SG11201610823XA - Determining coordinates for an area of interest on a specimen - Google Patents

Determining coordinates for an area of interest on a specimen

Info

Publication number
SG11201610823XA
SG11201610823XA SG11201610823XA SG11201610823XA SG11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA
Authority
SG
Singapore
Prior art keywords
specimen
interest
area
determining coordinates
coordinates
Prior art date
Application number
SG11201610823XA
Other languages
English (en)
Inventor
Brian Duffy
Michael Lennek
Changho Lee
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201610823XA publication Critical patent/SG11201610823XA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/187—Segmentation; Edge detection involving region growing; involving region merging; involving connected component labelling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/32—Determination of transform parameters for the alignment of images, i.e. image registration using correlation-based methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20112—Image segmentation details
    • G06T2207/20164—Salient point detection; Corner detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
SG11201610823XA 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen SG11201610823XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462027402P 2014-07-22 2014-07-22
US201562163325P 2015-05-18 2015-05-18
US14/804,102 US10127653B2 (en) 2014-07-22 2015-07-20 Determining coordinates for an area of interest on a specimen
PCT/US2015/041607 WO2016014711A1 (en) 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen

Publications (1)

Publication Number Publication Date
SG11201610823XA true SG11201610823XA (en) 2017-02-27

Family

ID=55163721

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610823XA SG11201610823XA (en) 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen

Country Status (7)

Country Link
US (1) US10127653B2 (zh)
JP (1) JP6789920B2 (zh)
KR (1) KR102268502B1 (zh)
CN (1) CN106537449B (zh)
SG (1) SG11201610823XA (zh)
TW (1) TWI686718B (zh)
WO (1) WO2016014711A1 (zh)

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US10692690B2 (en) * 2017-03-27 2020-06-23 Kla-Tencor Corporation Care areas for improved electron beam defect detection
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US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
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US20190279914A1 (en) * 2018-03-09 2019-09-12 Kla-Tencor Corporation Region of interest and pattern of interest generation for critical dimension measurement
US11094053B2 (en) * 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
KR102569650B1 (ko) 2019-03-06 2023-08-24 주식회사 히타치하이테크 결함 검사 장치, 결함 검사 프로그램
US12039716B2 (en) 2019-08-23 2024-07-16 Hitachi High-Tech Corporation Defect inspection method and defect inspection device
US11113827B2 (en) * 2019-09-23 2021-09-07 Kla Corporation Pattern-to-design alignment for one-dimensional unique structures
US11580650B2 (en) * 2019-10-01 2023-02-14 KLA Corp. Multi-imaging mode image alignment
US11644756B2 (en) 2020-08-07 2023-05-09 KLA Corp. 3D structure inspection or metrology using deep learning
US11244474B1 (en) * 2020-10-01 2022-02-08 Kla Corporation Sample positioning system and method
CN116883398B (zh) * 2023-09-06 2023-11-28 湖南隆深氢能科技有限公司 基于电堆装配生产线的检测方法、系统、终端设备及介质

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Also Published As

Publication number Publication date
KR102268502B1 (ko) 2021-06-22
KR20170033876A (ko) 2017-03-27
TWI686718B (zh) 2020-03-01
WO2016014711A1 (en) 2016-01-28
TW201629811A (zh) 2016-08-16
US20160027164A1 (en) 2016-01-28
JP2017529684A (ja) 2017-10-05
CN106537449B (zh) 2020-10-09
US10127653B2 (en) 2018-11-13
JP6789920B2 (ja) 2020-11-25
CN106537449A (zh) 2017-03-22

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