JP2005223106A - Temporary placement base for positioning - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temporary placement base for positioning which can perform accurate alignment of circular semiconductor substrates, having different diameters. <P>SOLUTION: The temporary placement base 1 comprises a cylindrical sidewall 2, whose inside diameter gradually increases from a bottom part 3 toward an upper opening edge 4, and the hollowed-out bottom part 3. The cylindrical sidewall 2 has a small bottom shelf 5, whose outside diameter is a diameter of a semiconductor substrate having a smaller diameter, and a large bottom shelf 6 whose inside diameter is larger than the diameter of the semiconductor substrate, having a smaller diameter and whose outside diameter is a diameter of a semiconductor substrate having a large diameter. A wall line, connecting the outer circumference 5a of the small bottom shelf and the inner circumference 6b of the large bottom shelf has a slope α and a wall line connecting the outer circumference 6a of the large bottom shelf 6, and the inner circumference 4b of the upper opening edge has slopes β, and α and β have slopes of 60° to 70°. A fifth to a quarter of the cylindrical sidewall 2 is cut out from up to down, forming an entrance 7 having such a width as to allow the arm of a transfer robot for supporting a suction pad which can suck the surface of the semiconductor substrate to move in the vertical directions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a temporary positioning table that enables alignment of circular semiconductor substrates having different diameters. This positioning temporary placement table 1) sucks the semiconductor substrate stored in the storage cassette onto the suction pad of the transfer robot, transports it onto the positioning temporary placement table, releases the semiconductor substrate from the suction pad, and tilts the temporary placement table. The outer peripheral edge of the semiconductor substrate is slid along the inner wall for positioning (alignment), and then the semiconductor substrate whose alignment is determined is sucked to the suction pad of the same or different transfer robot and transferred onto the vacuum chuck of the polishing apparatus. 2) The semiconductor substrate that has been ground or polished is transferred to the cleaning device with the transfer pad, and the cleaned semiconductor substrate is sucked to the suction pad of the transfer robot, transferred to the temporary positioning table, and cleaned from the suction pad. The semiconductor substrate is released, and the outer peripheral edge of the semiconductor substrate is slid along the inclined inner wall of the temporary table, and then positioned. When a semiconductor substrate that has been aligned is adsorbed to a suction pad of a different transfer robot, and the semiconductor substrate is stored in a storage cassette, or 3) a semiconductor substrate processed in a certain processing process (for example, a grinding process) Adsorbed to the suction pad, transported to the positioning temporary mounting table, released the semiconductor substrate from the suction pad, and positioned by sliding the outer peripheral edge of the semiconductor substrate along the inclined inner wall of the temporary mounting table, and then the same or different This is used when the semiconductor substrate whose alignment is fixed is sucked to the suction pad of the transfer robot and transferred to the next processing step (for example, polishing step).

  As a temporary mounting table for aligning a semiconductor substrate used attached to the polishing apparatus, a through portion 61a is provided at the center on the upper side of a fluid supply pipe 60 standing on the base of the polishing apparatus as shown in FIG. A disc-like base 61 having an annular protrusion 61 b is fitted on the upper surface, the upper face of the annular protrusion 61 b is covered with a flexible film 62, and the flexible film 62 is attached to the disc-like base 61 with a ring-shaped fixture 64. By fixing, a fluid chamber 63 is formed by the upper side of the fluid supply pipe 60, the disc-like base 61 and the flexible film 62, and the outer edge 61c of the disc-like base 61 is higher than the height of the annular protrusion 61b. An outer annular member 65 having substrate mounting support portions 65c and 65c having a plurality of inclined annular side wall portions 65a and a plurality of inclined portions 65b provided inside the annular side wall portion 65a and having water injection holes 65d is fixed. , The outer annular member 65 The flexible membrane 62 and the temporary placing base 40 forming the water reservoir 66 has been proposed (e.g., see Patent Document 1.).

