SG11201610823XA - Determining coordinates for an area of interest on a specimen - Google Patents

Determining coordinates for an area of interest on a specimen

Info

Publication number
SG11201610823XA
SG11201610823XA SG11201610823XA SG11201610823XA SG11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA SG 11201610823X A SG11201610823X A SG 11201610823XA
Authority
SG
Singapore
Prior art keywords
specimen
interest
area
determining coordinates
coordinates
Prior art date
Application number
SG11201610823XA
Other languages
English (en)
Inventor
Brian Duffy
Michael Lennek
Changho Lee
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201610823XA publication Critical patent/SG11201610823XA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/187—Segmentation; Edge detection involving region growing; involving region merging; involving connected component labelling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/32—Determination of transform parameters for the alignment of images, i.e. image registration using correlation-based methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20112—Image segmentation details
    • G06T2207/20164—Salient point detection; Corner detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
SG11201610823XA 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen SG11201610823XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462027402P 2014-07-22 2014-07-22
US201562163325P 2015-05-18 2015-05-18
US14/804,102 US10127653B2 (en) 2014-07-22 2015-07-20 Determining coordinates for an area of interest on a specimen
PCT/US2015/041607 WO2016014711A1 (en) 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen

Publications (1)

Publication Number Publication Date
SG11201610823XA true SG11201610823XA (en) 2017-02-27

Family

ID=55163721

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610823XA SG11201610823XA (en) 2014-07-22 2015-07-22 Determining coordinates for an area of interest on a specimen

Country Status (7)

Country Link
US (1) US10127653B2 (zh)
JP (1) JP6789920B2 (zh)
KR (1) KR102268502B1 (zh)
CN (1) CN106537449B (zh)
SG (1) SG11201610823XA (zh)
TW (1) TWI686718B (zh)
WO (1) WO2016014711A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9996942B2 (en) * 2015-03-19 2018-06-12 Kla-Tencor Corp. Sub-pixel alignment of inspection to design
US10339262B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation System and method for defining care areas in repeating structures of design data
US10692690B2 (en) * 2017-03-27 2020-06-23 Kla-Tencor Corporation Care areas for improved electron beam defect detection
US10408764B2 (en) * 2017-09-13 2019-09-10 Applied Materials Israel Ltd. System, method and computer program product for object examination
WO2019072704A1 (en) 2017-10-10 2019-04-18 Asml Netherlands B.V. LOW DOSE CHARGED PARTICLE METROLOGY SYSTEM
US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
KR102427648B1 (ko) * 2017-11-03 2022-08-01 삼성전자주식회사 결함 검사 방법 및 결함 검사 장치
US20190279914A1 (en) * 2018-03-09 2019-09-12 Kla-Tencor Corporation Region of interest and pattern of interest generation for critical dimension measurement
US11094053B2 (en) * 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
WO2020179000A1 (ja) 2019-03-06 2020-09-10 株式会社日立ハイテク 欠陥検査装置、欠陥検査プログラム
WO2021038633A1 (ja) 2019-08-23 2021-03-04 株式会社日立ハイテク 欠陥検査方法、欠陥検査装置
US11113827B2 (en) * 2019-09-23 2021-09-07 Kla Corporation Pattern-to-design alignment for one-dimensional unique structures
US11580650B2 (en) * 2019-10-01 2023-02-14 KLA Corp. Multi-imaging mode image alignment
US11644756B2 (en) 2020-08-07 2023-05-09 KLA Corp. 3D structure inspection or metrology using deep learning
US11244474B1 (en) * 2020-10-01 2022-02-08 Kla Corporation Sample positioning system and method
CN116883398B (zh) * 2023-09-06 2023-11-28 湖南隆深氢能科技有限公司 基于电堆装配生产线的检测方法、系统、终端设备及介质

