SG11201604483WA - Chamfering apparatus and method for manufacturing notchless wafer - Google Patents
Chamfering apparatus and method for manufacturing notchless waferInfo
- Publication number
- SG11201604483WA SG11201604483WA SG11201604483WA SG11201604483WA SG11201604483WA SG 11201604483W A SG11201604483W A SG 11201604483WA SG 11201604483W A SG11201604483W A SG 11201604483WA SG 11201604483W A SG11201604483W A SG 11201604483WA SG 11201604483W A SG11201604483W A SG 11201604483WA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- chamfering apparatus
- notchless wafer
- notchless
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250122A JP6007889B2 (en) | 2013-12-03 | 2013-12-03 | Chamfering apparatus and notchless wafer manufacturing method |
PCT/JP2014/005458 WO2015083319A1 (en) | 2013-12-03 | 2014-10-29 | Chamfering device and notchless wafer manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604483WA true SG11201604483WA (en) | 2016-07-28 |
Family
ID=53273106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604483WA SG11201604483WA (en) | 2013-12-03 | 2014-10-29 | Chamfering apparatus and method for manufacturing notchless wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US10002753B2 (en) |
JP (1) | JP6007889B2 (en) |
KR (1) | KR102081379B1 (en) |
CN (1) | CN105765702B (en) |
DE (1) | DE112014005150B4 (en) |
SG (1) | SG11201604483WA (en) |
TW (1) | TWI567814B (en) |
WO (1) | WO2015083319A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101452250B1 (en) * | 2013-05-28 | 2014-10-22 | 코닝정밀소재 주식회사 | Method and appratus of symmetrically chamfering a substrate |
JP6286256B2 (en) * | 2014-03-31 | 2018-02-28 | 株式会社東京精密 | Wafer marking / grinding apparatus and wafer marking / grinding method |
JP6614978B2 (en) * | 2016-01-14 | 2019-12-04 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
JP6877207B2 (en) * | 2017-03-28 | 2021-05-26 | 株式会社ディスコ | Wafer processing system |
CN109605207A (en) * | 2018-12-27 | 2019-04-12 | 西安奕斯伟硅片技术有限公司 | Wafer processing method and device |
CN113539896A (en) * | 2021-06-21 | 2021-10-22 | 王启胜 | Crystal wafer rotary corrosion device of thyristor for smart power grid |
CN113733376B (en) * | 2021-09-03 | 2023-08-01 | 东莞市中镓半导体科技有限公司 | Semiconductor wafer integrated processing device and method thereof |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5117590A (en) * | 1988-08-12 | 1992-06-02 | Shin-Etsu Handotai Co., Ltd. | Method of automatically chamfering a wafer and apparatus therefor |
JP3035690B2 (en) | 1994-01-27 | 2000-04-24 | 株式会社東京精密 | Wafer diameter / cross-sectional shape measuring device and wafer chamfering machine incorporating the same |
TW308561B (en) * | 1995-08-24 | 1997-06-21 | Mutsubishi Gum Kk | |
JP2943673B2 (en) * | 1995-10-31 | 1999-08-30 | 日本電気株式会社 | Apparatus and method for manufacturing semiconductor substrate |
JP3213563B2 (en) | 1997-03-11 | 2001-10-02 | 株式会社スーパーシリコン研究所 | Manufacturing method of notchless wafer |
JPH11320363A (en) * | 1998-05-18 | 1999-11-24 | Tokyo Seimitsu Co Ltd | Wafer chamferring device |
JP2001038614A (en) * | 1999-07-26 | 2001-02-13 | Ebara Corp | Grinding device |
US6474987B1 (en) * | 1999-09-03 | 2002-11-05 | Mitsubishi Materials Silicon Corporation | Wafer holder |
JP2002219645A (en) * | 2000-11-21 | 2002-08-06 | Nikon Corp | Grinding device, method for manufacturing semiconductor device using it and semiconductor device manufactured thereby |
JP3838341B2 (en) * | 2001-09-14 | 2006-10-25 | 信越半導体株式会社 | Wafer shape evaluation method, wafer and wafer sorting method |
JP2006142388A (en) | 2004-11-16 | 2006-06-08 | Nihon Micro Coating Co Ltd | Abrasive tape and method |
KR101203505B1 (en) * | 2005-04-19 | 2012-11-21 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus and substrate processing method |
JP5006011B2 (en) * | 2006-11-15 | 2012-08-22 | 古河電気工業株式会社 | Manufacturing method of disk-shaped substrate |
US7559825B2 (en) * | 2006-12-21 | 2009-07-14 | Memc Electronic Materials, Inc. | Method of polishing a semiconductor wafer |
KR101460993B1 (en) | 2007-01-31 | 2014-11-13 | 신에쯔 한도타이 가부시키가이샤 | Silicon wafer beveling device, silicon wafer manufacturing method, and etched silicon wafer |
JP5254575B2 (en) | 2007-07-11 | 2013-08-07 | 株式会社東芝 | Polishing apparatus and polishing method |
DE102009038942B4 (en) | 2008-10-22 | 2022-06-23 | Peter Wolters Gmbh | Device for machining flat workpieces on both sides and method for machining a plurality of semiconductor wafers simultaneously by removing material from both sides |
JP5352331B2 (en) * | 2009-04-15 | 2013-11-27 | ダイトエレクトロン株式会社 | Wafer chamfering method |
FR2953988B1 (en) | 2009-12-11 | 2012-02-10 | S O I Tec Silicon On Insulator Tech | PROCESS FOR DETOURING A CHANNEL SUBSTRATE |
US8562750B2 (en) | 2009-12-17 | 2013-10-22 | Lam Research Corporation | Method and apparatus for processing bevel edge |
JP5491273B2 (en) * | 2010-05-11 | 2014-05-14 | ダイトエレクトロン株式会社 | Wafer chamfering device |
KR102185659B1 (en) * | 2014-02-11 | 2020-12-03 | 삼성전자주식회사 | Method of fabricating a wafer and the wafer |
-
2013
- 2013-12-03 JP JP2013250122A patent/JP6007889B2/en active Active
-
2014
- 2014-10-29 SG SG11201604483WA patent/SG11201604483WA/en unknown
- 2014-10-29 WO PCT/JP2014/005458 patent/WO2015083319A1/en active Application Filing
- 2014-10-29 US US15/037,067 patent/US10002753B2/en active Active
- 2014-10-29 KR KR1020167014286A patent/KR102081379B1/en active IP Right Grant
- 2014-10-29 CN CN201480064323.5A patent/CN105765702B/en active Active
- 2014-10-29 DE DE112014005150.0T patent/DE112014005150B4/en active Active
- 2014-11-10 TW TW103138921A patent/TWI567814B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20160093615A (en) | 2016-08-08 |
WO2015083319A1 (en) | 2015-06-11 |
US20160300708A1 (en) | 2016-10-13 |
JP2015109300A (en) | 2015-06-11 |
DE112014005150B4 (en) | 2024-02-29 |
TW201533789A (en) | 2015-09-01 |
US10002753B2 (en) | 2018-06-19 |
KR102081379B1 (en) | 2020-02-25 |
CN105765702A (en) | 2016-07-13 |
CN105765702B (en) | 2018-11-06 |
TWI567814B (en) | 2017-01-21 |
DE112014005150T5 (en) | 2016-09-01 |
JP6007889B2 (en) | 2016-10-19 |
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