  The semiconductor substrate sucked and transferred by the suction pad of the transfer robot or the transfer suction pad slides on the plurality of inclined portions 65b provided on the inner side of the annular side wall portion 65a of the temporary table 40, and supports a plurality of substrate mounting support portions 65c. It is placed on and positioned.

In addition, a positioning / cleaning device has been proposed in which a plurality (6 to 8) of driving rods having a stepped portion standing up on the same circumference of the cleaning spinner are provided so as to be movable in the vertical and circumferential directions. (For example, refer to Patent Document 2).
JP 2003-71711 A Japanese Patent Laid-Open No. 2003-1000069

  The alignment of the semiconductor substrate using the temporary table or the cleaning device is positioned by sliding on the 6 to 8 inclined portions 65b, or by being locked to the steps of several ridges. That is, the positioning of the semiconductor substrate is such that the edge and bottom of the semiconductor substrate are supported by several inclined portions 65b or scissors, and most of the edges and bottom are not supported. Therefore, as a next-generation substrate alignment apparatus that requires wiring of 13 nm or less that requires higher positioning accuracy, further improvement of the alignment system is required from the semiconductor manufacturing apparatus market.

  The present invention provides a temporary mounting table capable of improving the positioning accuracy by increasing the contact area of the edge and bottom of the semiconductor substrate to the alignment device, and capable of aligning semiconductor substrates of different sizes. With the goal.

  The invention according to claim 1 is a positioning temporary placement table 1 on which semiconductor substrates having different diameters can be temporarily placed. The positioning temporary placement table has an inner diameter that gradually increases from the bottom 3 toward the upper open edge 4. The cylindrical side wall 2 is composed of a cylindrical side wall 2 having a diameter and a bottom portion 3 penetrating through the cylindrical side wall 2. The cylindrical side wall 2 includes a small bottom shelf 5 having a diameter of a small-diameter semiconductor substrate as an outer diameter of the bottom shelf, and the small diameter A large bottom shelf 6 having an inner diameter larger than the diameter of the semiconductor substrate and having the diameter of the large semiconductor substrate as an outer diameter of the bottom shelf, the outer periphery 5a of the small bottom shelf 5 and the inner periphery 6b of the large bottom shelf 6 And the slope β of the wall line connecting the outer circumference 6a of the large bottom shelf 6 and the inner periphery 4b of the upper open edge 4 are inclined by 60 to 70 degrees, respectively, and the cylindrical shape 1/5 to 1/4 part of the side wall 2 is an adsorption that can adsorb the surface of the semiconductor substrate A temporary positioning table 1 is provided, which is provided with an entrance / exit 7 cut out in the vertical direction so that the arm of the transfer robot supporting the pad can move up and down.

The invention according to claim 2 is the positioning temporary placement table 1 according to claim 1, wherein the lateral width of the small bottom shelf 5 and the large bottom shelf 6 is 5 to 10 mm, respectively, and the small bottom shelf 5 to the large bottom shelf 6. The height h ₁ to reach and the height h ₂ from the large bottom shelf 6 to the upper open edge 4 are 5 to 15 mm, respectively.

  Since the bottom portion 3 of the positioning temporary table 1 has the punched-through portion 3a, foreign matters such as polishing dust and abrasive grains are less likely to accumulate on the bottom portion, and the semiconductor substrate surface is not damaged. Further, since the contact area of the edge portion and the lower surface portion of the semiconductor substrate to the alignment device is significantly increased as compared with the conventional alignment device, the positioning accuracy is also improved. Furthermore, by providing two stages of shelves with different outer diameters on the temporary mounting table, it can be used for semiconductor substrates with different large and small diameters.

(Example)
Hereinafter, the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a perspective view of a positioning temporary mounting table of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a cross-sectional view taken along line AA in FIG. FIG.

