SG11201605958QA - Device for measuring the vibration amplitude of a capillary of a wire bonder - Google Patents
Device for measuring the vibration amplitude of a capillary of a wire bonderInfo
- Publication number
- SG11201605958QA SG11201605958QA SG11201605958QA SG11201605958QA SG11201605958QA SG 11201605958Q A SG11201605958Q A SG 11201605958QA SG 11201605958Q A SG11201605958Q A SG 11201605958QA SG 11201605958Q A SG11201605958Q A SG 11201605958QA SG 11201605958Q A SG11201605958Q A SG 11201605958QA
- Authority
- SG
- Singapore
- Prior art keywords
- capillary
- measuring
- vibration amplitude
- wire bonder
- bonder
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B3/02—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency involving a change of amplitude
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014204205.4A DE102014204205A1 (en) | 2014-03-07 | 2014-03-07 | Device for measuring the oscillation amplitude of a capillary of a wire bonder |
| PCT/EP2014/077195 WO2015131968A1 (en) | 2014-03-07 | 2014-12-10 | Device for measuring the vibration amplitude of a capillary of a wire bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201605958QA true SG11201605958QA (en) | 2016-08-30 |
Family
ID=52016094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201605958QA SG11201605958QA (en) | 2014-03-07 | 2014-12-10 | Device for measuring the vibration amplitude of a capillary of a wire bonder |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10048114B2 (en) |
| EP (1) | EP3113889B1 (en) |
| JP (1) | JP6461178B2 (en) |
| CN (1) | CN106104230B (en) |
| DE (1) | DE102014204205A1 (en) |
| SG (1) | SG11201605958QA (en) |
| WO (1) | WO2015131968A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3603826B1 (en) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Method for calibrating an ultrasonic bonding machine |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856094B2 (en) * | 1977-07-30 | 1983-12-13 | 株式会社東芝 | Microvibration measuring device |
| JPS57201810A (en) * | 1981-06-05 | 1982-12-10 | Tokyo Keiso Kk | Rotation displacement detecting device |
| JPS5958316A (en) * | 1982-09-29 | 1984-04-04 | Fuji Electric Co Ltd | Pressure detecting device |
| JPS59138717U (en) * | 1983-03-08 | 1984-09-17 | ナカミチ株式会社 | optical sensor device |
| JPS60111204U (en) * | 1983-12-29 | 1985-07-27 | 日本航空電子工業株式会社 | Fiber optic displacement meter |
| US5291884A (en) * | 1991-02-07 | 1994-03-08 | Minnesota Mining And Manufacturing Company | Apparatus for measuring a blood parameter |
| JP2705423B2 (en) * | 1992-01-24 | 1998-01-28 | 株式会社日立製作所 | Ultrasonic bonding equipment and quality monitoring method |
| JPH10209199A (en) | 1997-01-21 | 1998-08-07 | Toshiba Corp | Vibration amplitude evaluator and wire bonder |
| JPH10239148A (en) * | 1997-02-28 | 1998-09-11 | Toshiba Corp | Vibration-measuring device |
| US6827247B1 (en) | 1999-12-08 | 2004-12-07 | Asm Technology Singapore Pte Ltd. | Apparatus for detecting the oscillation amplitude of an oscillating object |
| DE60130111D1 (en) * | 2000-04-20 | 2007-10-04 | Elwyn Paul Michael Wakefield | METHOD FOR PRODUCING ELECTRICAL / MECHANICAL CONNECTIONS |
| EP1340582A1 (en) | 2002-02-28 | 2003-09-03 | Esec Trading S.A. | Process and apparatus for the measure of the amplitude of a free oscillating capillary of a wire bonder |
