SG11201700784QA - Repeater detection - Google Patents

Repeater detection

Info

Publication number
SG11201700784QA
SG11201700784QA SG11201700784QA SG11201700784QA SG11201700784QA SG 11201700784Q A SG11201700784Q A SG 11201700784QA SG 11201700784Q A SG11201700784Q A SG 11201700784QA SG 11201700784Q A SG11201700784Q A SG 11201700784QA SG 11201700784Q A SG11201700784Q A SG 11201700784QA
Authority
SG
Singapore
Prior art keywords
repeater detection
repeater
detection
Prior art date
Application number
SG11201700784QA
Inventor
Hong Chen
Kenong Wu
Eugene Shifrin
Masatoshi Yamaoka
Gangadharan Sivaraman
Raghav Babulnath
Satya Kurada
Alfonso Sun
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201700784QA publication Critical patent/SG11201700784QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201700784QA 2014-08-27 2015-08-27 Repeater detection SG11201700784QA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462042251P 2014-08-27 2014-08-27
US14/674,856 US9766186B2 (en) 2014-08-27 2015-03-31 Array mode repeater detection
PCT/US2015/047139 WO2016033300A1 (en) 2014-08-27 2015-08-27 Repeater detection

Publications (1)

Publication Number Publication Date
SG11201700784QA true SG11201700784QA (en) 2017-03-30

Family

ID=55400561

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201903148WA SG10201903148WA (en) 2014-08-27 2015-08-27 Repeater detection
SG11201700784QA SG11201700784QA (en) 2014-08-27 2015-08-27 Repeater detection

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201903148WA SG10201903148WA (en) 2014-08-27 2015-08-27 Repeater detection

Country Status (6)

Country Link
US (1) US9766186B2 (en)
KR (1) KR102435627B1 (en)
CN (1) CN106662538B (en)
SG (2) SG10201903148WA (en)
TW (1) TWI648706B (en)
WO (1) WO2016033300A1 (en)

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US10395358B2 (en) * 2016-11-10 2019-08-27 Kla-Tencor Corp. High sensitivity repeater defect detection
US10262408B2 (en) * 2017-04-12 2019-04-16 Kla-Tencor Corporation System, method and computer program product for systematic and stochastic characterization of pattern defects identified from a semiconductor wafer
TWI751329B (en) * 2017-05-15 2022-01-01 美商克萊譚克公司 High accuracy of relative defect locations for repeater analysis
US10648925B2 (en) * 2017-06-05 2020-05-12 Kla-Tencor Corporation Repeater defect detection
US10957033B2 (en) * 2017-07-10 2021-03-23 Kla-Tencor Corporation Repeater defect detection
US10275872B2 (en) 2017-08-24 2019-04-30 Applied Materials Israel Ltd. Method of detecting repeating defects and system thereof
US10964014B2 (en) 2017-10-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Defect detecting method and defect detecting system
US10572991B2 (en) * 2017-11-07 2020-02-25 Kla-Tencor Corporation System and method for aligning semiconductor device reference images and test images
JP6992475B2 (en) * 2017-12-14 2022-01-13 オムロン株式会社 Information processing equipment, identification system, setting method and program
US10964016B2 (en) * 2018-03-13 2021-03-30 Kla-Tencor Corporation Combining simulation and optical microscopy to determine inspection mode
CN108459023A (en) * 2018-03-27 2018-08-28 松下电子部品（江门）有限公司 Biradical pseudo-capacitance appearance images detection method
US10557802B2 (en) * 2018-05-09 2020-02-11 Kla-Tencor Corporation Capture of repeater defects on a semiconductor wafer
US10801968B2 (en) * 2018-10-26 2020-10-13 Kla-Tencor Corporation Algorithm selector based on image frames
JP2022043365A (en) * 2018-11-19 2022-03-16 株式会社日立ハイテク Inspection equipment, inspection method, and defect detection program
CN111476938B (en) * 2019-01-24 2023-04-28 中科晶源微电子技术（北京）有限公司 Anomaly detection for periodic patterns
US11276161B2 (en) * 2019-02-26 2022-03-15 KLA Corp. Reference image generation for semiconductor applications
CN112489849A (en) * 2019-09-11 2021-03-12 西门子医疗有限公司 Filter device for spectral filtering of X-ray beams of a computed tomography apparatus
US11113827B2 (en) * 2019-09-23 2021-09-07 Kla Corporation Pattern-to-design alignment for one-dimensional unique structures
US11328411B2 (en) 2020-05-04 2022-05-10 KLA Corp. Print check repeater defect detection
US11748868B2 (en) * 2020-09-08 2023-09-05 Kla Corporation Unsupervised pattern synonym detection using image hashing
CN113013048A (en) * 2021-02-24 2021-06-22 上海华力集成电路制造有限公司 Wafer defect detection method
CN113570604B (en) * 2021-09-28 2022-01-14 武汉精创电子技术有限公司 Automatic generation method and device for crystal grain detection sample

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US8000922B2 (en) 2008-05-29 2011-08-16 Kla-Tencor Corp. Methods and systems for generating information to be used for selecting values for one or more parameters of a detection algorithm
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SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US8605275B2 (en) 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
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JP5500871B2 (en) 2009-05-29 2014-05-21 株式会社日立ハイテクノロジーズ Template matching template creation method and template creation apparatus
CN102803939B (en) 2009-06-19 2014-12-31 克拉-坦科股份有限公司 Methods and apparatus for simultaneously inspecting multiple array regions having different pitches
JP5719843B2 (en) 2009-07-17 2015-05-20 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ Comparing and matching scanner performance using design and defect data

Also Published As

Publication number Publication date
CN106662538B (en) 2020-03-27
US9766186B2 (en) 2017-09-19
KR102435627B1 (en) 2022-08-23
TW201614586A (en) 2016-04-16
KR20170045272A (en) 2017-04-26
TWI648706B (en) 2019-01-21
CN106662538A (en) 2017-05-10
SG10201903148WA (en) 2019-05-30
WO2016033300A1 (en) 2016-03-03
US20160061749A1 (en) 2016-03-03

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