SG11201503318PA - Method for microcontact embossing - Google Patents
Method for microcontact embossingInfo
- Publication number
- SG11201503318PA SG11201503318PA SG11201503318PA SG11201503318PA SG11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA SG 11201503318P A SG11201503318P A SG 11201503318PA
- Authority
- SG
- Singapore
- Prior art keywords
- microcontact
- embossing
- microcontact embossing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012112030.7A DE102012112030A1 (de) | 2012-12-10 | 2012-12-10 | Verfahren zum Mikrokontaktprägen |
PCT/EP2013/075562 WO2014090661A1 (fr) | 2012-12-10 | 2013-12-04 | Procédé de poinçonnage de microcontacts |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201503318PA true SG11201503318PA (en) | 2015-06-29 |
Family
ID=49709685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201503318PA SG11201503318PA (en) | 2012-12-10 | 2013-12-04 | Method for microcontact embossing |
Country Status (8)
Country | Link |
---|---|
US (1) | US9323144B2 (fr) |
EP (1) | EP2888629B1 (fr) |
JP (1) | JP2016511931A (fr) |
KR (1) | KR101759810B1 (fr) |
CN (2) | CN104823107A (fr) |
DE (1) | DE102012112030A1 (fr) |
SG (1) | SG11201503318PA (fr) |
WO (1) | WO2014090661A1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9550353B2 (en) * | 2014-07-20 | 2017-01-24 | X-Celeprint Limited | Apparatus and methods for micro-transfer-printing |
WO2016070869A2 (fr) * | 2014-11-03 | 2016-05-12 | Universität Osnabrück | Dispositif pour la mise en oeuvre d'un procédé de nanoimpression capillaire, procédé de réalisation d'une nanoimpression capillaire faisant appel audit dispositif, produits pouvant être obtenus par ledit procédé et utilisation dudit dispositif |
CN104356740B (zh) * | 2014-11-05 | 2017-05-17 | 广西师范学院 | 利用水溶性卟啉铁配合物进行微接触印刷的方法 |
CN107111226B (zh) * | 2014-12-22 | 2021-04-13 | 皇家飞利浦有限公司 | 图案化印模制造方法、图案化印模和压印方法 |
US20180169907A1 (en) * | 2015-06-25 | 2018-06-21 | Ev Group E. Thallner Gmbh | Method for producing of structures on a substrate surface |
CN106486209A (zh) * | 2015-08-31 | 2017-03-08 | 中国科学院宁波材料技术与工程研究所 | 一种图案化3d石墨烯导电薄膜及其绿色制备方法和应用 |
CN105319840A (zh) * | 2015-11-23 | 2016-02-10 | 南通天鸿镭射科技有限公司 | 利用复制技术制作紫外光固化无缝成型辊轮的装置及方法 |
KR102331438B1 (ko) * | 2016-04-06 | 2021-11-26 | 코닌클리케 필립스 엔.브이. | 임프린트 리소그래피 스탬프, 이의 제조 방법 및 사용 방법 |
CN106542494B (zh) * | 2016-09-26 | 2017-12-26 | 西北工业大学 | 一种用于制备多层不等高微纳结构的方法 |
JP6854733B2 (ja) * | 2017-08-17 | 2021-04-07 | 株式会社ジェイエスピー | 樹脂シート |
US20230375759A1 (en) * | 2022-05-18 | 2023-11-23 | GE Precision Healthcare LLC | Aligned and stacked high-aspect ratio metallized structures |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL261937A (fr) * | 1960-03-16 | 1900-01-01 | ||
US3678848A (en) * | 1969-08-25 | 1972-07-25 | Weber Marking Systems Inc | Inking pad and use thereof |
US3709647A (en) * | 1970-10-21 | 1973-01-09 | Clear Pack Co | Apparatus for forming an embossed thermoplastic sheet |
JPS5436617B2 (fr) * | 1973-02-07 | 1979-11-10 | ||
US3971315A (en) * | 1974-08-12 | 1976-07-27 | Porelon, Inc. | Macroporous microporous marking structure |
JPH10278217A (ja) * | 1997-04-09 | 1998-10-20 | Asahi Optical Co Ltd | 印刷版とその製造方法及びその印刷版を用いた印刷装置 |
US6276272B1 (en) * | 1996-10-01 | 2001-08-21 | Brother Kogyo Kabushiki Kaisha | Stamp plate producing apparatus for producing stamp plate used in a stamp device |
