SG11201500378XA - Apparatus and methods for handling workpieces of different sizes - Google Patents
Apparatus and methods for handling workpieces of different sizesInfo
- Publication number
- SG11201500378XA SG11201500378XA SG11201500378XA SG11201500378XA SG11201500378XA SG 11201500378X A SG11201500378X A SG 11201500378XA SG 11201500378X A SG11201500378X A SG 11201500378XA SG 11201500378X A SG11201500378X A SG 11201500378XA SG 11201500378X A SG11201500378X A SG 11201500378XA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- different sizes
- handling workpieces
- workpieces
- handling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/567,507 US9385017B2 (en) | 2012-08-06 | 2012-08-06 | Apparatus and methods for handling workpieces of different sizes |
PCT/US2013/053398 WO2014025637A1 (en) | 2012-08-06 | 2013-08-02 | Apparatus and methods for handling workpieces of different sizes |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201500378XA true SG11201500378XA (en) | 2015-03-30 |
Family
ID=49034173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201500378XA SG11201500378XA (en) | 2012-08-06 | 2013-08-02 | Apparatus and methods for handling workpieces of different sizes |
Country Status (7)
Country | Link |
---|---|
US (1) | US9385017B2 (en) |
JP (1) | JP6321646B2 (en) |
KR (1) | KR102168255B1 (en) |
CN (1) | CN104603925B (en) |
SG (1) | SG11201500378XA (en) |
TW (1) | TWI613755B (en) |
WO (1) | WO2014025637A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017069238A1 (en) * | 2015-10-21 | 2017-04-27 | 住友大阪セメント株式会社 | Electrostatic chuck device |
US10438833B2 (en) * | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
LT3422396T (en) * | 2017-06-28 | 2021-09-10 | Meyer Burger (Germany) Gmbh | Device for transport of a substrate, treatment device with a holder plate adapted to a substrate holder of such a device and a method for processing a substrate using such a device for transporting a substrate and treatment plant |
US10504762B2 (en) * | 2018-02-06 | 2019-12-10 | Applied Materials, Inc. | Bridging front opening unified pod (FOUP) |
US20190259635A1 (en) * | 2018-02-17 | 2019-08-22 | Applied Materials, Inc. | Process kit for processing reduced sized substrates |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697270A (en) * | 1992-09-11 | 1994-04-08 | Sony Corp | Wafer mounting table |
JPH0733973A (en) | 1993-07-16 | 1995-02-03 | Mitsubishi Chem Corp | Thermoplastic resin composition |
JP2601180Y2 (en) * | 1993-12-06 | 1999-11-08 | 日新電機株式会社 | Substrate holding device |
TW254030B (en) | 1994-03-18 | 1995-08-11 | Anelva Corp | Mechanic escape mechanism for substrate |
US5708556A (en) * | 1995-07-10 | 1998-01-13 | Watkins Johnson Company | Electrostatic chuck assembly |
US5823416A (en) | 1995-07-28 | 1998-10-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus |
US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
JP3201302B2 (en) | 1997-02-10 | 2001-08-20 | 松下電器産業株式会社 | Plasma cleaning equipment for substrates |
JPH10233432A (en) * | 1997-02-20 | 1998-09-02 | Hitachi Ltd | Processing device |
KR100596822B1 (en) | 1999-03-30 | 2006-07-03 | 동경 엘렉트론 주식회사 | Plasma processing apparatus, its repair method, and its construction method |
US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
JP2001077184A (en) * | 1999-08-31 | 2001-03-23 | Ulvac Japan Ltd | Electrostatic attraction device and vacuum processing device using the attraction device |
JP2002009133A (en) | 2000-06-26 | 2002-01-11 | Canon Inc | Substrate conveying apparatus |
WO2002004887A1 (en) | 2000-07-08 | 2002-01-17 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6902622B2 (en) * | 2001-04-12 | 2005-06-07 | Mattson Technology, Inc. | Systems and methods for epitaxially depositing films on a semiconductor substrate |
JP4520677B2 (en) * | 2001-08-31 | 2010-08-11 | キヤノンアネルバ株式会社 | Multi-chamber sputtering equipment |
JP3948325B2 (en) | 2002-04-02 | 2007-07-25 | 松下電器産業株式会社 | Film substrate processing method |
US7013834B2 (en) * | 2002-04-19 | 2006-03-21 | Nordson Corporation | Plasma treatment system |
