SG11201507894XA - Method and apparatus for uniformly metallization on substrate - Google Patents

Method and apparatus for uniformly metallization on substrate

Info

Publication number
SG11201507894XA
SG11201507894XA SG11201507894XA SG11201507894XA SG11201507894XA SG 11201507894X A SG11201507894X A SG 11201507894XA SG 11201507894X A SG11201507894X A SG 11201507894XA SG 11201507894X A SG11201507894X A SG 11201507894XA SG 11201507894X A SG11201507894X A SG 11201507894XA
Authority
SG
Singapore
Prior art keywords
metallization
uniformly
substrate
uniformly metallization
Prior art date
Application number
SG11201507894XA
Other languages
English (en)
Inventor
Hui Wang
Fuping Chen
Xi Wang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201507894XA publication Critical patent/SG11201507894XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
SG11201507894XA 2013-04-22 2013-04-22 Method and apparatus for uniformly metallization on substrate SG11201507894XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/074527 WO2014172837A1 (en) 2013-04-22 2013-04-22 Method and apparatus for uniformly metallization on substrate

Publications (1)

Publication Number Publication Date
SG11201507894XA true SG11201507894XA (en) 2015-11-27

Family

ID=51790970

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507894XA SG11201507894XA (en) 2013-04-22 2013-04-22 Method and apparatus for uniformly metallization on substrate

Country Status (6)

Country Link
US (3) US10113244B2 (ja)
JP (1) JP6162881B2 (ja)
KR (1) KR102119634B1 (ja)
CN (1) CN105190859B (ja)
SG (1) SG11201507894XA (ja)
WO (1) WO2014172837A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220003145A (ko) * 2014-11-25 2022-01-07 에이씨엠 리서치 (상하이) 인코포레이티드 기판상의 균일한 금속화를 위한 장치 및 방법
JP6421154B2 (ja) * 2016-09-26 2018-11-07 千住金属工業株式会社 金属体の製造方法
CN108018584B (zh) * 2017-11-20 2020-04-07 大连理工大学 一种提高金属微电铸均匀性的兆声电铸设备及方法
WO2021189181A1 (en) * 2020-03-23 2021-09-30 Acm Research (Shanghai) , Inc. Plating apparatus and plating method
CN112391657A (zh) * 2020-10-29 2021-02-23 江西上品金刚石工具科技有限公司 一种利用超声波电镀金刚石钻头的方法
US20230279576A1 (en) * 2022-03-03 2023-09-07 Applied Materials, Inc. Plating and deplating currents for material co-planarity in semiconductor plating processes

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656720B1 (fr) * 1989-12-29 1992-03-20 Thomson Csf Reflecteur d'ondes acoustiques pouvant fonctionner sous une forte immersion.
JPH06256998A (ja) 1993-03-05 1994-09-13 Shimada Phys & Chem Ind Co Ltd メッキ液の攪拌方法
US5762084A (en) * 1994-07-15 1998-06-09 Ontrak Systems, Inc. Megasonic bath
JP3532065B2 (ja) 1997-04-14 2004-05-31 株式会社大和化成研究所 めっき方法及び装置
AU2233399A (en) * 1998-02-12 1999-08-30 Acm Research, Inc. Plating apparatus and method
US6261433B1 (en) 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
KR100390890B1 (ko) 1998-11-14 2003-10-08 주식회사 하이닉스반도체 도전층형성방법
US6582578B1 (en) * 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6746590B2 (en) * 2001-09-05 2004-06-08 3M Innovative Properties Company Ultrasonically-enhanced electroplating apparatus and methods
US7165565B2 (en) 2002-12-16 2007-01-23 Applied Materials, Inc. Megasonic wafer cleaning tank with reflector for improved wafer edge cleaning
US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
US20070170066A1 (en) * 2006-01-06 2007-07-26 Beaudry Christopher L Method for planarization during plating
WO2009055992A1 (en) 2007-11-02 2009-05-07 Acm Research (Shanghai) Inc. Plating apparatus for metallization on semiconductor workpiece
US9005409B2 (en) * 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
WO2012174732A1 (en) 2011-06-24 2012-12-27 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
CN202610367U (zh) * 2012-05-09 2012-12-19 博罗县精汇电子科技有限公司 超声波振动电镀装置

Also Published As

Publication number Publication date
KR20160002803A (ko) 2016-01-08
US20210156042A1 (en) 2021-05-27
JP2016515668A (ja) 2016-05-30
US20190024253A1 (en) 2019-01-24
US10907266B2 (en) 2021-02-02
US11629425B2 (en) 2023-04-18
CN105190859B (zh) 2018-03-02
WO2014172837A1 (en) 2014-10-30
KR102119634B1 (ko) 2020-06-08
CN105190859A (zh) 2015-12-23
US20160068985A1 (en) 2016-03-10
JP6162881B2 (ja) 2017-07-12
US10113244B2 (en) 2018-10-30

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