SG11201600523PA - Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording medium - Google Patents
Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumInfo
- Publication number
- SG11201600523PA SG11201600523PA SG11201600523PA SG11201600523PA SG11201600523PA SG 11201600523P A SG11201600523P A SG 11201600523PA SG 11201600523P A SG11201600523P A SG 11201600523PA SG 11201600523P A SG11201600523P A SG 11201600523PA SG 11201600523P A SG11201600523P A SG 11201600523PA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate processing
- semiconductor device
- recording medium
- manufacturing semiconductor
- processing apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
- H01L21/02323—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of oxygen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02219—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
- H01L21/02222—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02269—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by thermal evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
- H01L21/02323—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of oxygen
- H01L21/02326—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of oxygen into a nitride layer, e.g. changing SiN to SiON
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013159667 | 2013-07-31 | ||
PCT/JP2014/069826 WO2015016180A1 (en) | 2013-07-31 | 2014-07-28 | Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording medium |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600523PA true SG11201600523PA (en) | 2016-02-26 |
Family
ID=52431713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600523PA SG11201600523PA (en) | 2013-07-31 | 2014-07-28 | Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording medium |
Country Status (9)
Country | Link |
---|---|
US (1) | US9502239B2 (en) |
EP (1) | EP3029718B1 (en) |
JP (1) | JP5809771B2 (en) |
KR (1) | KR101718419B1 (en) |
CN (1) | CN105518835B (en) |
IL (1) | IL243817A0 (en) |
SG (1) | SG11201600523PA (en) |
TW (1) | TWI541901B (en) |
WO (1) | WO2015016180A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101744201B1 (en) * | 2015-12-28 | 2017-06-12 | 주식회사 유진테크 | Apparatus for processing substrate |
WO2018020590A1 (en) * | 2016-07-26 | 2018-02-01 | 株式会社日立国際電気 | Substrate treating device, method for manufacturing semiconductor device, and program |
CN109155253A (en) | 2016-08-10 | 2019-01-04 | 株式会社国际电气 | The manufacturing method of substrate processing device, metal parts and semiconductor devices |
JP6749469B2 (en) | 2017-03-23 | 2020-09-02 | 株式会社Kokusai Electric | Semiconductor device manufacturing method, substrate processing apparatus, and program |
JP6774972B2 (en) * | 2018-02-08 | 2020-10-28 | 株式会社Kokusai Electric | Substrate processing equipment, semiconductor equipment manufacturing methods and programs |
EP3756153A1 (en) * | 2018-02-21 | 2020-12-30 | Ecolab USA, Inc. | Pump chemical compatibility management system |
JP7055075B2 (en) * | 2018-07-20 | 2022-04-15 | 東京エレクトロン株式会社 | Heat treatment equipment and heat treatment method |
JP2022130124A (en) * | 2021-02-25 | 2022-09-06 | キオクシア株式会社 | Semiconductor manufacturing device and method for manufacturing semiconductor device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2643879B2 (en) * | 1994-10-31 | 1997-08-20 | 日本電気株式会社 | Fine pattern forming method |
AU6040198A (en) * | 1997-04-03 | 1998-10-22 | W.L. Gore & Associates, Inc. | Low dielectric constant material with improved dielectric strength |
US6121159A (en) * | 1997-06-19 | 2000-09-19 | Lsi Logic Corporation | Polymeric dielectric layers having low dielectric constants and improved adhesion to metal lines |
JPH1195450A (en) * | 1997-09-19 | 1999-04-09 | Fujitsu Ltd | Resist pattern forming method |
US6486078B1 (en) * | 2000-08-22 | 2002-11-26 | Advanced Micro Devices, Inc. | Super critical drying of low k materials |
US6852648B2 (en) * | 2000-09-27 | 2005-02-08 | Agere Systems Inc. | Semiconductor device having a low dielectric constant dielectric material and process for its manufacture |
JP3988676B2 (en) * | 2003-05-01 | 2007-10-10 | セイコーエプソン株式会社 | Coating apparatus, thin film forming method, thin film forming apparatus, and semiconductor device manufacturing method |
