SG11201406054TA - Silver-based cylindrical target and process for manufacturing same - Google Patents
Silver-based cylindrical target and process for manufacturing sameInfo
- Publication number
- SG11201406054TA SG11201406054TA SG11201406054TA SG11201406054TA SG11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA SG 11201406054T A SG11201406054T A SG 11201406054TA
- Authority
- SG
- Singapore
- Prior art keywords
- silver
- manufacturing same
- cylindrical target
- based cylindrical
- target
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/002—Extruding materials of special alloys so far as the composition of the alloy requires or permits special extruding methods of sequences
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012071328A JP5472353B2 (en) | 2012-03-27 | 2012-03-27 | Silver-based cylindrical target and manufacturing method thereof |
| PCT/JP2012/079485 WO2013145424A1 (en) | 2012-03-27 | 2012-11-14 | Silver-based cylindrical target and process for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201406054TA true SG11201406054TA (en) | 2014-11-27 |
Family
ID=49258759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201406054TA SG11201406054TA (en) | 2012-03-27 | 2012-11-14 | Silver-based cylindrical target and process for manufacturing same |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150041313A1 (en) |
| EP (1) | EP2832895B1 (en) |
| JP (1) | JP5472353B2 (en) |
| KR (3) | KR101467152B1 (en) |
| CN (1) | CN104246002B (en) |
| SG (1) | SG11201406054TA (en) |
| TW (1) | TWI457450B (en) |
| WO (1) | WO2013145424A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5159962B1 (en) * | 2012-01-10 | 2013-03-13 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| DE102012006718B3 (en) | 2012-04-04 | 2013-07-18 | Heraeus Materials Technology Gmbh & Co. Kg | Planar or tubular sputtering target and method of making the same |
| JP6198177B2 (en) * | 2013-07-19 | 2017-09-20 | 三菱マテリアル株式会社 | Ag alloy sputtering target |
| DE102014214683A1 (en) * | 2014-07-25 | 2016-01-28 | Heraeus Deutschland GmbH & Co. KG | Sputtering target based on a silver alloy |
| JP6350223B2 (en) * | 2014-11-04 | 2018-07-04 | 三菱マテリアル株式会社 | Ag alloy sputtering target |
| JP5975186B1 (en) | 2015-02-27 | 2016-08-23 | 三菱マテリアル株式会社 | Ag alloy sputtering target and method for producing Ag alloy film |
| JP6259847B2 (en) | 2016-02-05 | 2018-01-10 | 住友化学株式会社 | Manufacturing method of cylindrical target |
| KR101945145B1 (en) * | 2016-03-14 | 2019-02-01 | 제이엑스금속주식회사 | Oxide sintered compact |
| KR20190015346A (en) | 2016-06-02 | 2019-02-13 | 다나카 기킨조쿠 고교 가부시키가이샤 | Gold sputtering target |
| JP6877179B2 (en) * | 2017-02-23 | 2021-05-26 | Ｎｊｔ銅管株式会社 | Cylindrical sputtering target material and its manufacturing method |
| JP7274816B2 (en) | 2017-12-06 | 2023-05-17 | 田中貴金属工業株式会社 | Gold sputtering target and its manufacturing method |
| WO2019111945A1 (en) | 2017-12-06 | 2019-06-13 | 田中貴金属工業株式会社 | Method for producing gold sputtering target and method for producing gold film |
| JP2019131850A (en) * | 2018-01-30 | 2019-08-08 | 三菱マテリアル株式会社 | Laminated film and Ag alloy sputtering target |
| KR102623865B1 (en) * | 2018-09-26 | 2024-01-11 | 제이엑스금속주식회사 | Sputtering target and its manufacturing method |
| CN111215839A (en) * | 2018-11-23 | 2020-06-02 | 宁波江丰电子材料股份有限公司 | Forming method of coating material |
| CN109440073A (en) * | 2018-11-29 | 2019-03-08 | 信利光电股份有限公司 | A kind of silver alloy target, silver alloy layers and electrochromic rearview |
| JP2020125533A (en) * | 2019-02-06 | 2020-08-20 | 三菱マテリアル株式会社 | Ag ALLOY SPUTTERING TARGET, AND Ag ALLOY FILM |
| JP6853458B2 (en) * | 2019-02-06 | 2021-03-31 | 三菱マテリアル株式会社 | Ag alloy sputtering target and Ag alloy film |
| JP2021075762A (en) * | 2019-11-08 | 2021-05-20 | 三菱マテリアル株式会社 | Ag alloy sputtering target and Ag alloy film |
| JP7225170B2 (en) | 2020-08-05 | 2023-02-20 | 松田産業株式会社 | Ag alloy cylindrical sputtering target, sputtering apparatus, and method for manufacturing electronic device |
