SG11201610172WA - Package-on-package stacked microelectronic structures - Google Patents

Package-on-package stacked microelectronic structures

Info

Publication number
SG11201610172WA
SG11201610172WA SG11201610172WA SG11201610172WA SG11201610172WA SG 11201610172W A SG11201610172W A SG 11201610172WA SG 11201610172W A SG11201610172W A SG 11201610172WA SG 11201610172W A SG11201610172W A SG 11201610172WA SG 11201610172W A SG11201610172W A SG 11201610172WA
Authority
SG
Singapore
Prior art keywords
package
stacked microelectronic
microelectronic structures
structures
package stacked
Prior art date
Application number
SG11201610172WA
Inventor
Thorsten Meyer
Gerald Ofner
Original Assignee
Intel Ip Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Ip Corp filed Critical Intel Ip Corp
Publication of SG11201610172WA publication Critical patent/SG11201610172WA/en

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    • H01L25/0657—Stacked arrangements of devices
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    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
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KR20160045620A (en) 2016-04-27
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WO2016007120A1 (en) 2016-01-14
US10211182B2 (en) 2019-02-19

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