SG11201500700PA - Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods - Google Patents

Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods

Info

Publication number
SG11201500700PA
SG11201500700PA SG11201500700PA SG11201500700PA SG11201500700PA SG 11201500700P A SG11201500700P A SG 11201500700PA SG 11201500700P A SG11201500700P A SG 11201500700PA SG 11201500700P A SG11201500700P A SG 11201500700PA SG 11201500700P A SG11201500700P A SG 11201500700PA
Authority
SG
Singapore
Prior art keywords
apparatuses
rail
channel
systems
methods
Prior art date
Application number
SG11201500700PA
Other languages
English (en)
Inventor
Niall T Davidson
Original Assignee
Adc Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Technologies Inc filed Critical Adc Technologies Inc
Publication of SG11201500700PA publication Critical patent/SG11201500700PA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG11201500700PA 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods SG11201500700PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261684856P 2012-08-20 2012-08-20
PCT/IB2013/001789 WO2014030046A1 (en) 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods

Publications (1)

Publication Number Publication Date
SG11201500700PA true SG11201500700PA (en) 2015-04-29

Family

ID=50149503

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201500700PA SG11201500700PA (en) 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods
SG10201705879SA SG10201705879SA (en) 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of acooling rack enclosure, and related components, systems, and methods

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201705879SA SG10201705879SA (en) 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of acooling rack enclosure, and related components, systems, and methods

Country Status (12)

Country Link
US (1) US20150208551A1 (zh)
EP (1) EP2885957B1 (zh)
JP (2) JP6587540B2 (zh)
KR (1) KR20150045441A (zh)
CN (2) CN104685985A (zh)
CA (1) CA2886657C (zh)
HK (1) HK1209259A1 (zh)
IL (1) IL237127B (zh)
IN (1) IN2015DN02231A (zh)
MX (1) MX2015001987A (zh)
SG (2) SG11201500700PA (zh)
WO (1) WO2014030046A1 (zh)

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US8934245B2 (en) * 2009-09-29 2015-01-13 Nec Corporation Heat conveying structure for electronic device
WO2016004528A1 (en) * 2014-07-08 2016-01-14 Adc Technologies Inc. Robust redundant-capable leak-resistant cooled enclosure wall
US10365046B2 (en) * 2014-07-18 2019-07-30 Intel Corporation Server thermal management with heat pipes
US20170311485A1 (en) * 2014-09-26 2017-10-26 Nec Corporation Cooling device and method of manufacturing the same
US10356957B2 (en) * 2014-10-31 2019-07-16 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
US10431926B2 (en) 2015-04-14 2019-10-01 Hewlett Packard Enterprise Development Lp Magnetic fluid connector
WO2018005120A1 (en) * 2016-06-15 2018-01-04 Tango Tech, Inc. Multiple server architecture, server module, and cooler module systems and architecture
CA3070742A1 (en) * 2016-07-29 2018-02-01 Adc Technologies Inc. Fanless rail cooled electronics apparatus
US10809774B2 (en) 2016-08-12 2020-10-20 Hypertechnologie Ciara Inc. Fluid flow tunnelling in a non-metallic computer chassis
JP2018074100A (ja) * 2016-11-04 2018-05-10 富士通株式会社 ラックマウント型情報処理装置
WO2019178674A1 (en) * 2018-03-19 2019-09-26 Adc Technologies Inc. Improved fanless rail cooled electronic apparatus
US11147191B2 (en) * 2018-10-29 2021-10-12 Quanta Computer Inc. Liquid cooling with outdoor chiller rack system
DK3661339T3 (da) * 2018-11-30 2022-05-09 Ovh Stativ indrettet til modtagelse af en komponent, og system der inkluderer stativet og komponenten
US11856724B2 (en) 2018-11-30 2023-12-26 Ovh System comprising a rack, with support members and components insertable in the rack and connectable via liquid connectors
EP3670704A1 (en) * 2018-12-20 2020-06-24 Hymeth ApS Rack-mount box for a heat-emitting device
DK3697183T3 (da) 2019-02-13 2021-05-17 Ovh Stativ indrettet til modtagelse af en komponent, system der inkluderer stativet og komponenten og fremgangsmåde til forsyning af strøm til en komponent monteret i et stativ
WO2021032229A1 (de) * 2019-08-19 2021-02-25 Lea Kelbsch Gehäuse für wärme abgebende bauteile
JP7266499B2 (ja) * 2019-09-10 2023-04-28 株式会社ディスコ 固定板
DK3829278T3 (da) * 2019-11-29 2022-06-20 Ovh Køleanordning til en server som kan monteres i et serverstativ
CN113532155B (zh) * 2020-04-03 2023-05-23 浙江大学 一种燃料电池温控系统高效换热器及其加工装置
CN112223978A (zh) * 2020-10-10 2021-01-15 衡阳智电客车有限责任公司 一种便于安装的电动机场摆渡车用散热器
US20220287206A1 (en) * 2021-03-04 2022-09-08 TE Connectivity Services Gmbh Heat exchange assembly for an electrical device
DE102021208175A1 (de) 2021-07-29 2023-02-02 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Aufnahme austauschbarer Elektronikbaugruppen eines Kraftfahrzeugs
CN115904014A (zh) * 2021-08-05 2023-04-04 富联精密电子(天津)有限公司 液冷结构及服务器

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US6839235B2 (en) * 2002-12-19 2005-01-04 Dy 4 Systems Inc. Embedded heat pipe for a conduction cooled circuit card assembly
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Also Published As

Publication number Publication date
HK1209259A1 (zh) 2016-03-24
IL237127B (en) 2020-05-31
EP2885957B1 (en) 2019-12-25
WO2014030046A1 (en) 2014-02-27
MX2015001987A (es) 2015-09-29
CA2886657C (en) 2021-04-13
JP6587540B2 (ja) 2019-10-09
EP2885957A1 (en) 2015-06-24
CA2886657A1 (en) 2014-02-27
CN109195411A (zh) 2019-01-11
JP2015527673A (ja) 2015-09-17
EP2885957A4 (en) 2016-06-08
JP2018110258A (ja) 2018-07-12
KR20150045441A (ko) 2015-04-28
US20150208551A1 (en) 2015-07-23
IN2015DN02231A (zh) 2015-08-21
CN104685985A (zh) 2015-06-03
SG10201705879SA (en) 2017-08-30
IL237127A0 (en) 2015-03-31

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