| CN113088749A (en) * | 2021-03-11 | 2021-07-09 | 先导薄膜材料（广东）有限公司 | Silver alloy and preparation method thereof |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294738B1 (en) * | 1997-03-31 | 2001-09-25 | American Superconductor Corporation | Silver and silver alloy articles |
| US20030052000A1 (en) * | 1997-07-11 | 2003-03-20 | Vladimir Segal | Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method |
| JP4247863B2 (en) * | 1999-07-12 | 2009-04-02 | ソニー株式会社 | Metal materials for electronic components, wiring materials for electronic components, electrode materials for electronic components, electronic components, electronic equipment, processing methods for metal materials, and electro-optical components |
| CA2418807A1 (en) * | 2000-09-08 | 2003-02-05 | Asahi Glass Company, Limited | Cylindrical target and its production method |
| WO2004001093A1 (en) * | 2002-06-24 | 2003-12-31 | Kobelco Research Institute, Inc. | Silver alloy sputtering target and process for producing the same |
| JP4264302B2 (en) * | 2002-06-24 | 2009-05-13 | 株式会社コベルコ科研 | Silver alloy sputtering target and manufacturing method thereof |
| JP3993530B2 (en) * | 2003-05-16 | 2007-10-17 | 株式会社神戸製鋼所 | Ag-Bi alloy sputtering target and method for producing the same |
| JP4384453B2 (en) * | 2003-07-16 | 2009-12-16 | 株式会社神戸製鋼所 | Ag-based sputtering target and manufacturing method thereof |
| US20050279630A1 (en) * | 2004-06-16 | 2005-12-22 | Dynamic Machine Works, Inc. | Tubular sputtering targets and methods of flowforming the same |
| DE102005050424B4 (en) * | 2005-10-19 | 2009-10-22 | W.C. Heraeus Gmbh | Sputtering target made of multi-component alloys |
| US20070251819A1 (en) * | 2006-05-01 | 2007-11-01 | Kardokus Janine K | Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets |
| EP2878692B1 (en) * | 2006-12-13 | 2016-07-20 | UACJ Corporation | High-strength aluminum-base alloy products and process for production thereof |
| JP4793502B2 (en) * | 2009-10-06 | 2011-10-12 | 三菱マテリアル株式会社 | Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same |
| JP5533545B2 (en) | 2010-01-12 | 2014-06-25 | 三菱マテリアル株式会社 | Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same |
| JP5159963B1 (en) * | 2012-01-13 | 2013-03-13 | 三菱マテリアル株式会社 | Silver alloy sputtering target for forming conductive film and method for producing the same |
| DE102012006718B3 (en) * | 2012-04-04 | 2013-07-18 | Heraeus Materials Technology Gmbh & Co. Kg | Planar or tubular sputtering target and method of making the same |
-
2012
- 2012-03-27 JP JP2012071328A patent/JP5472353B2/en active Active
- 2012-11-13 TW TW101142209A patent/TWI457450B/en active
- 2012-11-14 KR KR1020147004114A patent/KR101467152B1/en active IP Right Grant
- 2012-11-14 EP EP12872951.4A patent/EP2832895B1/en active Active
- 2012-11-14 US US14/388,114 patent/US20150041313A1/en not_active Abandoned
- 2012-11-14 CN CN201280071819.6A patent/CN104246002B/en active Active
- 2012-11-14 WO PCT/JP2012/079485 patent/WO2013145424A1/en active Application Filing
- 2012-11-14 SG SG11201406054TA patent/SG11201406054TA/en unknown
- 2012-11-14 KR KR1020167003213A patent/KR20160022934A/en not_active Application Discontinuation
- 2012-11-14 KR KR1020147021670A patent/KR20140130434A/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP5472353B2 (en) | 2014-04-16 |
| WO2013145424A1 (en) | 2013-10-03 |
| CN104246002A (en) | 2014-12-24 |
| CN104246002B (en) | 2015-11-25 |
| TW201339327A (en) | 2013-10-01 |
| EP2832895A4 (en) | 2016-04-13 |
| KR20160022934A (en) | 2016-03-02 |
| KR20140029549A (en) | 2014-03-10 |
| EP2832895A1 (en) | 2015-02-04 |
| TWI457450B (en) | 2014-10-21 |
| EP2832895B1 (en) | 2019-08-21 |
| JP2013204052A (en) | 2013-10-07 |
| US20150041313A1 (en) | 2015-02-12 |
| KR101467152B1 (en) | 2014-11-28 |
| KR20140130434A (en) | 2014-11-10 |
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