  The positioning temporary table 1 shown in FIG. 1 to FIG. 3 is composed of a cylindrical side wall 2 whose inner diameter gradually increases from the bottom 3 toward the upper open edge 4 and a bottom 3 pierced through, The cylindrical side wall 2 includes a small bottom shelf 5 in which the diameter of the semiconductor substrate having a small diameter is the diameter of the bottom shelf, and a large bottom shelf 6 in which the diameter of the semiconductor substrate having a diameter larger than the diameter of the semiconductor substrate is the diameter of the bottom shelf. The slope α of the wall line connecting the outer periphery 5a of the small bottom shelf 5 and the inner periphery 6b of the large bottom shelf 6 and the slope β of the wall line connecting the outer periphery 6a of the large bottom shelf 6 and the inner periphery 4b of the upper open edge 4 are The arm of the transfer robot that supports the suction pad that can suck the surface of the semiconductor substrate moves up and down on the front surface of the cylindrical side wall 2 with an inclination of 60 to 70 degrees, preferably 64 to 68 degrees. The width that can be cut is cut from 1/5 to 1/4 in the top and bottom. A doorway 7 is provided.

  The positioning temporary table 1 is made of resin or ceramic. Examples of the resin material include hard polyvinyl chloride, ultrahigh density polyethylene, polyacetal, and polycarbonate. Examples of the ceramic material include alumina, silicon nitride, silicon carbide, kaolin, and silica.

When the positioning temporary table 1 is used for both a 5-inch semiconductor substrate having an actual diameter of 125 mm and a 6-inch semiconductor substrate having an actual diameter of 150 mm, the width of the small bottom shelf 5 and the large bottom shelf 6 is 5 10 mm, the outer diameter of the small bottom shelf 5 is 126 mm, the outer diameter of the large bottom shelf 6 is 151 mm, the side wall height h ₁ from the small bottom shelf 5 to the large bottom shelf 6, and the upper opening from the large bottom shelf 6 sidewall height _{h 2} leading to the edge 4, 5 to 15 mm, above the outer diameter of the open edge 4 of about 180 mm, bottom 3 hollow diameter of about 110 mm, bottom 3 height _{h 3} is 5 mm, a cylindrical side wall 2 the height _{(h 1 + h 2 + h} 3) is 20 to 30 mm. When the temporary mounting table is also used as an 8-inch diameter and 10-inch diameter semiconductor substrate, the width of the small bottom shelf 5 is 5 to 30 mm and the width of the large bottom shelf 6 is 40 to 45 mm. The height h ₁ reaching 6 and the height h ₂ reaching the upper open edge 4 from the large bottom shelf 6 are 15 to 40 mm, the outer diameter of the upper open edge 4 is about 320 mm, and penetrates the bottom 3 The diameter is about 180 mm, the bottom 3 height h ₃ is 5 mm, and the cylindrical side wall 2 height (h ₁ + h ₂ + h ₃ ) is 25 to 40 mm. In FIG. 2, reference numeral 8 denotes a bolt, which is used for coupling when the temporary table 1 is formed of two members or three members.

  The temporary positioning table 1 is installed on a base 101 of a semiconductor substrate processing apparatus 100 as shown in FIG. In FIG. 4, 1 is a temporary positioning table, 102 is a polisher, 102a is a polishing surface plate, 102b is a polishing head, 103 and 103 are semiconductor substrate storage cassettes, 104 is a substrate transfer robot, and is attached to an arm 106. A transport mechanism A that supports the pad 105 and a transport mechanism B that supports the suction hand 107 on the arm 108 are provided. Reference numeral 109 denotes an enclosure wall, and 110 denotes an entrance / exit of the suction pad 105.

