SG11201505000WA - End-effector device - Google Patents
End-effector deviceInfo
- Publication number
- SG11201505000WA SG11201505000WA SG11201505000WA SG11201505000WA SG11201505000WA SG 11201505000W A SG11201505000W A SG 11201505000WA SG 11201505000W A SG11201505000W A SG 11201505000WA SG 11201505000W A SG11201505000W A SG 11201505000WA SG 11201505000W A SG11201505000W A SG 11201505000WA
- Authority
- SG
- Singapore
- Prior art keywords
- effector device
- effector
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012285790 | 2012-12-27 | ||
PCT/JP2013/007582 WO2014103300A1 (en) | 2012-12-27 | 2013-12-25 | End-effector device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505000WA true SG11201505000WA (en) | 2015-07-30 |
Family
ID=51020416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505000WA SG11201505000WA (en) | 2012-12-27 | 2013-12-25 | End-effector device |
Country Status (7)
Country | Link |
---|---|
US (1) | US9343344B2 (en) |
EP (1) | EP2940723B1 (en) |
JP (1) | JP6314089B2 (en) |
KR (1) | KR101773272B1 (en) |
CN (1) | CN104937708B (en) |
SG (1) | SG11201505000WA (en) |
WO (1) | WO2014103300A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6309756B2 (en) * | 2013-12-26 | 2018-04-11 | 川崎重工業株式会社 | End effector device |
KR101863473B1 (en) * | 2013-12-26 | 2018-05-31 | 가와사끼 쥬고교 가부시끼 가이샤 | End effector and substrate transfer robot |
JP2017175072A (en) * | 2016-03-25 | 2017-09-28 | 川崎重工業株式会社 | Substrate transfer hand and robot |
WO2018053149A1 (en) * | 2016-09-15 | 2018-03-22 | Dishcraft Robotics, Inc. | Robotic manipulation using reusable, independent tags |
CN108695217B (en) * | 2017-04-07 | 2021-06-29 | 台湾积体电路制造股份有限公司 | Substrate transport apparatus and edge effector therefor |
US20190013215A1 (en) * | 2017-07-05 | 2019-01-10 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying apparatus including the same |
CN109244022B (en) * | 2018-09-07 | 2023-10-03 | 宁波润华全芯微电子设备有限公司 | Manipulator end effector |
TWI746014B (en) * | 2020-06-16 | 2021-11-11 | 大立鈺科技有限公司 | Wafer access assembly, wafer access device and wafer carrier |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0492446A (en) | 1990-08-07 | 1992-03-25 | Plasma Syst:Kk | Substrate conveyance robot |
JPH05235147A (en) | 1992-02-24 | 1993-09-10 | Dainippon Screen Mfg Co Ltd | Substrate transferring apparatus |
JPH0786371A (en) * | 1993-09-10 | 1995-03-31 | Dainippon Screen Mfg Co Ltd | Substrate transfer equipment |
JPH1032236A (en) * | 1996-07-12 | 1998-02-03 | Shinko Electric Co Ltd | Variable pitch wafer transfer hand |
JPH11130254A (en) * | 1997-10-24 | 1999-05-18 | Sharp Corp | Substrate carrier cassette |
JPH11163096A (en) | 1997-11-21 | 1999-06-18 | Kokusai Electric Co Ltd | Pitch varying mechanism for substrate transfer mechanism |
JP2001118909A (en) | 1999-10-21 | 2001-04-27 | Zenkyo Kasei Kogyo Kk | Pitch adjusting device |
JP4278275B2 (en) | 2000-04-07 | 2009-06-10 | 三菱電機株式会社 | Array pitch converter |
JP2003309166A (en) * | 2002-04-15 | 2003-10-31 | Sharp Corp | Transfer device for semiconductor wafer |
US20040013503A1 (en) * | 2002-07-22 | 2004-01-22 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
JP2004158625A (en) * | 2002-11-06 | 2004-06-03 | Canon Inc | Substrate transfer hand |
US7806642B2 (en) * | 2004-05-13 | 2010-10-05 | Panasonic Corporation | Receiver for component feed plates and component feeder |
JP3998662B2 (en) | 2004-05-31 | 2007-10-31 | 株式会社東京興業貿易商会 | Wafer pitch converter |
JP2006176276A (en) * | 2004-12-22 | 2006-07-06 | Shinko Electric Co Ltd | Lift |
JP2006313865A (en) * | 2005-05-09 | 2006-11-16 | Tatsumo Kk | Substrate holder |
KR101312621B1 (en) * | 2006-11-29 | 2013-10-07 | 삼성전자주식회사 | A wafer moving apparatus |
JP5823742B2 (en) * | 2010-07-02 | 2015-11-25 | 芝浦メカトロニクス株式会社 | Gripping device, transport device, processing device, and electronic device manufacturing method |
TWI538789B (en) * | 2011-08-10 | 2016-06-21 | Kawasaki Heavy Ind Ltd | A end effector device, and a substrate transport robot including the end effector device |
-
2013
- 2013-12-25 EP EP13868539.1A patent/EP2940723B1/en active Active
- 2013-12-25 JP JP2014554140A patent/JP6314089B2/en active Active
- 2013-12-25 US US14/758,263 patent/US9343344B2/en active Active
- 2013-12-25 KR KR1020157018042A patent/KR101773272B1/en active IP Right Grant
- 2013-12-25 CN CN201380067574.4A patent/CN104937708B/en active Active
- 2013-12-25 SG SG11201505000WA patent/SG11201505000WA/en unknown
- 2013-12-25 WO PCT/JP2013/007582 patent/WO2014103300A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20150096443A (en) | 2015-08-24 |
EP2940723A4 (en) | 2016-08-10 |
JPWO2014103300A1 (en) | 2017-01-12 |
JP6314089B2 (en) | 2018-04-18 |
EP2940723B1 (en) | 2020-05-20 |
EP2940723A1 (en) | 2015-11-04 |
WO2014103300A1 (en) | 2014-07-03 |
CN104937708B (en) | 2018-04-24 |
US20150357219A1 (en) | 2015-12-10 |
KR101773272B1 (en) | 2017-08-30 |
CN104937708A (en) | 2015-09-23 |
US9343344B2 (en) | 2016-05-17 |
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