SG11201504342SA - Quartz upper and lower domes - Google Patents

Quartz upper and lower domes

Info

Publication number
SG11201504342SA
SG11201504342SA SG11201504342SA SG11201504342SA SG11201504342SA SG 11201504342S A SG11201504342S A SG 11201504342SA SG 11201504342S A SG11201504342S A SG 11201504342SA SG 11201504342S A SG11201504342S A SG 11201504342SA SG 11201504342S A SG11201504342S A SG 11201504342SA
Authority
SG
Singapore
Prior art keywords
lower domes
quartz upper
quartz
domes
Prior art date
Application number
SG11201504342SA
Other languages
English (en)
Inventor
Anzhong Chang
Paul Brillhart
Mehmet Tugrul Samir
Anh N Nguyen
Kailash Kiran Patalay
Surajit Kumar
Steve Aboagye
David K Carlson
Satheesh Kuppurao
Joseph M Ranish
Oleg Serebryanov
Dongming Iu
Shu-Kwan Lau
Zouming Zhu
Herman Diniz
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201504342SA publication Critical patent/SG11201504342SA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45502Flow conditions in reaction chamber
    • C23C16/45504Laminar flow

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
SG11201504342SA 2013-01-16 2013-12-18 Quartz upper and lower domes SG11201504342SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361753410P 2013-01-16 2013-01-16
US201361780447P 2013-03-13 2013-03-13
PCT/US2013/076295 WO2014113179A1 (en) 2013-01-16 2013-12-18 Quartz upper and lower domes

Publications (1)

Publication Number Publication Date
SG11201504342SA true SG11201504342SA (en) 2015-08-28

Family

ID=51165213

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201708105UA SG10201708105UA (en) 2013-01-16 2013-12-18 Quartz upper and lower domes
SG11201504342SA SG11201504342SA (en) 2013-01-16 2013-12-18 Quartz upper and lower domes

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201708105UA SG10201708105UA (en) 2013-01-16 2013-12-18 Quartz upper and lower domes

Country Status (7)

