SG11201601941SA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11201601941SA SG11201601941SA SG11201601941SA SG11201601941SA SG11201601941SA SG 11201601941S A SG11201601941S A SG 11201601941SA SG 11201601941S A SG11201601941S A SG 11201601941SA SG 11201601941S A SG11201601941S A SG 11201601941SA SG 11201601941S A SG11201601941S A SG 11201601941SA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013204170A JP6113619B2 (ja) | 2013-09-30 | 2013-09-30 | 研磨用組成物 |
| PCT/JP2014/073076 WO2015045757A1 (ja) | 2013-09-30 | 2014-09-02 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201601941SA true SG11201601941SA (en) | 2016-04-28 |
Family
ID=52742904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201601941SA SG11201601941SA (en) | 2013-09-30 | 2014-09-02 | Polishing composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160215170A1 (zh) |
| EP (1) | EP3053979A4 (zh) |
| JP (1) | JP6113619B2 (zh) |
| KR (1) | KR102263486B1 (zh) |
| CN (1) | CN105593331B (zh) |
| SG (1) | SG11201601941SA (zh) |
| TW (1) | TWI638883B (zh) |
| WO (1) | WO2015045757A1 (zh) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY176027A (en) * | 2013-09-30 | 2020-07-22 | Hoya Corp | Silica abrasive particles, method for manufacturing silica abrasive particles, and method for manufacturing magnetic-disk glass substrate |
| CN108117839B (zh) * | 2016-11-29 | 2021-09-17 | 安集微电子科技（上海）股份有限公司 | 一种具有高氮化硅选择性的化学机械抛光液 |
| JP6811089B2 (ja) * | 2016-12-26 | 2021-01-13 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| EP3775076A4 (en) * | 2018-03-28 | 2021-12-22 | FUJIFILM Electronic Materials U.S.A, Inc. | CHEMICAL-MECHANICAL POLISHING SUSPENSION WITH RUTHENIUM BARRIER |
| US10995238B2 (en) * | 2018-07-03 | 2021-05-04 | Rohm And Haas Electronic Materials Cmp Holdings | Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten |
| JP7219061B2 (ja) * | 2018-11-14 | 2023-02-07 | 関東化学株式会社 | ルテニウム除去用組成物 |
| JP2021080441A (ja) * | 2019-11-20 | 2021-05-27 | 株式会社フジミインコーポレーテッド | 研磨組成物、研磨方法および基板の製造方法 |
| KR20220156623A (ko) * | 2020-03-30 | 2022-11-25 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| JP2023146034A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944836A (en) | 1985-10-28 | 1990-07-31 | International Business Machines Corporation | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
| US6290736B1 (en) * | 1999-02-09 | 2001-09-18 | Sharp Laboratories Of America, Inc. | Chemically active slurry for the polishing of noble metals and method for same |
| US6299795B1 (en) * | 2000-01-18 | 2001-10-09 | Praxair S.T. Technology, Inc. | Polishing slurry |
| US6332831B1 (en) * | 2000-04-06 | 2001-12-25 | Fujimi America Inc. | Polishing composition and method for producing a memory hard disk |
| JP2004172326A (ja) | 2002-11-20 | 2004-06-17 | Hitachi Ltd | 研磨用スラリー及び半導体装置の製造方法 |
| TWI363796B (en) * | 2004-06-14 | 2012-05-11 | Kao Corp | Polishing composition |
| US20070037892A1 (en) * | 2004-09-08 | 2007-02-15 | Irina Belov | Aqueous slurry containing metallate-modified silica particles |
| JP4759298B2 (ja) * | 2005-03-30 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 単結晶表面用の研磨剤及び研磨方法 |
| US7998866B2 (en) * | 2006-09-05 | 2011-08-16 | Cabot Microelectronics Corporation | Silicon carbide polishing method utilizing water-soluble oxidizers |
| FR2912841B1 (fr) | 2007-02-15 | 2009-05-22 | Soitec Silicon On Insulator | Procede de polissage d'heterostructures |
| JP2008264952A (ja) * | 2007-04-23 | 2008-11-06 | Shin Etsu Chem Co Ltd | 多結晶シリコン基板の平面研磨加工方法 |
| JP5646996B2 (ja) * | 2007-09-21 | 2014-12-24 | キャボット マイクロエレクトロニクス コーポレイション | 研磨組成物およびアミノシランを用いて処理された研削剤粒子の使用方法 |
| JP5333744B2 (ja) * | 2008-02-18 | 2013-11-06 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体、化学機械研磨方法および化学機械研磨用水系分散体の製造方法 |
| DE102008059044B4 (de) | 2008-11-26 | 2013-08-22 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht |
| EP2389417B1 (en) * | 2009-01-20 | 2017-03-15 | Cabot Corporation | Compositons comprising silane modified metal oxides |
| CN102449747B (zh) * | 2009-08-19 | 2015-09-16 | 日立化成株式会社 | Cmp研磨液和研磨方法 |
| JP2013084876A (ja) * | 2011-09-30 | 2013-05-09 | Fujimi Inc | 研磨用組成物 |
-
2013
- 2013-09-30 JP JP2013204170A patent/JP6113619B2/ja active Active
-
2014
- 2014-09-02 KR KR1020167007748A patent/KR102263486B1/ko active IP Right Grant
- 2014-09-02 EP EP14849721.7A patent/EP3053979A4/en not_active Withdrawn
- 2014-09-02 US US15/023,788 patent/US20160215170A1/en not_active Abandoned
- 2014-09-02 CN CN201480054190.3A patent/CN105593331B/zh active Active
- 2014-09-02 SG SG11201601941SA patent/SG11201601941SA/en unknown
- 2014-09-02 WO PCT/JP2014/073076 patent/WO2015045757A1/ja active Application Filing
- 2014-09-17 TW TW103132069A patent/TWI638883B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI638883B (zh) | 2018-10-21 |
| WO2015045757A1 (ja) | 2015-04-02 |
| EP3053979A1 (en) | 2016-08-10 |
| TW201518490A (zh) | 2015-05-16 |
| EP3053979A4 (en) | 2016-11-09 |
| JP6113619B2 (ja) | 2017-04-12 |
| JP2015067752A (ja) | 2015-04-13 |
| CN105593331B (zh) | 2019-02-22 |
| KR20160063331A (ko) | 2016-06-03 |
| CN105593331A (zh) | 2016-05-18 |
| KR102263486B1 (ko) | 2021-06-11 |
| US20160215170A1 (en) | 2016-07-28 |
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