SG11201608362TA - Method and device for embossing of a nanostructure - Google Patents

Method and device for embossing of a nanostructure

Info

Publication number
SG11201608362TA
SG11201608362TA SG11201608362TA SG11201608362TA SG11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA
Authority
SG
Singapore
Prior art keywords
nanostructure
embossing
Prior art date
Application number
SG11201608362TA
Other languages
English (en)
Inventor
Gerald Kreindl
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201608362TA publication Critical patent/SG11201608362TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/02—Apparatus or machines for carrying out printing operations combined with other operations with embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/0052—Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/026—Dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201608362TA 2014-04-22 2014-04-22 Method and device for embossing of a nanostructure SG11201608362TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/058141 WO2015161868A1 (de) 2014-04-22 2014-04-22 Verfahren und vorrichtung zum prägen einer nanostruktur

Publications (1)

Publication Number Publication Date
SG11201608362TA true SG11201608362TA (en) 2016-11-29

Family

ID=50588682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608362TA SG11201608362TA (en) 2014-04-22 2014-04-22 Method and device for embossing of a nanostructure

Country Status (8)

Country Link
US (4) US10118381B2 (de)
EP (2) EP3134771B1 (de)
JP (1) JP6391709B2 (de)
KR (3) KR102394754B1 (de)
CN (4) CN112445064A (de)
SG (1) SG11201608362TA (de)
TW (4) TWI694967B (de)
WO (1) WO2015161868A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019210976A1 (de) 2018-05-04 2019-11-07 Ev Group E. Thallner Gmbh Stempel und verfahren zum prägen
TWI828760B (zh) * 2018-10-25 2024-01-11 日商尼康股份有限公司 基板貼合裝置、參數計算裝置、基板貼合方法及參數計算方法
KR20210107694A (ko) * 2018-12-28 2021-09-01 에이에스엠엘 홀딩 엔.브이. 리소그래피 시스템에서 지지 구조물을 세정하기 위한 장치 및 방법

