SG11201403053UA - Interchangeable magnet pack - Google Patents

Interchangeable magnet pack

Info

Publication number
SG11201403053UA
SG11201403053UA SG11201403053UA SG11201403053UA SG11201403053UA SG 11201403053U A SG11201403053U A SG 11201403053UA SG 11201403053U A SG11201403053U A SG 11201403053UA SG 11201403053U A SG11201403053U A SG 11201403053UA SG 11201403053U A SG11201403053U A SG 11201403053UA
Authority
SG
Singapore
Prior art keywords
magnet pack
interchangeable magnet
interchangeable
pack
magnet
Prior art date
Application number
SG11201403053UA
Other languages
English (en)
Inventor
Toon Hai Foo
Thomas P Nolan
Walter Stanley Kassela
Original Assignee
Seagate Technology Llc
Toon Hai Foo
Thomas P Nolan
Walter Stanley Kassela
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology Llc, Toon Hai Foo, Thomas P Nolan, Walter Stanley Kassela filed Critical Seagate Technology Llc
Publication of SG11201403053UA publication Critical patent/SG11201403053UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H01F7/0273—Magnetic circuits with PM for magnetic field generation
    • H01F7/0278—Magnetic circuits with PM for magnetic field generation for generating uniform fields, focusing, deflecting electrically charged particles
    • H01F7/0284—Magnetic circuits with PM for magnetic field generation for generating uniform fields, focusing, deflecting electrically charged particles using a trimmable or adjustable magnetic circuit, e.g. for a symmetric dipole or quadrupole magnetic field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Physical Vapour Deposition (AREA)
  • Prostheses (AREA)
SG11201403053UA 2011-12-09 2012-12-07 Interchangeable magnet pack SG11201403053UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/316,358 US9347129B2 (en) 2011-12-09 2011-12-09 Interchangeable magnet pack
PCT/US2012/068635 WO2013086466A1 (en) 2011-12-09 2012-12-07 Interchangeable magnet pack

Publications (1)

Publication Number Publication Date
SG11201403053UA true SG11201403053UA (en) 2014-09-26

Family

ID=48570988

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403053UA SG11201403053UA (en) 2011-12-09 2012-12-07 Interchangeable magnet pack

Country Status (8)

Country Link
US (1) US9347129B2 (https=)
EP (1) EP2788524A4 (https=)
JP (1) JP6106690B2 (https=)
KR (1) KR20140138597A (https=)
CN (1) CN104603325A (https=)
SG (1) SG11201403053UA (https=)
TW (1) TW201339343A (https=)
WO (1) WO2013086466A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10573500B2 (en) * 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
FR3064423B1 (fr) 2017-03-22 2019-11-15 Whylot Sas Rotor pour moteur ou generatrice electromagnetique a structure alveolaire comportant des alveoles pour le logement d'aimants respectifs
US11322338B2 (en) 2017-08-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Sputter target magnet
FR3077414B1 (fr) * 2018-01-26 2022-03-11 Whylot Sas Aimant unitaire a configuration ovoide et structure d'aimant a plusieurs aimants unitaires
GB201815216D0 (en) * 2018-09-18 2018-10-31 Spts Technologies Ltd Apparatus and a method of controlling thickness variation in a material layer formed using physical vapour deposition
US11772812B1 (en) * 2020-09-09 2023-10-03 United States Of America As Represented By The Secretary Of The Air Force Magnetic mobile aircraft cover
US12014912B2 (en) * 2021-05-05 2024-06-18 Taiwan Semiconductor Manufacturing Company Limited Apparatus and method for physical vapor deposition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386568A (en) * 1967-06-22 1968-06-04 Ruby L. Harmon Magnet kit
DE3727901A1 (de) 1987-08-21 1989-03-02 Leybold Ag Zerstaeubungskathode nach dem magnetronprinzip
JPH04218905A (ja) 1990-03-23 1992-08-10 Unitika Ltd 薄膜状磁性材料及びその製造方法
US5407551A (en) 1993-07-13 1995-04-18 The Boc Group, Inc. Planar magnetron sputtering apparatus
JP3834111B2 (ja) * 1996-10-16 2006-10-18 松下電器産業株式会社 マグネトロンスパッタ方法、マグネトロンスパッタ装置及びそれに使用するマグネットユニット
GB9718947D0 (en) * 1997-09-05 1997-11-12 Nordiko Ltd Vacuum sputtering apparatus
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6306265B1 (en) 1999-02-12 2001-10-23 Applied Materials, Inc. High-density plasma for ionized metal deposition capable of exciting a plasma wave
US6299740B1 (en) * 2000-01-19 2001-10-09 Veeco Instrument, Inc. Sputtering assembly and target therefor
KR100345924B1 (ko) * 2000-01-24 2002-07-27 한전건 평판 마그네트론 스퍼터링 장치
US6406599B1 (en) * 2000-11-01 2002-06-18 Applied Materials, Inc. Magnetron with a rotating center magnet for a vault shaped sputtering target
JP4411512B2 (ja) 2003-08-07 2010-02-10 アイシン精機株式会社 超電導磁場発生装置、その励磁方法、超電導磁場発生装置を用いたスパッタリング成膜装置、強磁性体着脱治具
US7018515B2 (en) * 2004-03-24 2006-03-28 Applied Materials, Inc. Selectable dual position magnetron
WO2006082863A1 (ja) * 2005-02-02 2006-08-10 Hitachi Metals, Ltd. マグネトロンスパッタリング用磁気回路装置及びその製造方法
DE102005019100B4 (de) * 2005-04-25 2009-02-12 Steag Hamatech Ag Magnetsystem für eine Zerstäubungskathode
US20070108041A1 (en) * 2005-11-11 2007-05-17 Guo George X Magnetron source having increased usage life
US8557094B2 (en) * 2006-10-05 2013-10-15 Applied Materials, Inc. Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum
CN102066604A (zh) * 2008-06-26 2011-05-18 株式会社爱发科 阴极单元及具有该阴极单元的溅射装置
US20120097534A1 (en) * 2008-08-29 2012-04-26 Ulvac, Inc. Magnetron sputtering cathode and film formation apparatus
US8721796B2 (en) * 2008-10-23 2014-05-13 Applied Materials, Inc. Plasma cleaning apparatus and method
CN101851746A (zh) * 2009-04-03 2010-10-06 鸿富锦精密工业（深圳）有限公司 磁控式溅镀靶及磁控式溅镀系统

Also Published As

Publication number Publication date
TW201339343A (zh) 2013-10-01
EP2788524A4 (en) 2015-08-26
KR20140138597A (ko) 2014-12-04
EP2788524A1 (en) 2014-10-15
US9347129B2 (en) 2016-05-24
WO2013086466A1 (en) 2013-06-13
JP6106690B2 (ja) 2017-04-05
US20130146453A1 (en) 2013-06-13
JP2015509138A (ja) 2015-03-26
CN104603325A (zh) 2015-05-06

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