Country Link
US (2) US9768043B2 (ko)
JP (2) JP6388876B2 (ko)
KR (1) KR20150108392A (ko)
CN (3) CN107658245A (ko)
SG (2) SG10201708105UA (ko)
TW (1) TWI638070B (ko)
WO (1) WO2014113179A1 (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140083360A1 (en) * 2012-09-26 2014-03-27 Applied Materials, Inc. Process chamber having more uniform gas flow
US10405375B2 (en) 2013-03-11 2019-09-03 Applied Materials, Inc. Lamphead PCB with flexible standoffs
US9814099B2 (en) * 2013-08-02 2017-11-07 Applied Materials, Inc. Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same
US11414759B2 (en) * 2013-11-29 2022-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for supplying process gas into wafer process apparatus
US11060203B2 (en) * 2014-09-05 2021-07-13 Applied Materials, Inc. Liner for epi chamber
US10760161B2 (en) 2014-09-05 2020-09-01 Applied Materials, Inc. Inject insert for EPI chamber
SG11201701467RA (en) * 2014-09-05 2017-03-30 Applied Materials Inc Upper dome for epi chamber
US10872790B2 (en) * 2014-10-20 2020-12-22 Applied Materials, Inc. Optical system
CN107109645B (zh) * 2015-01-02 2021-02-26 应用材料公司 处理腔室
US10475674B2 (en) * 2015-03-25 2019-11-12 SCREEN Holdings Co., Ltd. Light irradiation type heat treatment apparatus and method for manufacturing heat treatment apparatus
US10781533B2 (en) * 2015-07-31 2020-09-22 Applied Materials, Inc. Batch processing chamber
KR102104468B1 (ko) * 2015-12-30 2020-04-27 맷슨 테크놀로지, 인크. 밀리세컨드 어닐닝 시스템에서 공정 균일성을 향상시키기 위한 방법
JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Screenホールディングス 熱処理装置
IT201600099783A1 (it) * 2016-10-05 2018-04-05 Lpe Spa Reattore per deposizione epitassiale con riflettore esterno alla camera di reazione e metodo di raffreddamento di un suscettore e di substrati
CN117810127A (zh) * 2017-02-23 2024-04-02 株式会社国际电气 基板处理装置、半导体装置的制造方法、基板处理方法、容器及存储介质
WO2019147493A1 (en) * 2018-01-29 2019-08-01 Applied Materials, Inc. Process kit geometry for particle reduction in pvd processes
CN214848503U (zh) 2018-08-29 2021-11-23 应用材料公司 注入器设备、基板处理设备及在机器可读介质中实现的结构
US11032945B2 (en) * 2019-07-12 2021-06-08 Applied Materials, Inc. Heat shield assembly for an epitaxy chamber
JP2021068871A (ja) * 2019-10-28 2021-04-30 株式会社Sumco エピタキシャル成長装置およびエピタキシャルウェーハの製造方法
CN110981172A (zh) * 2019-12-21 2020-04-10 张忠恕 一种外延工艺石英焊件组件及其加工工艺
US12084770B2 (en) * 2020-08-18 2024-09-10 Globalwafers Co., Ltd. Window for chemical vapor deposition systems and related methods
CN114686849B (zh) * 2020-12-31 2023-12-01 拓荆科技股份有限公司 制造半导体薄膜的装置和方法
US12091749B2 (en) 2021-05-11 2024-09-17 Applied Materials, Inc. Method for epitaxially depositing a material on a substrate by flowing a process gas across the substrate from an upper gas inlet to an upper gas outlet and flowing a purge gas from a lower gas inlet to a lower gas outlet
US12060651B2 (en) 2021-05-11 2024-08-13 Applied Materials, Inc. Chamber architecture for epitaxial deposition and advanced epitaxial film applications
US12018372B2 (en) 2021-05-11 2024-06-25 Applied Materials, Inc. Gas injector for epitaxy and CVD chamber
KR20230122133A (ko) * 2021-05-11 2023-08-22 어플라이드 머티어리얼스, 인코포레이티드 에피택시 및 cvd 챔버용 가스 인젝터
KR20230012803A (ko) * 2021-07-16 2023-01-26 주성엔지니어링(주) 기판처리장치용 상부돔 및 기판처리장치
CN115020303B (zh) * 2022-08-09 2022-11-04 北京屹唐半导体科技股份有限公司 晶圆的热处理装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085887A (en) * 1990-09-07 1992-02-04 Applied Materials, Inc. Wafer reactor vessel window with pressure-thermal compensation
EP0967632A1 (en) * 1993-07-30 1999-12-29 Applied Materials, Inc. Gas inlets for wafer processing chamber
US6121579A (en) * 1996-02-28 2000-09-19 Tokyo Electron Limited Heating apparatus, and processing apparatus
US6108490A (en) * 1996-07-11 2000-08-22 Cvc, Inc. Multizone illuminator for rapid thermal processing with improved spatial resolution
US6406543B1 (en) * 1998-07-23 2002-06-18 Applied Materials, Inc. Infra-red transparent thermal reactor cover member
US6108491A (en) * 1998-10-30 2000-08-22 Applied Materials, Inc. Dual surface reflector
US6143078A (en) * 1998-11-13 2000-11-07 Applied Materials, Inc. Gas distribution system for a CVD processing chamber
US6307184B1 (en) 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
US6770144B2 (en) 2000-07-25 2004-08-03 International Business Machines Corporation Multideposition SACVD reactor
JP2002075901A (ja) * 2000-08-31 2002-03-15 Tokyo Electron Ltd アニール装置、メッキ処理システム、および半導体デバイスの製造方法
US6350964B1 (en) * 2000-11-09 2002-02-26 Applied Materials, Inc. Power distribution printed circuit board for a semiconductor processing system
US6344631B1 (en) * 2001-05-11 2002-02-05 Applied Materials, Inc. Substrate support assembly and processing apparatus
US6455814B1 (en) 2001-11-07 2002-09-24 Applied Materials, Inc. Backside heating chamber for emissivity independent thermal processes
US6576565B1 (en) * 2002-02-14 2003-06-10 Infineon Technologies, Ag RTCVD process and reactor for improved conformality and step-coverage
US6833322B2 (en) * 2002-10-17 2004-12-21 Applied Materials, Inc. Apparatuses and methods for depositing an oxide film
KR20050067835A (ko) * 2003-12-29 2005-07-05 삼성전자주식회사 프로세스 챔버의 램프 어셈블리
US7396743B2 (en) 2004-06-10 2008-07-08 Singh Kaushal K Low temperature epitaxial growth of silicon-containing films using UV radiation
US7147359B2 (en) * 2004-06-25 2006-12-12 Applied Materials, Inc. Lamp assembly having flexibly positioned rigid plug
US8372203B2 (en) * 2005-09-30 2013-02-12 Applied Materials, Inc. Apparatus temperature control and pattern compensation
US7794667B2 (en) * 2005-10-19 2010-09-14 Moore Epitaxial, Inc. Gas ring and method of processing substrates
JP5102217B2 (ja) * 2005-10-31 2012-12-19 アプライド マテリアルズ インコーポレイテッド プロセス削減反応器
JP5004513B2 (ja) 2006-06-09 2012-08-22 Sumco Techxiv株式会社 気相成長装置及び気相成長方法
US8852349B2 (en) * 2006-09-15 2014-10-07 Applied Materials, Inc. Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects
US8317449B2 (en) * 2007-03-05 2012-11-27 Applied Materials, Inc. Multiple substrate transfer robot
US20080220150A1 (en) * 2007-03-05 2008-09-11 Applied Materials, Inc. Microbatch deposition chamber with radiant heating
JP5169299B2 (ja) 2008-02-22 2013-03-27 株式会社デンソー 半導体製造装置
US8314368B2 (en) * 2008-02-22 2012-11-20 Applied Materials, Inc. Silver reflectors for semiconductor processing chambers
JP2010040541A (ja) * 2008-07-31 2010-02-18 Sumco Corp エピタキシャル装置
US8294068B2 (en) * 2008-09-10 2012-10-23 Applied Materials, Inc. Rapid thermal processing lamphead with improved cooling
US8150242B2 (en) * 2008-10-31 2012-04-03 Applied Materials, Inc. Use of infrared camera for real-time temperature monitoring and control
DE102009022224B4 (de) 2009-05-20 2012-09-13 Siltronic Ag Verfahren zur Herstellung von epitaxierten Siliciumscheiben
CN201448782U (zh) * 2009-07-17 2010-05-05 吴育林 便于调节照射方向的导轨灯
CN201448777U (zh) * 2009-07-22 2010-05-05 吴育林 便于调节照射方向的落地灯
US20120145697A1 (en) * 2009-08-18 2012-06-14 Tokyo Electron Limmited Heat treatment apparatus
US9127360B2 (en) 2009-10-05 2015-09-08 Applied Materials, Inc. Epitaxial chamber with cross flow
JP5837178B2 (ja) * 2011-03-22 2015-12-24 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 化学気相堆積チャンバ用のライナアセンブリ
US20120270384A1 (en) * 2011-04-22 2012-10-25 Applied Materials, Inc. Apparatus for deposition of materials on a substrate
US20140026816A1 (en) 2012-07-27 2014-01-30 Applied Materials, Inc. Multi-zone quartz gas distribution apparatus

