SG11201606917TA - Bump forming method, bump forming apparatus, and semiconductor device manufacturing method - Google Patents
Bump forming method, bump forming apparatus, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201606917TA SG11201606917TA SG11201606917TA SG11201606917TA SG11201606917TA SG 11201606917T A SG11201606917T A SG 11201606917TA SG 11201606917T A SG11201606917T A SG 11201606917TA SG 11201606917T A SG11201606917T A SG 11201606917TA SG 11201606917T A SG11201606917T A SG 11201606917TA
- Authority
- SG
- Singapore
- Prior art keywords
- bump forming
- semiconductor device
- device manufacturing
- forming apparatus
- bump
- Prior art date
Links
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1052—Wire or wire-like electrical connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15333—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014030413A JP5686912B1 (en) | 2014-02-20 | 2014-02-20 | Bump forming method, bump forming apparatus, and semiconductor device manufacturing method |
PCT/JP2014/061608 WO2015125316A1 (en) | 2014-02-20 | 2014-04-24 | Bump forming method, bump forming apparatus, and semiconductor device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606917TA true SG11201606917TA (en) | 2016-09-29 |
Family
ID=52822349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606917TA SG11201606917TA (en) | 2014-02-20 | 2014-04-24 | Bump forming method, bump forming apparatus, and semiconductor device manufacturing method |
Country Status (7)
Country | Link |
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US (1) | US20160358883A1 (en) |
JP (1) | JP5686912B1 (en) |
KR (1) | KR101860151B1 (en) |
CN (1) | CN106233443B (en) |
SG (1) | SG11201606917TA (en) |
TW (1) | TWI576932B (en) |
WO (1) | WO2015125316A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN107900693B (en) * | 2017-12-25 | 2023-11-24 | 苏州格洛佛精密科技有限公司 | Moving iron horn conducting rod welding device |
WO2022113193A1 (en) * | 2020-11-25 | 2022-06-02 | 株式会社新川 | Method for forming wire and method for manufacturing semiconductor device |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US5054192A (en) * | 1987-05-21 | 1991-10-08 | Cray Computer Corporation | Lead bonding of chips to circuit boards and circuit boards to circuit boards |
US5205463A (en) * | 1992-06-05 | 1993-04-27 | Kulicke And Soffa Investments, Inc. | Method of making constant clearance flat link fine wire interconnections |
US5601740A (en) * | 1993-11-16 | 1997-02-11 | Formfactor, Inc. | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
US20100065963A1 (en) * | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
JPH09252005A (en) * | 1996-03-15 | 1997-09-22 | Shinkawa Ltd | Method for forming bumps |
JP3400287B2 (en) * | 1997-03-06 | 2003-04-28 | 株式会社新川 | Wire bonding method |
JPH118269A (en) * | 1997-06-16 | 1999-01-12 | Sony Corp | Methods of manufacturing electronic component and electronic device, and electronic component and electronic device |
JP3377748B2 (en) * | 1998-06-25 | 2003-02-17 | 株式会社新川 | Wire bonding method |
JP2010192928A (en) * | 1999-08-12 | 2010-09-02 | Fujitsu Semiconductor Ltd | Semiconductor device, and method of manufacturing the same |
JP3566156B2 (en) * | 1999-12-02 | 2004-09-15 | 株式会社新川 | Method for forming pin-shaped wires |
JP2004172477A (en) * | 2002-11-21 | 2004-06-17 | Kaijo Corp | Wire loop form, semiconductor device having the same, wire bonding method, and semiconductor manufacturing apparatus |
US7227095B2 (en) * | 2003-08-06 | 2007-06-05 | Micron Technology, Inc. | Wire bonders and methods of wire-bonding |
JP2006278407A (en) * | 2005-03-28 | 2006-10-12 | Renesas Technology Corp | Manufacturing method of semiconductor device |
US8016182B2 (en) * | 2005-05-10 | 2011-09-13 | Kaijo Corporation | Wire loop, semiconductor device having same and wire bonding method |
JP4530975B2 (en) * | 2005-11-14 | 2010-08-25 | 株式会社新川 | Wire bonding method |
JP4509043B2 (en) * | 2006-02-14 | 2010-07-21 | 株式会社新川 | Stud bump formation method |
JP4679427B2 (en) * | 2006-04-24 | 2011-04-27 | 株式会社新川 | Tail wire cutting method and program for bonding apparatus |
JP4425319B1 (en) * | 2008-09-10 | 2010-03-03 | 株式会社新川 | Bonding method, bonding apparatus, and manufacturing method |
JP4467631B1 (en) * | 2009-01-07 | 2010-05-26 | 株式会社新川 | Wire bonding method |
JP5062283B2 (en) * | 2009-04-30 | 2012-10-31 | 日亜化学工業株式会社 | Semiconductor device and manufacturing method thereof |
JP4787374B2 (en) * | 2010-01-27 | 2011-10-05 | 株式会社新川 | Semiconductor device manufacturing method and wire bonding apparatus |
JP5734236B2 (en) * | 2011-05-17 | 2015-06-17 | 株式会社新川 | Wire bonding apparatus and bonding method |
JP2013038257A (en) * | 2011-08-09 | 2013-02-21 | Toshiba Corp | Wire bonding device and semiconductor device manufacturing method |
WO2014014643A1 (en) * | 2012-07-17 | 2014-01-23 | Kulicke And Soffa Industries, Inc. | Methods of forming wire interconnect structures |
US8540136B1 (en) * | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
TWI585927B (en) * | 2014-02-21 | 2017-06-01 | 新川股份有限公司 | Method for producing semiconductor apparatus, semiconductor apparatus and wire bonding apparatus |
-
2014
- 2014-02-20 JP JP2014030413A patent/JP5686912B1/en active Active
- 2014-04-24 KR KR1020167025717A patent/KR101860151B1/en active IP Right Grant
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- 2014-05-09 TW TW103116459A patent/TWI576932B/en active
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2016
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KR20160120780A (en) | 2016-10-18 |
WO2015125316A1 (en) | 2015-08-27 |
CN106233443A (en) | 2016-12-14 |
JP5686912B1 (en) | 2015-03-18 |
US20160358883A1 (en) | 2016-12-08 |
KR101860151B1 (en) | 2018-05-23 |
CN106233443B (en) | 2018-11-20 |
JP2016066633A (en) | 2016-04-28 |
TW201533816A (en) | 2015-09-01 |
TWI576932B (en) | 2017-04-01 |
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