SG11201600737TA - Instrument changing assembly and methods - Google Patents
Instrument changing assembly and methodsInfo
- Publication number
- SG11201600737TA SG11201600737TA SG11201600737TA SG11201600737TA SG11201600737TA SG 11201600737T A SG11201600737T A SG 11201600737TA SG 11201600737T A SG11201600737T A SG 11201600737TA SG 11201600737T A SG11201600737T A SG 11201600737TA SG 11201600737T A SG11201600737T A SG 11201600737TA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- changing assembly
- instrument changing
- instrument
- assembly
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/36—DC mode
- G01Q60/366—Nanoindenters, i.e. wherein the indenting force is measured
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
- G01Q70/02—Probe holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/10—Aligning parts to be fitted together
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0076—Hardness, compressibility or resistance to crushing
- G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/0202—Control of the test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/0202—Control of the test
- G01N2203/0206—Means for supplying or positioning specimens or exchangeable parts of the machine such as indenters...
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0286—Miniature specimen; Testing on microregions of a specimen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Measuring Leads Or Probes (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361861306P | 2013-08-01 | 2013-08-01 | |
PCT/US2014/049379 WO2015017765A2 (en) | 2013-08-01 | 2014-08-01 | Instrument changing assembly and methods for the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600737TA true SG11201600737TA (en) | 2016-02-26 |
Family
ID=52432589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600737TA SG11201600737TA (en) | 2013-08-01 | 2014-08-01 | Instrument changing assembly and methods |
Country Status (6)
Country | Link |
---|---|
US (1) | US9902027B2 (ja) |
EP (1) | EP3027365B1 (ja) |
JP (1) | JP6379197B2 (ja) |
KR (1) | KR101712028B1 (ja) |
SG (1) | SG11201600737TA (ja) |
WO (1) | WO2015017765A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9902027B2 (en) | 2013-08-01 | 2018-02-27 | Hysitron, Inc. | Instrument changing assembly and methods |
US10883908B2 (en) * | 2017-03-13 | 2021-01-05 | King Fahd University Of Petroleum And Minerals | Stage for high temperature indentation test |
EP3680736A1 (en) * | 2019-01-14 | 2020-07-15 | JOT Automation Oy | Apparatus and method for testing electronic device |
US20220397503A1 (en) * | 2021-06-12 | 2022-12-15 | University of the District of Columbia | Scratch tester for adhesion testing of coatings on surfaces |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5595707A (en) * | 1990-03-02 | 1997-01-21 | Ventana Medical Systems, Inc. | Automated biological reaction apparatus |
US5327657A (en) * | 1991-07-11 | 1994-07-12 | Renishaw Metrology Ltd. | Touch probe |
JP3266457B2 (ja) * | 1995-05-25 | 2002-03-18 | 住友金属工業株式会社 | 自動ロックウェル硬さ試験機 |
US6538254B1 (en) | 1997-07-22 | 2003-03-25 | Hitachi, Ltd. | Method and apparatus for sample fabrication |
JP3425383B2 (ja) * | 1998-12-03 | 2003-07-14 | 株式会社島津製作所 | 走査型プローブ顕微鏡及びプローブホルダ |
CN100430735C (zh) * | 2002-03-22 | 2008-11-05 | 电子科学工业公司 | 测试探针对准设备 |
US6756800B2 (en) * | 2002-04-16 | 2004-06-29 | Teradyne, Inc. | Semiconductor test system with easily changed interface unit |
JP2004085387A (ja) * | 2002-08-27 | 2004-03-18 | Mitsutoyo Corp | 測定装置 |
WO2008042009A1 (en) | 2006-03-13 | 2008-04-10 | Asylum Research Corporation | Nanoindenter |
EP2237052A1 (en) * | 2009-03-31 | 2010-10-06 | Capres A/S | Automated multi-point probe manipulation |
GB201005252D0 (ja) * | 2010-03-29 | 2010-05-12 | Infinitesima Ltd | |
KR101386602B1 (ko) * | 2011-02-10 | 2014-04-17 | 하이지트론, 인코포레이티드 | 나노기계 테스트 시스템 |
US9902027B2 (en) | 2013-08-01 | 2018-02-27 | Hysitron, Inc. | Instrument changing assembly and methods |
CH710648A1 (de) * | 2015-01-23 | 2016-07-29 | Erowa Ag | Messmaschine zum Vermessen von Werkstücken. |
-
2014
- 2014-08-01 US US14/908,809 patent/US9902027B2/en active Active
- 2014-08-01 EP EP14831561.7A patent/EP3027365B1/en active Active
- 2014-08-01 KR KR1020167005442A patent/KR101712028B1/ko active IP Right Grant
- 2014-08-01 SG SG11201600737TA patent/SG11201600737TA/en unknown
- 2014-08-01 WO PCT/US2014/049379 patent/WO2015017765A2/en active Application Filing
- 2014-08-01 JP JP2016531930A patent/JP6379197B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP3027365B1 (en) | 2018-05-23 |
EP3027365A4 (en) | 2017-02-15 |
US9902027B2 (en) | 2018-02-27 |
WO2015017765A3 (en) | 2015-10-15 |
WO2015017765A2 (en) | 2015-02-05 |
US20160169718A1 (en) | 2016-06-16 |
JP6379197B2 (ja) | 2018-08-22 |
KR101712028B1 (ko) | 2017-03-03 |
KR20160030335A (ko) | 2016-03-16 |
JP2016527517A (ja) | 2016-09-08 |
EP3027365A2 (en) | 2016-06-08 |
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