Also Published As

Publication number Publication date
JP2016509751A (ja) 2016-03-31
US20180005856A1 (en) 2018-01-04
CN104885192B (zh) 2018-03-27
TW201432103A (zh) 2014-08-16
US9768043B2 (en) 2017-09-19
CN104885192A (zh) 2015-09-02
CN108364889A (zh) 2018-08-03
TWI638070B (zh) 2018-10-11
US20140199056A1 (en) 2014-07-17
SG10201708105UA (en) 2017-11-29
JP2019009453A (ja) 2019-01-17
WO2014113179A1 (en) 2014-07-24
JP6388876B2 (ja) 2018-09-12
KR20150108392A (ko) 2015-09-25
CN107658245A (zh) 2018-02-02

Similar Documents

Publication Publication Date Title
SG11201504342SA (en) Quartz upper and lower domes
HK1218386A1 (zh) 生物光子材料及其用途
HRP20191277T8 (hr) Anti-cd26 antitijela i njihove primjene
GB201305277D0 (en) Novel combination and use
HK1220806A1 (zh) 改進的開關以及相關方法
SG11201509226RA (en) Communication methods and communication devices
AU355563S (en) Wristwatch
AU354606S (en) Keyboard
EP2961108A4 (en) SWITCH AND PROGRAM
AU352809S (en) Watchcase
AU350512S (en) Wristwatch
IL244751A0 (en) Cyclic thianouracil-carboxamides and their use
GB201311862D0 (en) Optoelectronic devices, methods of fabrication thereof and materials therefor
EP2978169A4 (en) SWITCH AND PROGRAM
HK1192409A2 (en) Timepiece
GB201307989D0 (en) Novel combinations and use
GB201320992D0 (en) Complex and uses thereof
HK1203233A1 (en) Watchcase
ZA201601880B (en) Hetero-transglycosylase and uses thereof
AU353958S (en) Watchcase
EP2961107A4 (en) SWITCH AND PROGRAM
PL2881006T3 (pl) Jednostka bagażowa ze skorupą dolną i skorupą górną
GB201301393D0 (en) Kiddibidet and pottibidet
HUP1300040A2 (en) Gluten-free flourmix
AU352813S (en) Wristwatch