Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B11/00—Measuring arrangements characterised by the use of optical techniques
  • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
  • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B9/00—Measuring instruments characterised by the use of optical techniques
  • G01B9/02—Interferometers
  • G01B9/02034—Interferometers characterised by particularly shaped beams or wavefronts
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
  • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
  • G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
  • G01M11/33—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face
  • G01M11/331—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face by using interferometer
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/8806—Specially adapted optical and illumination features
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
  • G01N21/9501—Semiconductor wafers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
  • G01N21/9501—Semiconductor wafers
  • G01N21/9503—Wafer edge inspection
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
  • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Analytical Chemistry (AREA)
• Chemical & Material Sciences (AREA)
• Immunology (AREA)
• Biochemistry (AREA)
• General Health & Medical Sciences (AREA)
• Life Sciences & Earth Sciences (AREA)
• Health & Medical Sciences (AREA)
• Pathology (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Optics & Photonics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Length Measuring Devices By Optical Means (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=51866249

Family Applications (1)

Country Status (8)

Families Citing this family (5)

Family Cites Families (8)

• 2014
  • 2014-09-29 FR FR1459170A patent/FR3026484B1/fr active Active
• 2015
  • 2015-09-29 EP EP15774574.6A patent/EP3201610B1/fr active Active
  • 2015-09-29 KR KR1020177008603A patent/KR20170066375A/ko not_active Withdrawn
  • 2015-09-29 CN CN201580052315.3A patent/CN106716112B/zh active Active
  • 2015-09-29 WO PCT/EP2015/072368 patent/WO2016050738A1/fr active Application Filing
  • 2015-09-29 JP JP2017518136A patent/JP6530062B2/ja active Active
  • 2015-09-29 SG SG11201702300PA patent/SG11201702300PA/en unknown
  • 2015-09-29 US US15/515,407 patent/US10260868B2/en active Active

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