SG11201507942PA - Coating liquid for forming metal oxide film, metal oxide film, field-effect transistor, and method for producing field-effect transistor - Google Patents
Coating liquid for forming metal oxide film, metal oxide film, field-effect transistor, and method for producing field-effect transistorInfo
- Publication number
- SG11201507942PA SG11201507942PA SG11201507942PA SG11201507942PA SG11201507942PA SG 11201507942P A SG11201507942P A SG 11201507942PA SG 11201507942P A SG11201507942P A SG 11201507942PA SG 11201507942P A SG11201507942P A SG 11201507942PA SG 11201507942P A SG11201507942P A SG 11201507942PA
- Authority
- SG
- Singapore
- Prior art keywords
- oxide film
- metal oxide
- effect transistor
- field
- coating liquid
- Prior art date
Links
- 230000005669 field effect Effects 0.000 title 2
- 229910044991 metal oxide Inorganic materials 0.000 title 2
- 150000004706 metal oxides Chemical class 0.000 title 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013072954 | 2013-03-29 | ||
JP2014042911 | 2014-03-05 | ||
JP2014058359A JP6454974B2 (en) | 2013-03-29 | 2014-03-20 | Metal oxide film forming coating solution, metal oxide film manufacturing method, and field effect transistor manufacturing method |
PCT/JP2014/059695 WO2014157733A1 (en) | 2013-03-29 | 2014-03-26 | Coating liquid for forming metal oxide film, metal oxide film, field-effect transistor, and method for producing field-effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201507942PA true SG11201507942PA (en) | 2015-10-29 |
Family
ID=51624688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201507942PA SG11201507942PA (en) | 2013-03-29 | 2014-03-26 | Coating liquid for forming metal oxide film, metal oxide film, field-effect transistor, and method for producing field-effect transistor |
Country Status (9)
Country | Link |
---|---|
US (1) | US9748097B2 (en) |
EP (1) | EP2962327B1 (en) |
JP (1) | JP6454974B2 (en) |
KR (1) | KR101835194B1 (en) |
CN (1) | CN105190854B (en) |
BR (1) | BR112015024759A2 (en) |
SG (1) | SG11201507942PA (en) |
TW (1) | TWI599622B (en) |
WO (1) | WO2014157733A1 (en) |
Families Citing this family (25)
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JP5972065B2 (en) * | 2012-06-20 | 2016-08-17 | 富士フイルム株式会社 | Thin film transistor manufacturing method |
CN105408244B (en) * | 2013-08-07 | 2019-04-12 | 株式会社尼康 | The manufacturing method of metal oxide film and the manufacturing method of transistor |
EP3125296B1 (en) * | 2015-07-30 | 2020-06-10 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
JP6828293B2 (en) | 2015-09-15 | 2021-02-10 | 株式会社リコー | A coating liquid for forming an n-type oxide semiconductor film, a method for producing an n-type oxide semiconductor film, and a method for producing a field-effect transistor. |
US10269293B2 (en) | 2015-10-23 | 2019-04-23 | Ricoh Company, Ltd. | Field-effect transistor (FET) having gate oxide insulating layer including SI and alkaline earth elements, and display element, image display and system including FET |
US10312373B2 (en) | 2015-11-17 | 2019-06-04 | Ricoh Company, Ltd. | Field-effect transistor (FET) having oxide insulating layer disposed on gate insulating film and between source and drain electrodes, and display element, display and system including said FET, and method of manufacturing said FET |
JP6607013B2 (en) | 2015-12-08 | 2019-11-20 | 株式会社リコー | Field effect transistor, display element, image display device, and system |
JP2017105013A (en) | 2015-12-08 | 2017-06-15 | 株式会社リコー | Gas barrier laminate, semiconductor device, display element, display device and system |
US10600916B2 (en) | 2015-12-08 | 2020-03-24 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
US10170635B2 (en) | 2015-12-09 | 2019-01-01 | Ricoh Company, Ltd. | Semiconductor device, display device, display apparatus, and system |
JP6907512B2 (en) * | 2015-12-15 | 2021-07-21 | 株式会社リコー | Manufacturing method of field effect transistor |
JP6665536B2 (en) | 2016-01-12 | 2020-03-13 | 株式会社リコー | Oxide semiconductor |
SG11201806226WA (en) | 2016-02-01 | 2018-08-30 | Ricoh Co Ltd | Field effect transistor, method for manufacturing same, display element, display device, and system |
JP6701835B2 (en) | 2016-03-11 | 2020-05-27 | 株式会社リコー | Field effect transistor, display element, image display device, and system |