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180288B1 (en) * 1997-03-21 2001-01-30 Kimberly-Clark Worldwide, Inc. Gel sensors and method of use thereof
AT405775B (de) * 1998-01-13 1999-11-25 Thallner Erich Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
KR101056505B1 (ko) 2002-11-13 2011-08-11 몰레큘러 임프린츠 인코퍼레이티드 기판의 형상을 조절하기 위한 척킹 시스템 및 방법
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
KR100504080B1 (ko) * 2003-05-26 2005-07-27 한국기계연구원 선택적 부가압력을 이용한 ｕｖ 나노임프린트 리소그래피공정
DE102004007060B3 (de) 2004-02-13 2005-07-07 Thallner, Erich, Dipl.-Ing. Vorrichtung und Verfahren zum Verbinden von Wafern
CN100555076C (zh) * 2004-07-26 2009-10-28 鸿富锦精密工业（深圳）有限公司 用于纳米压印的压模及其制备方法
DE102005036775B4 (de) * 2004-08-09 2007-01-25 Schuler Pressen Gmbh & Co. Kg Umformeinrichtung mit Auswerfer und Verfahren zum Auswerfen von Werkstücken
US20070164476A1 (en) * 2004-09-01 2007-07-19 Wei Wu Contact lithography apparatus and method employing substrate deformation
EP1789848B1 (de) * 2004-09-08 2010-06-30 NIL Technology APS Flexibler nano-druckstempel
US7331283B2 (en) * 2004-12-16 2008-02-19 Asml Holding N.V. Method and apparatus for imprint pattern replication
WO2006094309A2 (en) 2005-03-04 2006-09-08 The Procter & Gamble Company Rinse-off or wipe-off skin cleansing compositions
EP1890887B1 (de) * 2005-05-03 2015-10-28 Koninklijke Philips N.V. Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
WO2007136832A2 (en) 2006-05-18 2007-11-29 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
TWI322754B (en) 2006-05-18 2010-04-01 Molecular Imprints Inc Method for expelling gas positioned between a substrate and a mold
WO2007142250A1 (en) * 2006-05-31 2007-12-13 Canon Kabushiki Kaisha Gap measuring method, imprint method, and imprint apparatus
JP2008098263A (ja) * 2006-10-10 2008-04-24 Canon Inc 近接場露光用マスク及び該マスクを用いたレジストパターンの形成方法
JP4418476B2 (ja) * 2007-03-20 2010-02-17 株式会社日立ハイテクノロジーズ 微細構造転写装置および微細構造体の製造方法
NL2004409A (en) * 2009-05-19 2010-11-22 Asml Netherlands Bv Imprint lithography apparatus.
EP2287666B1 (de) 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
JP5469041B2 (ja) * 2010-03-08 2014-04-09 株式会社日立ハイテクノロジーズ 微細構造転写方法およびその装置
EP2612109B1 (de) 2010-09-03 2014-06-04 Ev Group E. Thallner GmbH Vorrichtung und verfahren zur verringerung eines keilfehlers
JP5930622B2 (ja) * 2010-10-08 2016-06-08 キヤノン株式会社 インプリント装置、及び、物品の製造方法
CN102096315B (zh) * 2010-12-22 2012-04-04 青岛理工大学 整片晶圆纳米压印的装置和方法
JP2012190877A (ja) * 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
WO2012133840A1 (ja) 2011-03-30 2012-10-04 日本電気株式会社 インプリント装置、インプリント方法、電子回路基板、及び電子機器
US9613840B2 (en) * 2011-08-12 2017-04-04 Ev Group E. Thallner Gmbh Apparatus and method for bonding substrates
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
CN102346369B (zh) * 2011-09-08 2013-04-10 青岛理工大学 一种整片晶圆纳米压印光刻机
EP2587560A1 (de) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Lichtemittierende Diode
JP5824380B2 (ja) 2012-02-07 2015-11-25 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
CN102591143B (zh) * 2012-02-29 2014-04-16 青岛理工大学 一种大面积纳米压印光刻的装置和方法
CN102566262B (zh) * 2012-02-29 2013-06-19 青岛理工大学 一种适用于非平整衬底晶圆级纳米压印的装置
JP6069689B2 (ja) * 2012-07-26 2017-02-01 大日本印刷株式会社 ナノインプリント用テンプレート
CN103631086A (zh) * 2012-08-21 2014-03-12 华中科技大学 一种用于集成光电子器件的微纳图形的制作方法及应用
WO2014054749A1 (ja) * 2012-10-04 2014-04-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6188123B2 (ja) * 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
JP6328001B2 (ja) * 2013-08-30 2018-05-23 キヤノン株式会社 インプリント用硬化性組成物、膜、膜の製造方法
US10578964B2 (en) * 2013-12-31 2020-03-03 Canon Nanotechnologies, Inc. Asymmetric template shape modulation for partial field imprinting

Also Published As

Publication number Publication date
US20210129520A1 (en) 2021-05-06
KR20210050597A (ko) 2021-05-07
US20170001431A1 (en) 2017-01-05
TWI824579B (zh) 2023-12-01
TW201544447A (zh) 2015-12-01
CN112445064A (zh) 2021-03-05
US10906293B2 (en) 2021-02-02
EP3134771A1 (de) 2017-03-01
US20190022999A1 (en) 2019-01-24
CN106462053A (zh) 2017-02-22
TWI694967B (zh) 2020-06-01
US10118381B2 (en) 2018-11-06
US20200047485A1 (en) 2020-02-13
JP2017516302A (ja) 2017-06-15
CN112445065A (zh) 2021-03-05
TW202030145A (zh) 2020-08-16
US10493747B2 (en) 2019-12-03
CN106462053B (zh) 2020-12-01
TWI772789B (zh) 2022-08-01
EP3591470A1 (de) 2020-01-08
KR102394754B1 (ko) 2022-05-04
JP6391709B2 (ja) 2018-09-19
KR20160145599A (ko) 2016-12-20
KR20220058671A (ko) 2022-05-09
TW202237526A (zh) 2022-10-01
EP3134771B1 (de) 2019-08-28
KR102545684B1 (ko) 2023-06-20
WO2015161868A1 (de) 2015-10-29
KR102249004B1 (ko) 2021-05-07
TWI654134B (zh) 2019-03-21
CN112445066A (zh) 2021-03-05
TW201930179A (zh) 2019-08-01

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