SG11201603375TA - Microcontact printing stamps with functional features - Google Patents
Microcontact printing stamps with functional featuresInfo
- Publication number
- SG11201603375TA SG11201603375TA SG11201603375TA SG11201603375TA SG11201603375TA SG 11201603375T A SG11201603375T A SG 11201603375TA SG 11201603375T A SG11201603375T A SG 11201603375TA SG 11201603375T A SG11201603375T A SG 11201603375TA SG 11201603375T A SG11201603375T A SG 11201603375TA
- Authority
- SG
- Singapore
- Prior art keywords
- functional features
- microcontact printing
- printing stamps
- stamps
- microcontact
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
- B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
- B41K1/36—Details
- B41K1/38—Inking devices; Stamping surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41D—APPARATUS FOR THE MECHANICAL REPRODUCTION OF PRINTING SURFACES FOR STEREOTYPE PRINTING; SHAPING ELASTIC OR DEFORMABLE MATERIAL TO FORM PRINTING SURFACES
- B41D7/00—Shaping elastic or deformable material, e.g. rubber, plastics material, to form printing surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
- B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
- B41K3/44—Means for handling copy matter
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Printing Methods (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Printing Plates And Materials Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361900923P | 2013-11-06 | 2013-11-06 | |
PCT/US2014/063133 WO2015069538A1 (en) | 2013-11-06 | 2014-10-30 | Microcontact printing stamps with functional features |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201603375TA true SG11201603375TA (en) | 2016-05-30 |
Family
ID=53041973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201603375TA SG11201603375TA (en) | 2013-11-06 | 2014-10-30 | Microcontact printing stamps with functional features |
Country Status (8)
Country | Link |
---|---|
US (1) | US9873276B2 (zh) |
EP (1) | EP3065951B1 (zh) |
KR (1) | KR102320712B1 (zh) |
CN (1) | CN105722687B (zh) |
BR (1) | BR112016010214A2 (zh) |
SG (1) | SG11201603375TA (zh) |
TW (1) | TWI660858B (zh) |
WO (1) | WO2015069538A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015103565A1 (en) * | 2014-01-05 | 2015-07-09 | Vorbeck Materials | Coated leather articles and method of preparation |
EP3256906B1 (en) * | 2015-02-13 | 2019-04-10 | Morphotonics Holding B.V. | Method for texturing discrete substrates and flexible stamp |
JP5974147B1 (ja) * | 2015-07-31 | 2016-08-23 | 株式会社フジクラ | 配線体アセンブリ、導体層付き構造体、及びタッチセンサ |
TWI735455B (zh) * | 2015-08-10 | 2021-08-11 | 南韓商東友精細化工有限公司 | 電極連接單元及包括其的電裝置 |
KR101671694B1 (ko) * | 2015-08-19 | 2016-11-02 | 광주과학기술원 | 수소 센서의 제조방법 및 이에 의해 제조된 수소 센서 |
JP6673780B2 (ja) * | 2016-08-10 | 2020-03-25 | 株式会社ジャパンディスプレイ | 入力検出装置 |
CN109790639B (zh) * | 2016-09-16 | 2021-07-06 | 3M创新有限公司 | 制造纳米结构化柱形轧辊的方法 |
KR101842176B1 (ko) * | 2017-10-27 | 2018-03-26 | 동우 화인켐 주식회사 | 전극 접속 구조체 및 이를 포함하는 전자 소자 |
WO2019130222A1 (en) * | 2017-12-29 | 2019-07-04 | 3M Innovative Properties Company | Nonplanar patterned nanostructured surface and printing methods for making thereof |
KR102254470B1 (ko) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | 도전입자의 이격거리가 제어된 이방도전성 접착필름의 제조방법 |
KR102254467B1 (ko) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | 이방도전성 접착필름의 제조방법 |
EP4307048A1 (en) * | 2022-07-11 | 2024-01-17 | Morphotonics Holding B.V. | Electrical flexible stamp |
TW202346076A (zh) * | 2022-01-17 | 2023-12-01 | 荷蘭商摩富塔尼克斯控股公司 | 可撓性之印模及可撓性印模的製造方法及壓印系統 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5079600A (en) | 1987-03-06 | 1992-01-07 | Schnur Joel M | High resolution patterning on solid substrates |