US10818705B2 (en) | 2016-03-18 | 2020-10-27 | Ricoh Company, Ltd. | Method for manufacturing a field effect transistor, method for manufacturing a volatile semiconductor memory element, method for manufacturing a non-volatile semiconductor memory element, method for manufacturing a display element, method for manufacturing an image display device, and method for manufacturing a system |
EP3432349A4 (en) | 2016-03-18 | 2019-03-20 | Ricoh Company, Ltd. | Method for manufacturing a field effect transistor |
CN105914150A (en) * | 2016-04-29 | 2016-08-31 | 京东方科技集团股份有限公司 | Film transistor and the manufacturing method thereof, array substrate and the manufacturing method of, display panel and display apparatus |
JP2018160670A (en) * | 2017-03-21 | 2018-10-11 | 株式会社リコー | Coating liquid for forming metal oxide film, oxide film, field-effect transistor, and manufacturing method thereof |
JP7305933B2 (en) * | 2018-07-23 | 2023-07-11 | 株式会社リコー | Coating solution for forming metal oxide film, oxide insulator film, field effect transistor, display device, image display device, and system |
JP2020088300A (en) * | 2018-11-30 | 2020-06-04 | 株式会社リコー | Coating liquid for forming oxide, manufacturing method of oxide film, and manufacturing method of field effect transistor |
CN111370495B (en) * | 2018-12-26 | 2022-05-03 | Tcl科技集团股份有限公司 | Thin film transistor active layer ink and preparation method of thin film transistor |
JP7326795B2 (en) | 2019-03-20 | 2023-08-16 | 株式会社リコー | FIELD EFFECT TRANSISTOR, DISPLAY DEVICE, IMAGE DISPLAY DEVICE, AND SYSTEM |
CN111088484A (en) * | 2019-11-14 | 2020-05-01 | Tcl华星光电技术有限公司 | Method for preparing metal oxide film |
CN112980234B (en) * | 2019-12-17 | 2022-12-23 | 山东海科创新研究院有限公司 | Dimethyl carbonate azeotropic solvent composition, preparation method thereof, automobile low-temperature baking varnish formula and application |
CN111678332B (en) * | 2020-05-12 | 2022-03-22 | 首钢集团有限公司 | Alloy baking method for reducing blockage rate of burner |
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US20120286265A1 (en) * | 2010-02-01 | 2012-11-15 | Kazushige Takechi | Amorphous oxide thin film, thin film transistor using the same, and method for manufacturing the same |
JP6064314B2 (en) | 2010-11-29 | 2017-01-25 | 株式会社リコー | Metal oxide thin film forming coating liquid, metal oxide thin film manufacturing method, and field effect transistor manufacturing method |
KR101361054B1 (en) * | 2011-09-02 | 2014-02-12 | 연세대학교 산학협력단 | A material for forming oxide thin film, a forming method for oxide thin film and a making method for a thim film transistor |
JP5929132B2 (en) | 2011-11-30 | 2016-06-01 | 株式会社リコー | Metal oxide thin film forming coating liquid, metal oxide thin film manufacturing method, and field effect transistor manufacturing method |
JP6236778B2 (en) | 2012-12-19 | 2017-11-29 | 株式会社リコー | Metal oxide film forming coating solution, metal oxide film, field effect transistor, and method of manufacturing field effect transistor |
-
2014
- 2014-03-20 JP JP2014058359A patent/JP6454974B2/en active Active
- 2014-03-26 US US14/780,190 patent/US9748097B2/en active Active
- 2014-03-26 WO PCT/JP2014/059695 patent/WO2014157733A1/en active Application Filing
- 2014-03-26 KR KR1020157030733A patent/KR101835194B1/en active IP Right Grant
- 2014-03-26 BR BR112015024759A patent/BR112015024759A2/en active Search and Examination
- 2014-03-26 EP EP14775599.5A patent/EP2962327B1/en active Active
- 2014-03-26 SG SG11201507942PA patent/SG11201507942PA/en unknown
- 2014-03-26 CN CN201480024713.XA patent/CN105190854B/en active Active
- 2014-03-27 TW TW103111482A patent/TWI599622B/en active
Also Published As
Publication number | Publication date |
---|---|
CN105190854B (en) | 2018-01-30 |
EP2962327A4 (en) | 2016-04-06 |
CN105190854A (en) | 2015-12-23 |
KR20150135480A (en) | 2015-12-02 |
BR112015024759A2 (en) | 2017-07-18 |
WO2014157733A1 (en) | 2014-10-02 |
EP2962327A1 (en) | 2016-01-06 |
TWI599622B (en) | 2017-09-21 |
US9748097B2 (en) | 2017-08-29 |
JP6454974B2 (en) | 2019-01-23 |
US20160042947A1 (en) | 2016-02-11 |
JP2015181141A (en) | 2015-10-15 |
KR101835194B1 (en) | 2018-04-13 |
EP2962327B1 (en) | 2019-09-11 |
TW201439227A (en) | 2014-10-16 |
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