US7842390B2 (en) * | 2006-10-03 | 2010-11-30 | The Penn State Research Foundation | Chain end functionalized fluoropolymers having good electrical properties and good chemical reactivity |
JP4748042B2 (en) | 2006-11-30 | 2011-08-17 | 東京エレクトロン株式会社 | Heat treatment method, heat treatment apparatus and storage medium |
JP2012060000A (en) | 2010-09-10 | 2012-03-22 | Toshiba Corp | Device for manufacturing silicone oxide film |
JP5710308B2 (en) * | 2011-02-17 | 2015-04-30 | メルクパフォーマンスマテリアルズIp合同会社 | Method for producing silicon dioxide film |
WO2013077321A1 (en) * | 2011-11-21 | 2013-05-30 | 株式会社日立国際電気 | Apparatus for manufacturing semiconductor device, method for manufacturing semiconductor device, and recoding medium |
JP5970197B2 (en) * | 2012-02-08 | 2016-08-17 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | Inorganic polysilazane resin |
-
2014
- 2014-07-28 SG SG11201600523PA patent/SG11201600523PA/en unknown
- 2014-07-28 CN CN201480043306.3A patent/CN105518835B/en active Active
- 2014-07-28 JP JP2015507838A patent/JP5809771B2/en active Active
- 2014-07-28 KR KR1020167000114A patent/KR101718419B1/en active IP Right Grant
- 2014-07-28 WO PCT/JP2014/069826 patent/WO2015016180A1/en active Application Filing
- 2014-07-28 EP EP14831930.4A patent/EP3029718B1/en active Active
- 2014-07-31 TW TW103126162A patent/TWI541901B/en active
-
2015
- 2015-05-08 US US14/707,350 patent/US9502239B2/en active Active
-
2016
- 2016-01-28 IL IL243817A patent/IL243817A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201513226A (en) | 2015-04-01 |
US9502239B2 (en) | 2016-11-22 |
CN105518835B (en) | 2017-05-10 |
EP3029718A1 (en) | 2016-06-08 |
KR20160009705A (en) | 2016-01-26 |
JPWO2015016180A1 (en) | 2017-03-02 |
KR101718419B1 (en) | 2017-03-22 |
US20150262817A1 (en) | 2015-09-17 |
IL243817A0 (en) | 2016-04-21 |
CN105518835A (en) | 2016-04-20 |
WO2015016180A1 (en) | 2015-02-05 |
JP5809771B2 (en) | 2015-11-11 |
TWI541901B (en) | 2016-07-11 |
EP3029718A4 (en) | 2017-03-15 |
EP3029718B1 (en) | 2022-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201800143RA (en) | Substrate processing device, semiconductor device manufacturing method, and recording medium | |
SG11201802143QA (en) | Substrate treatment apparatus, method for manufacturing semiconductor device, and recording medium | |
TWI562204B (en) | Substrate processing apparatus, semiconductor device manufacturing method and computer-readable recording medium | |
SG11201705569PA (en) | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | |
HK1214408A1 (en) | Semiconductor device and method for manufacturing same | |
HK1221819A1 (en) | Substrate-holding apparatus, exposure apparatus, and device manufacturing method | |
EP2966673A4 (en) | Substrate processing device and substrate processing method | |
EP3001451A4 (en) | Substrate holding method, substrate holding apparatus, exposure method, and exposure apparatus | |
TWI563560B (en) | Substrate processing apparatus and substrate processing method | |
SG11201600523PA (en) | Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording medium | |
EP2942808A4 (en) | Ceramic wiring substrate, semiconductor device, and method for manufacturing ceramic wiring substrate | |
EP3054700A4 (en) | Method, device and system for processing media | |
EP2980833A4 (en) | Substrate processing device and substrate processing method | |
IL242526B (en) | Inspection method and apparatus, substrates for use therein and device manufacturing method | |
EP2975858A4 (en) | Method for processing data in the ethernet, physical layer chip and ethernet device | |
EP2958146A4 (en) | Semiconductor substrate, image pickup element, and image pickup apparatus | |
TWI562221B (en) | Substrate processing method and substrate processing apparatus | |
HK1215307A1 (en) | Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method | |
HK1219347A1 (en) | Semiconductor device and manufacturing method for same | |
SG11201605229PA (en) | Cassette positioning device and semiconductor processing apparatus | |
HK1206458A1 (en) | Method for processing data and device thereof | |
SG11201604486XA (en) | Semiconductor wafer processing methods and apparatus | |
EP2955748A4 (en) | Semiconductor device and method for manufacturing same | |
SG10201404086XA (en) | Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus | |
HK1220776A1 (en) | Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus |