SG11201702300PA - Method and system for inspecting transparent wafers for electronics, optics or optoelectronics - Google Patents
Method and system for inspecting transparent wafers for electronics, optics or optoelectronicsInfo
- Publication number
- SG11201702300PA SG11201702300PA SG11201702300PA SG11201702300PA SG11201702300PA SG 11201702300P A SG11201702300P A SG 11201702300PA SG 11201702300P A SG11201702300P A SG 11201702300PA SG 11201702300P A SG11201702300P A SG 11201702300PA SG 11201702300P A SG11201702300P A SG 11201702300PA
- Authority
- SG
- Singapore
- Prior art keywords
- optoelectronics
- optics
- electronics
- transparent wafers
- inspecting transparent
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02034—Interferometers characterised by particularly shaped beams or wavefronts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
- G01M11/33—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face
- G01M11/331—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face by using interferometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1459170A FR3026484B1 (fr) | 2014-09-29 | 2014-09-29 | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
PCT/EP2015/072368 WO2016050738A1 (fr) | 2014-09-29 | 2015-09-29 | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201702300PA true SG11201702300PA (en) | 2017-04-27 |
Family
ID=51866249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201702300PA SG11201702300PA (en) | 2014-09-29 | 2015-09-29 | Method and system for inspecting transparent wafers for electronics, optics or optoelectronics |
Country Status (8)
Country | Link |
---|---|
US (1) | US10260868B2 (fr) |
EP (1) | EP3201610B1 (fr) |
JP (1) | JP6530062B2 (fr) |
KR (1) | KR20170066375A (fr) |
CN (1) | CN106716112B (fr) |
FR (1) | FR3026484B1 (fr) |
SG (1) | SG11201702300PA (fr) |
WO (1) | WO2016050738A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160343140A1 (en) * | 2015-05-24 | 2016-11-24 | Pointivo, Inc. | Surveying and measurement methods and devices |
FR3049710B1 (fr) | 2016-03-31 | 2020-06-19 | Unity Semiconductor | Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique |
FR3076618B1 (fr) | 2018-01-05 | 2023-11-24 | Unity Semiconductor | Procede et systeme d'inspection optique d'un substrat |
CN109543720B (zh) * | 2018-10-30 | 2023-10-27 | 东华大学 | 一种基于对抗生成网络的晶圆图缺陷模式识别方法 |
EP4202423A1 (fr) | 2021-12-23 | 2023-06-28 | Unity Semiconductor | Procédé et système de discrimination de défauts présents sur une face avant par rapport à des défauts présents sur une face arrière d'un substrat transparent |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4030830A (en) * | 1976-01-05 | 1977-06-21 | Atlantic Research Corporation | Process and apparatus for sensing defects on a smooth surface |
IL125964A (en) * | 1998-08-27 | 2003-10-31 | Tevet Process Control Technolo | Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate |
AU4277501A (en) * | 2000-03-24 | 2001-10-03 | Olympus Optical Co., Ltd. | Apparatus for detecting defect |
EP1319244A1 (fr) * | 2000-09-20 | 2003-06-18 | Kla-Tencor Inc. | Procedes et systemes destines a des processus de fabrication de semi-conducteurs |
WO2002039099A2 (fr) * | 2000-11-13 | 2002-05-16 | Koninklijke Philips Electronics N.V. | Mesure de defauts de surface |
US7106454B2 (en) * | 2003-03-06 | 2006-09-12 | Zygo Corporation | Profiling complex surface structures using scanning interferometry |
FR2927175B1 (fr) * | 2008-02-05 | 2011-02-18 | Altatech Semiconductor | Dispositif d'inspection de plaquettes semi-conductrices |
EP2331294A1 (fr) * | 2008-10-01 | 2011-06-15 | Peter Wolters GmbH | Procédé de mesure de l'épaisseur d'une pièce à usiner en forme de disque |
-
2014
- 2014-09-29 FR FR1459170A patent/FR3026484B1/fr active Active
-
2015
- 2015-09-29 US US15/515,407 patent/US10260868B2/en active Active
- 2015-09-29 EP EP15774574.6A patent/EP3201610B1/fr active Active
- 2015-09-29 JP JP2017518136A patent/JP6530062B2/ja active Active
- 2015-09-29 CN CN201580052315.3A patent/CN106716112B/zh active Active
- 2015-09-29 KR KR1020177008603A patent/KR20170066375A/ko unknown
- 2015-09-29 WO PCT/EP2015/072368 patent/WO2016050738A1/fr active Application Filing
- 2015-09-29 SG SG11201702300PA patent/SG11201702300PA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2017538102A (ja) | 2017-12-21 |
CN106716112B (zh) | 2019-08-06 |
EP3201610B1 (fr) | 2018-11-07 |
CN106716112A (zh) | 2017-05-24 |
US20180231370A1 (en) | 2018-08-16 |
EP3201610A1 (fr) | 2017-08-09 |
JP6530062B2 (ja) | 2019-06-12 |
WO2016050738A1 (fr) | 2016-04-07 |
FR3026484B1 (fr) | 2018-06-15 |
FR3026484A1 (fr) | 2016-04-01 |
US10260868B2 (en) | 2019-04-16 |
KR20170066375A (ko) | 2017-06-14 |
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