US5512131A (en) | 1993-10-04 | 1996-04-30 | President And Fellows Of Harvard College | Formation of microstamped patterns on surfaces and derivative articles |
US7338613B2 (en) * | 2001-09-10 | 2008-03-04 | Surface Logix, Inc. | System and process for automated microcontact printing |
AU2003256008A1 (en) * | 2002-09-09 | 2004-03-29 | International Business Machines Corporation | Printing method using rubber stamp |
WO2006110634A2 (en) | 2005-04-11 | 2006-10-19 | 3M Innovative Properties Company | Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method |
JP2007035138A (ja) | 2005-07-26 | 2007-02-08 | Tdk Corp | パターン描画方法、スタンパー製造方法およびパターン描画装置 |
EP2485052B1 (en) * | 2005-09-13 | 2015-05-06 | Affymetrix, Inc. | Encoded microparticles |
US7968804B2 (en) * | 2006-12-20 | 2011-06-28 | 3M Innovative Properties Company | Methods of patterning a deposit metal on a substrate |
JP5543367B2 (ja) | 2007-12-19 | 2014-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | マイクロコンタクトプリンティング用のインク溶液 |
EP2257969B1 (en) | 2008-02-28 | 2017-12-20 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
EP2298047B1 (en) | 2008-05-20 | 2020-02-05 | 3M Innovative Properties Company | Method for continuous sintering on indefinite length webs |
US9003970B2 (en) | 2008-06-30 | 2015-04-14 | 3M Innovative Properties Company | Solvent assisted method of microcontact printing |
US20100252955A1 (en) * | 2009-04-01 | 2010-10-07 | Nano Terra Inc. | Methods of Patterning Substrates Using Microcontact Printed Polymer Resists and Articles Prepared Therefrom |
JP6128847B2 (ja) | 2009-06-25 | 2017-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
WO2011090641A2 (en) * | 2009-12-30 | 2011-07-28 | 3M Innovative Properties Company | Method of using a mask to provide a patterned substrate |
WO2013003412A2 (en) | 2011-06-30 | 2013-01-03 | 3M Innovative Properties Company | Method for making,inking, and mounting stamps for micro-contact printing |
WO2013003253A2 (en) | 2011-06-30 | 2013-01-03 | 3M Innovative Properties Company | Apparatus and method for microcontact printing on indefinite length webs |
BR112014006043A2 (pt) | 2011-09-16 | 2017-04-04 | 3M Innovative Properties Co | método e aparelho para aplicação de uma estampa para impressão por microcontato a um cilindro de estampagem |
CN103226214A (zh) | 2012-01-29 | 2013-07-31 | 王广武 | 凸凹组合光栅板及其制造方法 |
EP2929417A4 (en) | 2012-12-07 | 2016-07-20 | 3M Innovative Properties Co | METHOD FOR PRODUCING TRANSPARENT CONDUCTORS ON A SUBSTRATE |
-
2014
- 2014-10-30 SG SG11201603375TA patent/SG11201603375TA/en unknown
- 2014-10-30 US US15/033,672 patent/US9873276B2/en active Active
- 2014-10-30 EP EP14859968.1A patent/EP3065951B1/en not_active Not-in-force
- 2014-10-30 BR BR112016010214A patent/BR112016010214A2/pt not_active Application Discontinuation
- 2014-10-30 KR KR1020167014718A patent/KR102320712B1/ko active IP Right Grant
- 2014-10-30 WO PCT/US2014/063133 patent/WO2015069538A1/en active Application Filing
- 2014-10-30 CN CN201480060951.6A patent/CN105722687B/zh active Active
- 2014-11-05 TW TW103138430A patent/TWI660858B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2015069538A1 (en) | 2015-05-14 |
US9873276B2 (en) | 2018-01-23 |
KR20160082537A (ko) | 2016-07-08 |
KR102320712B1 (ko) | 2021-11-02 |
EP3065951A1 (en) | 2016-09-14 |
BR112016010214A2 (pt) | 2017-08-08 |
EP3065951B1 (en) | 2019-07-31 |
TWI660858B (zh) | 2019-06-01 |
EP3065951A4 (en) | 2017-10-18 |
CN105722687A (zh) | 2016-06-29 |
TW201531413A (zh) | 2015-08-16 |
CN105722687B (zh) | 2018-09-25 |
US20160250875A1 (en) | 2016-09-01 |
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