SG11201401219WA - Etching device for the electrolytic etching of copper - Google Patents

Etching device for the electrolytic etching of copper

Info

Publication number
SG11201401219WA
SG11201401219WA SG11201401219WA SG11201401219WA SG11201401219WA SG 11201401219W A SG11201401219W A SG 11201401219WA SG 11201401219W A SG11201401219W A SG 11201401219WA SG 11201401219W A SG11201401219W A SG 11201401219WA SG 11201401219W A SG11201401219W A SG 11201401219WA
Authority
SG
Singapore
Prior art keywords
etching
copper
electrolytic
etching device
electrolytic etching
Prior art date
Application number
SG11201401219WA
Inventor
Christoph Herkle
Original Assignee
Christoph Herkle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Christoph Herkle filed Critical Christoph Herkle
Publication of SG11201401219WA publication Critical patent/SG11201401219WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C25F7/02—Regeneration of process liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/232—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles
    • B01F23/2323—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles by circulating the flow in guiding constructions or conduits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
    • B01F23/2376—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media characterised by the gas being introduced
    • B01F23/23761—Aerating, i.e. introducing oxygen containing gas in liquids
    • B01F23/237612—Oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
    • B01F23/2376—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media characterised by the gas being introduced
    • B01F23/23761—Aerating, i.e. introducing oxygen containing gas in liquids
    • B01F23/237613—Ozone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B01F23/45—Mixing liquids with liquids; Emulsifying using flow mixing
    • B01F23/454—Mixing liquids with liquids; Emulsifying using flow mixing by injecting a mixture of liquid and gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/20—Jet mixers, i.e. mixers using high-speed fluid streams
    • B01F25/21—Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers
    • B01F25/211—Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers the injectors being surrounded by guiding tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30—Injector mixers
    • B01F25/31—Injector mixers in conduits or tubes through which the main component flows
    • B01F25/312—Injector mixers in conduits or tubes through which the main component flows with Venturi elements; Details thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
    • B01F25/53—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle in which the mixture is discharged from and reintroduced into a receptacle through a recirculation tube, into which an additional component is introduced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/80—Mixing plants; Combinations of mixers
    • B01F33/82—Combinations of dissimilar mixers
    • B01F33/821—Combinations of dissimilar mixers with consecutive receptacles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
SG11201401219WA 2011-10-08 2011-10-08 Etching device for the electrolytic etching of copper SG11201401219WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2011/001810 WO2013050008A1 (en) 2011-10-08 2011-10-08 Etching device for the electrolytic etching of copper

Publications (1)

Publication Number Publication Date
SG11201401219WA true SG11201401219WA (en) 2014-07-30

Family

ID=45952807

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201401219WA SG11201401219WA (en) 2011-10-08 2011-10-08 Etching device for the electrolytic etching of copper

Country Status (8)

Country Link
US (1) US20140251797A1 (en)
EP (1) EP2764138B1 (en)
JP (1) JP5711856B2 (en)
KR (1) KR101587245B1 (en)
CN (1) CN103975096B (en)
DE (1) DE112011105722A5 (en)
SG (1) SG11201401219WA (en)
WO (1) WO2013050008A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5719468B1 (en) * 2014-06-20 2015-05-20 日本ガス開発株式会社 Heat exchanger
US9551083B2 (en) * 2014-09-10 2017-01-24 Invensas Corporation Paddle for materials processing
CN104947111B (en) * 2015-07-02 2017-09-22 深圳市洁驰科技有限公司 A kind of printed circuit board acidic etching solution cuprous ion oxidation unit
CN107215140A (en) * 2017-07-27 2017-09-29 安徽省九华山法器有限公司 A kind of Zijin etch process
WO2020074541A1 (en) * 2018-10-08 2020-04-16 Degrémont Technologies Ag Using ozone for manganese* oxidation in etching application

