SG11201401848XA - Esd protective component and component comprising esd protective component and led - Google Patents
Esd protective component and component comprising esd protective component and ledInfo
- Publication number
- SG11201401848XA SG11201401848XA SG11201401848XA SG11201401848XA SG11201401848XA SG 11201401848X A SG11201401848X A SG 11201401848XA SG 11201401848X A SG11201401848X A SG 11201401848XA SG 11201401848X A SG11201401848X A SG 11201401848XA SG 11201401848X A SG11201401848X A SG 11201401848XA
- Authority
- SG
- Singapore
- Prior art keywords
- component
- esd protective
- led
- protective component
- esd
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011117151 | 2011-10-28 | ||
DE102012101606A DE102012101606A1 (en) | 2011-10-28 | 2012-02-28 | ESD protection device and device with an ESD protection device and an LED |
PCT/EP2012/071287 WO2013060861A1 (en) | 2011-10-28 | 2012-10-26 | Esd protective component and component comprising esd protective component and led |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401848XA true SG11201401848XA (en) | 2014-09-26 |
Family
ID=48084467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401848XA SG11201401848XA (en) | 2011-10-28 | 2012-10-26 | Esd protective component and component comprising esd protective component and led |
Country Status (8)
Country | Link |
---|---|
US (1) | US9209619B2 (en) |
EP (1) | EP2771890A1 (en) |
JP (1) | JP6117809B2 (en) |
CN (1) | CN103890866B (en) |
DE (1) | DE102012101606A1 (en) |
MY (1) | MY175814A (en) |
SG (1) | SG11201401848XA (en) |
WO (1) | WO2013060861A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015104641A1 (en) * | 2015-03-26 | 2016-09-29 | At & S Austria Technologie & Systemtechnik Ag | Carrier with passive cooling function for a semiconductor device |
KR102345612B1 (en) | 2015-07-08 | 2022-01-03 | 삼성디스플레이 주식회사 | Display device |
WO2017036511A1 (en) | 2015-08-31 | 2017-03-09 | Epcos Ag | Electric multilayer component for surface-mount technology and method of producing an electric multilayer component |
JP6482735B2 (en) * | 2015-12-08 | 2019-03-13 | フィリップス ライティング ホールディング ビー ヴィ | Assembly and lighting device having assembly |
CN108512205A (en) * | 2017-02-24 | 2018-09-07 | 北京小米移动软件有限公司 | ESD protection device and data connecting line |
TWI820026B (en) * | 2017-06-21 | 2023-11-01 | 荷蘭商露明控股公司 | Lighting assembly with improved thermal behaviour |
WO2020096591A1 (en) * | 2018-11-07 | 2020-05-14 | Frederick Stephen Felt | Protection of biological systems |
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US4811164A (en) * | 1988-03-28 | 1989-03-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Monolithic capacitor-varistor |
US4882650A (en) * | 1988-12-05 | 1989-11-21 | Sprague Electric Company | Magnesium titanate ceramic and dual dielectric substrate using same |
JPH02220406A (en) * | 1989-02-21 | 1990-09-03 | Murata Mfg Co Ltd | Multipolar varistor |
JP2976046B2 (en) * | 1991-06-27 | 1999-11-10 | 株式会社村田製作所 | Chip varistor |
JP3251134B2 (en) * | 1994-08-29 | 2002-01-28 | 松下電器産業株式会社 | Method for producing sintered zinc oxide |
JPH10261546A (en) * | 1997-03-19 | 1998-09-29 | Murata Mfg Co Ltd | Lamination capacitor |
JPH10335114A (en) * | 1997-04-04 | 1998-12-18 | Murata Mfg Co Ltd | Thermistor |
JPH1154301A (en) * | 1997-08-07 | 1999-02-26 | Murata Mfg Co Ltd | Chip thermister |
JPH11191506A (en) * | 1997-12-25 | 1999-07-13 | Murata Mfg Co Ltd | Laminated varistor |
US6011683A (en) * | 1997-12-29 | 2000-01-04 | Texas Instruments Incorporated | Thin multilayer ceramic capacitors |
JPH11297510A (en) * | 1998-04-07 | 1999-10-29 | Murata Mfg Co Ltd | Laminated varistor |
TW432731B (en) * | 1998-12-01 | 2001-05-01 | Murata Manufacturing Co | Multilayer piezoelectric part |
JP2000228302A (en) * | 1999-02-04 | 2000-08-15 | Atsushi Iga | Zinc oxide based porcelain laminated member, its manufacture and zinc oxide varistor |
DE19931056B4 (en) * | 1999-07-06 | 2005-05-19 | Epcos Ag | Multilayer varistor of low capacity |
US7113383B2 (en) * | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
EP1179826A1 (en) * | 2000-07-12 | 2002-02-13 | Littelfuse Ireland Development Company Limited | An integrated passive device and a method for producing such a device |
US6760215B2 (en) * | 2001-05-25 | 2004-07-06 | Daniel F. Devoe | Capacitor with high voltage breakdown threshold |
US7463474B2 (en) * | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
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US7279724B2 (en) * | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
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DE102009010212B4 (en) * | 2009-02-23 | 2017-12-07 | Epcos Ag | Electrical multilayer component |
JP5310863B2 (en) | 2009-09-30 | 2013-10-09 | 株式会社村田製作所 | ESD protection device and manufacturing method thereof |
JP5324390B2 (en) * | 2009-10-22 | 2013-10-23 | Tdk株式会社 | Laminated electronic components |
DE102010007443A1 (en) * | 2010-02-10 | 2011-08-11 | Epcos Ag, 81669 | Ceramic multilayer component |
US8947852B2 (en) * | 2011-07-07 | 2015-02-03 | Kemet Electronics Corporation | Integrated EMI filter and surge protection component |
-
2012
- 2012-02-28 DE DE102012101606A patent/DE102012101606A1/en active Pending
- 2012-10-26 EP EP12787404.8A patent/EP2771890A1/en not_active Ceased
- 2012-10-26 US US14/351,051 patent/US9209619B2/en active Active
- 2012-10-26 JP JP2014537638A patent/JP6117809B2/en active Active
- 2012-10-26 SG SG11201401848XA patent/SG11201401848XA/en unknown
- 2012-10-26 MY MYPI2014701016A patent/MY175814A/en unknown
- 2012-10-26 WO PCT/EP2012/071287 patent/WO2013060861A1/en active Application Filing
- 2012-10-26 CN CN201280052959.9A patent/CN103890866B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103890866A (en) | 2014-06-25 |
JP6117809B2 (en) | 2017-04-19 |
US20140252403A1 (en) | 2014-09-11 |
JP2015501545A (en) | 2015-01-15 |
MY175814A (en) | 2020-07-09 |
DE102012101606A1 (en) | 2013-05-02 |
CN103890866B (en) | 2017-03-22 |
EP2771890A1 (en) | 2014-09-03 |
US9209619B2 (en) | 2015-12-08 |
WO2013060861A1 (en) | 2013-05-02 |
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