SG11201502940SA - Wire saw apparatus, and cut-machining method - Google Patents

Wire saw apparatus, and cut-machining method

Info

Publication number
SG11201502940SA
SG11201502940SA SG11201502940SA SG11201502940SA SG11201502940SA SG 11201502940S A SG11201502940S A SG 11201502940SA SG 11201502940S A SG11201502940S A SG 11201502940SA SG 11201502940S A SG11201502940S A SG 11201502940SA SG 11201502940S A SG11201502940S A SG 11201502940SA
Authority
SG
Singapore
Prior art keywords
cut
wire saw
machining method
saw apparatus
machining
Prior art date
Application number
SG11201502940SA
Inventor
Shoji Imakurusu
Toshimitsu Iwai
Jun Ohya
Masaru Fukuman
Original Assignee
Toyo Advanced Tech Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Advanced Tech Co filed Critical Toyo Advanced Tech Co
Publication of SG11201502940SA publication Critical patent/SG11201502940SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201502940SA 2012-10-15 2012-10-15 Wire saw apparatus, and cut-machining method SG11201502940SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/006589 WO2014061053A1 (en) 2012-10-15 2012-10-15 Wire saw apparatus, and cut-machining method

Publications (1)

Publication Number Publication Date
SG11201502940SA true SG11201502940SA (en) 2015-06-29

Family

ID=50487653

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502940SA SG11201502940SA (en) 2012-10-15 2012-10-15 Wire saw apparatus, and cut-machining method

Country Status (6)

Country Link
US (1) US9969017B2 (en)
KR (1) KR101990664B1 (en)
CN (1) CN104781045B (en)
MY (1) MY183892A (en)
SG (1) SG11201502940SA (en)
WO (1) WO2014061053A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015147293A (en) * 2014-01-09 2015-08-20 株式会社コベルコ科研 Method for cutting workpiece
JP6402700B2 (en) * 2015-10-20 2018-10-10 信越半導体株式会社 Work cutting method and wire saw
CN106863630B (en) * 2017-01-22 2019-09-27 江阴市展照科技有限公司 A kind of silicon slice linear cutter
TWI713832B (en) * 2017-04-28 2020-12-21 友達晶材股份有限公司 Wafer slicing machine and its take-up and unwinding device and wafer slicing method
CN108943462A (en) * 2018-08-07 2018-12-07 无锡斯达新能源科技股份有限公司 It is multi-thread to wave silicon rod cutting machine
FR3086194A1 (en) * 2018-09-25 2020-03-27 Luneau Technology Operations OPTICAL GLASS MACHINE HAVING AT LEAST ONE CUTTING WIRE, AND METHOD FOR MACHINING AN OPTICAL GLASS THEREOF
CN115816664A (en) * 2022-12-28 2023-03-21 泉州市品河精密科技有限公司 Stone cutting method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0635107B2 (en) 1987-12-26 1994-05-11 株式会社タカトリハイテック Wire saw
JP3692703B2 (en) 1997-03-28 2005-09-07 三菱住友シリコン株式会社 Wire saw and ingot cutting method
JPH10337725A (en) 1997-06-05 1998-12-22 Nitomatsuku Ii R Kk Method for cutting hard brittle material and semiconductor silicon wafer
JPH1110510A (en) * 1997-06-19 1999-01-19 Nippei Toyama Corp Wire saw device and method for cutting workpiece
US6279564B1 (en) * 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JPH1170457A (en) * 1997-08-29 1999-03-16 Tokyo Seimitsu Co Ltd Fixed abrasive grain wire saw and workpiece cutting method therewith
JPH11309660A (en) 1998-04-30 1999-11-09 Shin Etsu Chem Co Ltd Wire type cutter and method of cutting work
JP4252193B2 (en) 2000-05-24 2009-04-08 コバレントマテリアル株式会社 Wire saw and cutting method using the same
CH697024A5 (en) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Wire sawing device.
JP4803717B2 (en) * 2005-12-13 2011-10-26 株式会社タカトリ Wire saw
JP2007276097A (en) * 2006-04-03 2007-10-25 Takatori Corp Wire saw
JP5085923B2 (en) 2006-12-11 2012-11-28 旭ダイヤモンド工業株式会社 Wafer and manufacturing method thereof
JP2010023145A (en) 2008-07-16 2010-02-04 Asahi Diamond Industrial Co Ltd Cutter and cutting method
JP5441057B2 (en) 2009-11-26 2014-03-12 株式会社タカトリ Wire saw
CN102049821A (en) 2010-12-15 2011-05-11 湖南宇晶机器实业有限公司 Cutting rollers of multi-wire cutting machine
CN202114341U (en) 2011-05-16 2012-01-18 上海外高桥造船有限公司 Cutting platform
CN102717446B (en) 2012-07-13 2014-10-15 上海日进机床有限公司 Four-roller sapphire slicing machine

Also Published As

Publication number Publication date
KR20150064214A (en) 2015-06-10
CN104781045B (en) 2018-05-04
WO2014061053A1 (en) 2014-04-24
KR101990664B1 (en) 2019-06-18
MY183892A (en) 2021-03-17
US20150290728A1 (en) 2015-10-15
CN104781045A (en) 2015-07-15
US9969017B2 (en) 2018-05-15

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