US6048623A (en) * | 1996-12-18 | 2000-04-11 | Kimberly-Clark Worldwide, Inc. | Method of contact printing on gold coated films |
DE19949993C1 (de) * | 1999-10-15 | 2001-05-03 | Peter Barth | Verfahren zur Oberflächenstrukturierung |
WO2001059523A1 (fr) * | 2000-02-07 | 2001-08-16 | Koninklijke Philips Electronics N.V. | Matrice utilisee dans un processus lithographique, procede de fabrication d'une matrice et procede de fabrication d'une couche a motifs sur un substrat |
WO2002042844A2 (fr) * | 2000-11-22 | 2002-05-30 | Koninklijke Philips Electronics N.V. | Tampon, procede, et appareil |
US6817293B2 (en) | 2001-03-28 | 2004-11-16 | Dainippon Printing Co., Ltd. | Patterning method with micro-contact printing and its printed product |
JP5055672B2 (ja) * | 2001-07-31 | 2012-10-24 | 大日本印刷株式会社 | 薄膜パターン形成用スタンプ |
US20030127002A1 (en) * | 2002-01-04 | 2003-07-10 | Hougham Gareth Geoffrey | Multilayer architechture for microcontact printing stamps |
GB0326904D0 (en) * | 2003-11-19 | 2003-12-24 | Koninkl Philips Electronics Nv | Formation of self-assembled monolayers |
CN101043953A (zh) * | 2004-10-22 | 2007-09-26 | 皇家飞利浦电子股份有限公司 | 带有压力控制的辊子微接触印刷机 |
ES2381621T3 (es) * | 2006-11-01 | 2012-05-30 | Koninklijke Philips Electronics N.V. | Método de sobreimpresión para formar una capa en relieve y uso de la misma como máscara de grabado |
US20080230773A1 (en) | 2007-03-20 | 2008-09-25 | Nano Terra Inc. | Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes |
US7959975B2 (en) | 2007-04-18 | 2011-06-14 | Micron Technology, Inc. | Methods of patterning a substrate |
US9003970B2 (en) * | 2008-06-30 | 2015-04-14 | 3M Innovative Properties Company | Solvent assisted method of microcontact printing |
JP2010171281A (ja) * | 2009-01-23 | 2010-08-05 | Jsr Corp | インプリント方法 |
WO2010115027A1 (fr) * | 2009-04-01 | 2010-10-07 | Nano Terra Inc. | Procédés de configuration de substrats à l'aide de résists polymères imprimés par microcontact et articles préparés à partir de ceux-ci |
CN102666103B (zh) * | 2009-12-22 | 2016-04-06 | 3M创新有限公司 | 用于使用增压辊的微接触印刷的装置及方法 |
-
2012
- 2012-12-10 DE DE102012112030.7A patent/DE102012112030A1/de not_active Ceased
-
2013
- 2013-12-04 KR KR1020157014532A patent/KR101759810B1/ko active IP Right Grant
- 2013-12-04 SG SG11201503318PA patent/SG11201503318PA/en unknown
- 2013-12-04 WO PCT/EP2013/075562 patent/WO2014090661A1/fr active Application Filing
- 2013-12-04 EP EP13799316.8A patent/EP2888629B1/fr active Active
- 2013-12-04 CN CN201380064460.4A patent/CN104823107A/zh active Pending
- 2013-12-04 CN CN201910665524.5A patent/CN110376844A/zh active Pending
- 2013-12-04 US US14/439,860 patent/US9323144B2/en active Active
- 2013-12-04 JP JP2015546946A patent/JP2016511931A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN110376844A (zh) | 2019-10-25 |
JP2016511931A (ja) | 2016-04-21 |
EP2888629A1 (fr) | 2015-07-01 |
US9323144B2 (en) | 2016-04-26 |
KR101759810B1 (ko) | 2017-07-19 |
EP2888629B1 (fr) | 2016-03-02 |
US20150293442A1 (en) | 2015-10-15 |
DE102012112030A1 (de) | 2014-06-12 |
WO2014090661A1 (fr) | 2014-06-19 |
CN104823107A (zh) | 2015-08-05 |
KR20150092139A (ko) | 2015-08-12 |
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