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272501A (en) * 1991-08-28 1993-12-21 Nikon Corporation Projection exposure apparatus
US5525808A (en) * 1992-01-23 1996-06-11 Nikon Corporaton Alignment method and alignment apparatus with a statistic calculation using a plurality of weighted coordinate positions
JP3572430B2 (ja) * 1994-11-29 2004-10-06 株式会社ニコン 露光方法及びその装置
JPH09148217A (ja) * 1995-11-17 1997-06-06 Mitsubishi Electric Corp 位置合わせ方法
US7796801B2 (en) * 1999-08-26 2010-09-14 Nanogeometry Research Inc. Pattern inspection apparatus and method
US6780656B2 (en) * 2000-09-18 2004-08-24 Hpl Technologies, Inc. Correction of overlay offset between inspection layers
JP3810694B2 (ja) * 2002-02-15 2006-08-16 三菱電機株式会社 パターン検査装置及びパターン検査方法
JP3965189B2 (ja) * 2005-03-24 2007-08-29 アドバンスド・マスク・インスペクション・テクノロジー株式会社 画像補正方法
EP1929061A4 (en) 2005-08-30 2011-01-05 Camtek Ltd PIPELINE CONTROL SYSTEM AND METHOD FOR MONITORING A FROZEN CUTTING WAFER
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570800B2 (en) * 2005-12-14 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for binning defects detected on a specimen
JP2008041940A (ja) * 2006-08-07 2008-02-21 Hitachi High-Technologies Corp Ｓｅｍ式レビュー装置並びにｓｅｍ式レビュー装置を用いた欠陥のレビュー方法及び欠陥検査方法
US7904845B2 (en) 2006-12-06 2011-03-08 Kla-Tencor Corp. Determining locations on a wafer to be reviewed during defect review
US8698093B1 (en) 2007-01-19 2014-04-15 Kla-Tencor Corporation Objective lens with deflector plates immersed in electrostatic lens field
US8611639B2 (en) 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
JP2009071136A (ja) * 2007-09-14 2009-04-02 Hitachi High-Technologies Corp データ管理装置、検査システムおよび欠陥レビュー装置
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
JP5412169B2 (ja) * 2008-04-23 2014-02-12 株式会社日立ハイテクノロジーズ 欠陥観察方法及び欠陥観察装置
EP2396815A4 (en) * 2009-02-13 2012-11-28 Kla Tencor Corp DETECTION OF DEFECTS ON A WAFER
US8559001B2 (en) * 2010-01-11 2013-10-15 Kla-Tencor Corporation Inspection guided overlay metrology
US10354405B2 (en) * 2010-05-17 2019-07-16 Kla-Tencor Corporation Run-time correction of defect locations during defect review
US9170211B2 (en) * 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US8664594B1 (en) 2011-04-18 2014-03-04 Kla-Tencor Corporation Electron-optical system for high-speed and high-sensitivity inspections
US8692204B2 (en) 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
JP5460662B2 (ja) * 2011-09-07 2014-04-02 株式会社日立ハイテクノロジーズ 領域決定装置、観察装置または検査装置、領域決定方法および領域決定方法を用いた観察方法または検査方法
US9087367B2 (en) * 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9277186B2 (en) * 2012-01-18 2016-03-01 Kla-Tencor Corp. Generating a wafer inspection process using bit failures and virtual inspection
US8716662B1 (en) 2012-07-16 2014-05-06 Kla-Tencor Corporation Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
JP5717711B2 (ja) * 2012-12-07 2015-05-13 東京エレクトロン株式会社 基板の基準画像作成方法、基板の欠陥検査方法、基板の基準画像作成装置、基板の欠陥検査ユニット、プログラム及びコンピュータ記憶媒体
US9299564B2 (en) * 2012-12-12 2016-03-29 Varian Semiconductor Equipment Associates, Inc. Ion implant for defect control
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
TWI503721B (zh) * 2013-05-09 2015-10-11 Henghao Technology Co Ltd 觸控電極裝置
US9183624B2 (en) 2013-06-19 2015-11-10 Kla-Tencor Corp. Detecting defects on a wafer with run time use of design data
US9355208B2 (en) 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9816939B2 (en) 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes

Also Published As

Publication number Publication date
CN106537449A (zh) 2017-03-22
KR20170033876A (ko) 2017-03-27
JP2017529684A (ja) 2017-10-05
TW201629811A (zh) 2016-08-16
US10127653B2 (en) 2018-11-13
US20160027164A1 (en) 2016-01-28
KR102268502B1 (ko) 2021-06-22
JP6789920B2 (ja) 2020-11-25
TWI686718B (zh) 2020-03-01
WO2016014711A1 (en) 2016-01-28
CN106537449B (zh) 2020-10-09

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