| KR100903458B1 (en) * | 2002-02-28 | 2009-06-18 | 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 | Method and device for measuring the amplitude of a freely oscillating capillary of a wire bonder |
| US6972846B2 (en) * | 2003-03-31 | 2005-12-06 | Metrolaser, Inc. | Multi-beam heterodyne laser doppler vibrometer |
| GB2451443B (en) * | 2007-07-30 | 2012-12-26 | Lein Applied Diagnostics Ltd | Optical measurement apparatus and method therefor |
| JP4595020B2 (en) * | 2009-04-02 | 2010-12-08 | 株式会社新川 | Bonding apparatus, bonding tool amplitude measurement method, and bonding tool amplitude calibration method |
| JP2011149753A (en) * | 2010-01-20 | 2011-08-04 | Seiko Epson Corp | Optical pickup device for vibration detection |
| WO2012030814A2 (en) * | 2010-09-01 | 2012-03-08 | Schlumberger Canada Limited | Distributed fiber optic sensor system with improved linearity |
| JP5869347B2 (en) * | 2011-02-03 | 2016-02-24 | Hoya株式会社 | Transmittance measuring apparatus and transmittance measuring method |
-
2014
- 2014-03-07 DE DE102014204205.4A patent/DE102014204205A1/en not_active Withdrawn
- 2014-12-10 EP EP14809420.4A patent/EP3113889B1/en active Active
- 2014-12-10 JP JP2016551808A patent/JP6461178B2/en not_active Expired - Fee Related
- 2014-12-10 CN CN201480076921.4A patent/CN106104230B/en active Active
- 2014-12-10 US US15/124,159 patent/US10048114B2/en not_active Expired - Fee Related
- 2014-12-10 SG SG11201605958QA patent/SG11201605958QA/en unknown
- 2014-12-10 WO PCT/EP2014/077195 patent/WO2015131968A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015131968A1 (en) | 2015-09-11 |
| JP2017510798A (en) | 2017-04-13 |
| CN106104230B (en) | 2019-04-23 |
| EP3113889A1 (en) | 2017-01-11 |
| EP3113889B1 (en) | 2020-07-29 |
| DE102014204205A1 (en) | 2015-09-10 |
| US10048114B2 (en) | 2018-08-14 |
| JP6461178B2 (en) | 2019-01-30 |
| US20170016760A1 (en) | 2017-01-19 |
| CN106104230A (en) | 2016-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12016501076A1 (en) | Bonding wire for semiconductor device | |
| SG11201606185QA (en) | Bonding wire for semiconductor device | |
| PH12016500999A1 (en) | Bonding wire for semiconductor device | |
| GB2549644B (en) | MEMS transducer package | |
| SG11201608819VA (en) | Bonding wire for semiconductor device | |
| GB2549877B (en) | Mems transducer package | |
| SG11201704914QA (en) | Bonding wire for semiconductor device | |
| SG11201604437RA (en) | Bonding wire for semiconductor device | |
| SG10201705029XA (en) | Bonding wire for semiconductor device | |
| PL3486020T3 (en) | Ultrasonic welding device | |
| SG11201601519YA (en) | Bonding wire for semiconductor device | |
| HK1249803A1 (en) | Ultrasonic vibration bonding device | |
| GB2573963B (en) | MEMS transducer package | |
| GB2593402B (en) | MEMS transducer package | |
| EP3147938A4 (en) | Bonding wire for semiconductor device | |
| SG11201608267TA (en) | Bonding device | |
| SG10201400485PA (en) | A wire holding apparatus for wire bonding | |
| TWM533528U (en) | Multifunctional test device | |
| SG11201605958QA (en) | Device for measuring the vibration amplitude of a capillary of a wire bonder | |
| RS64107B1 (en) | Ultrasonic welding device | |
| GB201710849D0 (en) | Mems transducer package | |
| SG10201408305YA (en) | Bonding wire for a semiconductor device | |
| TWM532911U (en) | Piezoelectric vibration device | |
| GB201519434D0 (en) | Conttinuity bond device | |
| GB201413911D0 (en) | Determining the characteristics of a device under test |