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE34781T1 (en) * 1983-04-13 1988-06-15 Kernforschungsanlage Juelich PLANT FOR REGENERATION OF AN AMMONIA CAUSTIC SOLUTION.
JPS6388026A (en) * 1986-10-01 1988-04-19 Mitsubishi Rayon Eng Co Ltd Gas liquid mixing apparatus
JP2701444B2 (en) * 1989-04-07 1998-01-21 富士電機株式会社 Etchant regeneration equipment
HU9202203D0 (en) * 1990-01-29 1992-12-28 Yasuyuki Sakurada Apparatus for purifying sewage water
DE4208582A1 (en) * 1992-03-18 1993-09-23 Hoellmueller Maschbau H Regeneration process and appts. for copper chloride etching and pickling solns. - utilising dissolved oxygen@ content as re-oxidant, making process economical
JPH07243062A (en) * 1994-03-03 1995-09-19 Hitachi Chem Co Ltd Etching method and device therefor
JPH08302487A (en) * 1995-05-08 1996-11-19 Fuji Electric Co Ltd Liquid etchant regenerating device
FR2762232B1 (en) * 1997-04-17 1999-05-28 Degremont PROCESS AND DEVICE FOR CONTACT WITH OZONE IN TREATMENT FLUIDS, ESPECIALLY WATER
JP2000017462A (en) * 1998-07-03 2000-01-18 Kenshin Ka Copper etching method and device therefor
DE10002000A1 (en) * 2000-01-19 2001-08-09 Bosch Gmbh Robert Atomization arrangement
JP3555557B2 (en) * 2000-06-16 2004-08-18 栗田工業株式会社 Aeration device
US6619318B2 (en) * 2001-09-25 2003-09-16 Hydro Systems Company Multiple flow rate eductive dispenser
EP1533398B1 (en) * 2003-10-24 2011-08-31 Siemens Aktiengesellschaft Process for producing an electrolyte ready for use out of waste products containing metal ions
JP4559289B2 (en) * 2005-04-28 2010-10-06 株式会社荏原製作所 Oxygen dissolving apparatus and oxygen dissolving method
JP5524453B2 (en) * 2008-05-15 2014-06-18 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Silicon wafer etching method and etching apparatus

Also Published As

Publication number Publication date
KR20140092817A (en) 2014-07-24
EP2764138A1 (en) 2014-08-13
CN103975096A (en) 2014-08-06
DE112011105722A5 (en) 2014-06-26
US20140251797A1 (en) 2014-09-11
KR101587245B1 (en) 2016-01-20
WO2013050008A1 (en) 2013-04-11
EP2764138B1 (en) 2015-04-29
JP2014528516A (en) 2014-10-27
CN103975096B (en) 2016-08-17
JP5711856B2 (en) 2015-05-07

Similar Documents

Publication Publication Date Title
SG10201506427XA (en) Etching solution for copper or copper alloy
HK1187964A1 (en) Insulated metal substrate
EP2684264A4 (en) Electrical enclosure
EP2704785A4 (en) Component for medical circuit
GB2508991B (en) Subsea electrical architectures
EP2595180A4 (en) Etching method
EP2716796A4 (en) Electrical contact component
EP2701479A4 (en) Electronic apparatus
GB2489508B8 (en) Improvements for electrical circuits
EP2782120A4 (en) Etching method
EP2662473A4 (en) Conductive member
EP2774032A4 (en) Cross-store electronic discovery
EP2760121A4 (en) Electronic circuit
EP2693274A4 (en) Conductive member
ZA201400624B (en) Solids-handling equipment
ZA201308491B (en) Solids-handling equipment
PL2590275T3 (en) Circuit positioning device
EP2724893A4 (en) Waterproof structure for electronic device
TWI560986B (en) Integrated circuit
EP2680545A4 (en) Electronic apparatus
SG11201401219WA (en) Etching device for the electrolytic etching of copper
SG11201503933RA (en) Substrate etching method
EP2903019A4 (en) Plasma etching device
EP2741393A4 (en) Electrical device
PL2718631T3 (en) An electric shower