MX2015001987A - Aparatos para transmision de calor entre un rail de un equipo montado en bastidor y un canal de una caja de bastidor de enfriamiento, y componentes, sistemas y procedimientos relacionados. - Google Patents

Aparatos para transmision de calor entre un rail de un equipo montado en bastidor y un canal de una caja de bastidor de enfriamiento, y componentes, sistemas y procedimientos relacionados.

Info

Publication number
MX2015001987A
MX2015001987A MX2015001987A MX2015001987A MX2015001987A MX 2015001987 A MX2015001987 A MX 2015001987A MX 2015001987 A MX2015001987 A MX 2015001987A MX 2015001987 A MX2015001987 A MX 2015001987A MX 2015001987 A MX2015001987 A MX 2015001987A
Authority
MX
Mexico
Prior art keywords
channel
rack
enclosure
rail
cooling
Prior art date
Application number
MX2015001987A
Other languages
English (en)
Inventor
Niall T Davidson
Original Assignee
Adc Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Technologies Inc filed Critical Adc Technologies Inc
Publication of MX2015001987A publication Critical patent/MX2015001987A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un equipo montable en bastidor y una caja de bastidor de enfriamiento complementaria están dispuestos para trabajar conjuntamente para transmitir calor desde componentes de generación de calor del equipo montable en bastidor hasta la caja de bastidor de enfriamiento. El calor procedente de los componentes es transferido a la caja de bastidor de enfriamiento por medio de una superficie enfriable dispuesta en un canal de la caja de bastidor de enfriamiento. El equipo montable en bastidor incluye un raíl adaptado para ser recibido por el canal en la caja de bastidor de enfriamiento. Una superficie térmicamente conductora sobre el raíl entra en contacto con la superficie enfriable en el interior del canal y transfiere calor desde el equipo montable en bastidor hasta la caja de bastidor de enfriamiento.
MX2015001987A 2012-08-20 2013-08-19 Aparatos para transmision de calor entre un rail de un equipo montado en bastidor y un canal de una caja de bastidor de enfriamiento, y componentes, sistemas y procedimientos relacionados. MX2015001987A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261684856P 2012-08-20 2012-08-20
PCT/IB2013/001789 WO2014030046A1 (en) 2012-08-20 2013-08-19 Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods

Publications (1)

Publication Number Publication Date
MX2015001987A true MX2015001987A (es) 2015-09-29

Family

ID=50149503

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015001987A MX2015001987A (es) 2012-08-20 2013-08-19 Aparatos para transmision de calor entre un rail de un equipo montado en bastidor y un canal de una caja de bastidor de enfriamiento, y componentes, sistemas y procedimientos relacionados.

Country Status (12)

Country Link
US (1) US20150208551A1 (es)
EP (1) EP2885957B1 (es)
JP (2) JP6587540B2 (es)
KR (1) KR20150045441A (es)
CN (2) CN109195411A (es)
CA (1) CA2886657C (es)
HK (1) HK1209259A1 (es)
IL (1) IL237127B (es)
IN (1) IN2015DN02231A (es)
MX (1) MX2015001987A (es)
SG (2) SG11201500700PA (es)
WO (1) WO2014030046A1 (es)

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JP2017522677A (ja) * 2014-07-08 2017-08-10 エーディーシー テクノロジーズ インコーポレイテッドＡｄｃ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｉｎｃ． 堅牢で冗長可能な耐漏洩性冷却筐体壁
US10365046B2 (en) * 2014-07-18 2019-07-30 Intel Corporation Server thermal management with heat pipes
JPWO2016047099A1 (ja) * 2014-09-26 2017-07-13 日本電気株式会社 冷却装置およびその製造方法
WO2016069010A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
US10431926B2 (en) 2015-04-14 2019-10-01 Hewlett Packard Enterprise Development Lp Magnetic fluid connector
WO2018005120A1 (en) * 2016-06-15 2018-01-04 Tango Tech, Inc. Multiple server architecture, server module, and cooler module systems and architecture
WO2018018163A2 (en) * 2016-07-29 2018-02-01 Adc Technologies Inc. Fanless rail cooled electronics apparatus
CA3030592C (en) 2016-08-12 2021-09-07 Hypertechnologie Ciara Inc Fluid flow tunnelling in a non-metallic computer chassis
JP2018074100A (ja) * 2016-11-04 2018-05-10 富士通株式会社 ラックマウント型情報処理装置
WO2019178674A1 (en) * 2018-03-19 2019-09-26 Adc Technologies Inc. Improved fanless rail cooled electronic apparatus
US11147191B2 (en) * 2018-10-29 2021-10-12 Quanta Computer Inc. Liquid cooling with outdoor chiller rack system
US11856724B2 (en) 2018-11-30 2023-12-26 Ovh System comprising a rack, with support members and components insertable in the rack and connectable via liquid connectors
EP3661339B1 (en) 2018-11-30 2022-04-13 Ovh Rack adapted for receiving a component and system including the rack and the component
EP3670704A1 (en) * 2018-12-20 2020-06-24 Hymeth ApS Rack-mount box for a heat-emitting device
PL3697183T3 (pl) 2019-02-13 2021-09-06 Ovh Szafa przystosowana do umieszczania komponentu, system zawierający szafę i komponent oraz sposób dostarczania zasilania do komponentu zamontowanego w szafie
WO2021032229A1 (de) * 2019-08-19 2021-02-25 Lea Kelbsch Gehäuse für wärme abgebende bauteile
JP7266499B2 (ja) * 2019-09-10 2023-04-28 株式会社ディスコ 固定板
EP3829278B1 (en) 2019-11-29 2022-05-18 Ovh Cooling arrangement for a server mountable in a server rack
CN113532155B (zh) * 2020-04-03 2023-05-23 浙江大学 一种燃料电池温控系统高效换热器及其加工装置
CN112223978A (zh) * 2020-10-10 2021-01-15 衡阳智电客车有限责任公司 一种便于安装的电动机场摆渡车用散热器
US20220287206A1 (en) * 2021-03-04 2022-09-08 TE Connectivity Services Gmbh Heat exchange assembly for an electrical device
DE102021208175A1 (de) 2021-07-29 2023-02-02 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Aufnahme austauschbarer Elektronikbaugruppen eines Kraftfahrzeugs
CN115904014A (zh) * 2021-08-05 2023-04-04 富联精密电子(天津)有限公司 液冷结构及服务器

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Also Published As

Publication number Publication date
CA2886657C (en) 2021-04-13
CA2886657A1 (en) 2014-02-27
SG10201705879SA (en) 2017-08-30
JP6587540B2 (ja) 2019-10-09
IN2015DN02231A (es) 2015-08-21
KR20150045441A (ko) 2015-04-28
JP2015527673A (ja) 2015-09-17
CN104685985A (zh) 2015-06-03
EP2885957B1 (en) 2019-12-25
CN109195411A (zh) 2019-01-11
IL237127B (en) 2020-05-31
SG11201500700PA (en) 2015-04-29
US20150208551A1 (en) 2015-07-23
JP2018110258A (ja) 2018-07-12
EP2885957A4 (en) 2016-06-08
EP2885957A1 (en) 2015-06-24
IL237127A0 (en) 2015-03-31
WO2014030046A1 (en) 2014-02-27
HK1209259A1 (en) 2016-03-24

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