US6846380B2 (en) | 2002-06-13 | 2005-01-25 | The Boc Group, Inc. | Substrate processing apparatus and related systems and methods |
JP4298523B2 (en) * | 2004-01-09 | 2009-07-22 | 株式会社ディスコ | Etching device |
JP2005223106A (en) * | 2004-02-05 | 2005-08-18 | Okamoto Machine Tool Works Ltd | Temporary placement base for positioning |
US7845309B2 (en) | 2004-07-13 | 2010-12-07 | Nordson Corporation | Ultra high speed uniform plasma processing system |
US20060090703A1 (en) | 2004-11-01 | 2006-05-04 | Tokyo Electron Limited | Substrate processing method, system and program |
SG174093A1 (en) * | 2006-08-22 | 2011-09-29 | Nordson Corp | Apparatus and methods for handling workpieces in a processing system |
US20080296261A1 (en) * | 2007-06-01 | 2008-12-04 | Nordson Corporation | Apparatus and methods for improving treatment uniformity in a plasma process |
JP2009253115A (en) * | 2008-04-08 | 2009-10-29 | Sumco Corp | Wafer stage |
KR20100019039A (en) * | 2008-08-08 | 2010-02-18 | 에이피시스템 주식회사 | Apparatus for bonding substrates of which the size is various |
US8034723B2 (en) * | 2009-12-25 | 2011-10-11 | Tokyo Electron Limited | Film deposition apparatus and film deposition method |
-
2012
- 2012-08-06 US US13/567,507 patent/US9385017B2/en active Active
-
2013
- 2013-08-02 JP JP2015526592A patent/JP6321646B2/en not_active Expired - Fee Related
- 2013-08-02 CN CN201380041863.7A patent/CN104603925B/en active Active
- 2013-08-02 KR KR1020157002518A patent/KR102168255B1/en active IP Right Grant
- 2013-08-02 SG SG11201500378XA patent/SG11201500378XA/en unknown
- 2013-08-02 WO PCT/US2013/053398 patent/WO2014025637A1/en active Application Filing
- 2013-08-06 TW TW102128150A patent/TWI613755B/en active
Also Published As
Publication number | Publication date |
---|---|
CN104603925A (en) | 2015-05-06 |
CN104603925B (en) | 2017-04-26 |
JP2015532001A (en) | 2015-11-05 |
TW201411772A (en) | 2014-03-16 |
JP6321646B2 (en) | 2018-05-09 |
KR102168255B1 (en) | 2020-10-22 |
WO2014025637A1 (en) | 2014-02-13 |
KR20150040888A (en) | 2015-04-15 |
TWI613755B (en) | 2018-02-01 |
US9385017B2 (en) | 2016-07-05 |
US20140034610A1 (en) | 2014-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB201218594D0 (en) | Apparatus for and method of handling workpieces | |
GB2509822B (en) | Method of and apparatus for processing graphics | |
IL242155B (en) | Method and apparatus for interrupt handling | |
IL234010A0 (en) | Method and apparatus for procurement aggregation | |
GB2503411B (en) | Sorting apparatus for arthropods and method of use thereof | |
EP2854160A4 (en) | Substrate processing apparatus and substrate processing method | |
EP2547491A4 (en) | Apparatus and method for gripping and releasing objects | |
GB201505403D0 (en) | Method and apparatus for configurable microplanning | |
SG2013064423A (en) | Machining process and apparatus for machining | |
GB2516772B (en) | Drilling-Pipe Handling Apparatus And Method | |
EP2748633A4 (en) | Method and apparatus for position determination | |
PL2906490T3 (en) | Method and apparatus for handling glass sheets of extreme large dimensions | |
GB2504999B8 (en) | Apparatus and method for object positioning | |
GB201103450D0 (en) | Apparatus and method of manipulation of articles | |
EP2903220A4 (en) | Method and apparatus for processing packet | |
EP2885709A4 (en) | Method and apparatus for implementing extended application | |
GB2528223B (en) | Methods and apparatus for handling of sensor capsules | |
GB201213961D0 (en) | Method and apparatus for forming workpiece components | |
SG11201500378XA (en) | Apparatus and methods for handling workpieces of different sizes | |
EP2786238A4 (en) | Method and device for processing tabbed-page | |
EP2855299A4 (en) | Method and apparatus for handling cylindrical objects | |
EP2936765A4 (en) | Method and apparatus for handling messages | |
EP2867760A4 (en) | Method and apparatus for task chaining | |
EP2876612A4 (en) | Banknote handling apparatus and banknote handling method | |
ZA201405701B (en) | Method and apparatus for gripping |