  The transport mechanism A is used for transporting the small-diameter semiconductor substrate w, and the transport mechanism B is used for transporting the large-diameter semiconductor substrate w '. The transport mechanism A of the substrate transport robot 104 sucks the semiconductor substrate processed in a separate process (for example, a grinding process) with the suction pad 105, transports the semiconductor substrate onto the alignment temporary table 1, and the small bottom shelf of the alignment temporary table 1 The semiconductor substrate is brought closer to 1 to 3 mm in the vicinity of the part 5 by the lowering of the suction pad 105, and then the pressure reduction of the suction pad 105 is stopped to open the semiconductor substrate into the temporary table 1, and the semiconductor along the side wall inclined portion of the temporary table 1. The edge inclined portion at the edge of the lower surface of the substrate is slid and the slip is locked by the small bottom shelf 5 to align the semiconductor substrate. Next, the suction pad 105 is lowered and the upper surface of the semiconductor substrate is pushed by the suction pad 105 to ensure alignment, and then the suction pad 105 is depressurized to suck the semiconductor substrate, and the suction pad 105 is raised. Then, the semiconductor substrate is transferred to the storage cassette 103 or the polishing head 102b. The transport mechanism A is used for transporting a small-diameter semiconductor substrate, and the transport mechanism B is used for transporting a large-diameter semiconductor substrate. Similarly, the transport mechanism B of the substrate transport robot 104 sucks a semiconductor substrate processed in a separate process (for example, a grinding process) with a suction hand (including a suction pad mechanism) 107 and transports it onto the alignment temporary table 1. The semiconductor substrate is brought closer to 1 to 3 mm in the vicinity of the large bottom shelf 6 of the alignment temporary placement table 1 by the lowering of the suction hand 107, and then the vacuum of the suction hand 107 is stopped to open the semiconductor substrate in the temporary placement table 1. The edge inclined portion at the edge of the lower surface of the semiconductor substrate is slid along the side wall inclined portion 1 and the sliding is locked by the large bottom shelf 6 to align the semiconductor substrate. Next, the suction hand 107 is lowered and the upper surface of the semiconductor substrate is pushed by the suction hand 107 to ensure alignment, and then the suction hand 107 is depressurized to suck the semiconductor substrate, and the suction head 107 is lifted. Then, the semiconductor substrate is transferred to the storage cassette 103 or the polishing head 102b.

  The alignment temporary placement table 1 of the present invention is used to align a semiconductor substrate when the semiconductor substrate is transported from one process to the next.

It is a perspective view of a positioning temporary placement stand. It is a top view of a positioning device. It is AA sectional drawing in FIG. 2 of a positioning device. It is a top view of the polish device provided with the positioning temporary placement stand of the present invention. It is a perspective view of a well-known temporary placement stand.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Temporary stand 2 Cylindrical side wall 3 Bottom part 4 Upper open edge 5 Small bottom shelf 6 Large bottom shelf 7 Entrance

Claims (2)

  A temporary positioning table 1 on which semiconductor substrates having different diameters can be temporarily mounted, the positioning temporary table having a cylindrical side wall 2 whose inner diameter gradually increases from the bottom 3 toward the upper open edge 4. The cylindrical side wall 2 includes a small bottom shelf 5 having an outer diameter of the bottom shelf as a diameter of a small-diameter semiconductor substrate, and a diameter of the small-diameter semiconductor substrate. A large bottom shelf 6 having a large inner diameter and having a diameter of a large semiconductor substrate as the outer diameter of the bottom shelf, and a wall line gradient α connecting the outer periphery 5a of the small bottom shelf 5 and the inner periphery 6b of the large bottom shelf 6 And the slope β of the wall line connecting the outer periphery 6a of the large bottom shelf 6 and the inner periphery 4b of the upper open edge 4 is inclined by 60 to 70 degrees, respectively, and 1/5 of the cylindrical side wall 2 The 1/4 part is a carrying part that supports a suction pad that can suck the surface of the semiconductor substrate. Temporary positioning table 1 characterized by being provided with an entrance / exit 7 cut out in the vertical direction so that the arm of the feeding robot can move up and down. The width of each of the small bottom shelf 5 and the large bottom shelf 6 is 5 to 10 mm, the height h ₁ from the small bottom shelf 5 to the large bottom shelf 6, and the upward opening edge 4 from the large bottom shelf 6. _{2. The} temporary positioning table 1 according to claim 1, wherein each of the reached heights h2 is 5 to 15 mm.

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