SG108955A1 - Missing die detection - Google Patents

Missing die detection

Info

Publication number
SG108955A1
SG108955A1 SG200404277A SG200404277A SG108955A1 SG 108955 A1 SG108955 A1 SG 108955A1 SG 200404277 A SG200404277 A SG 200404277A SG 200404277 A SG200404277 A SG 200404277A SG 108955 A1 SG108955 A1 SG 108955A1
Authority
SG
Singapore
Prior art keywords
die detection
missing die
missing
detection
die
Prior art date
Application number
SG200404277A
Other languages
English (en)
Inventor
Fan Wang
Wing Hong Leung
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG108955A1 publication Critical patent/SG108955A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Die Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Geophysics And Detection Of Objects (AREA)
SG200404277A 2003-07-11 2004-07-09 Missing die detection SG108955A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/618,297 US7045803B2 (en) 2003-07-11 2003-07-11 Missing die detection

Publications (1)

Publication Number Publication Date
SG108955A1 true SG108955A1 (en) 2005-02-28

Family

ID=33565111

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200404277A SG108955A1 (en) 2003-07-11 2004-07-09 Missing die detection

Country Status (6)

Country Link
US (1) US7045803B2 (zh)
KR (1) KR100671729B1 (zh)
CN (1) CN100413046C (zh)
MY (1) MY130675A (zh)
SG (1) SG108955A1 (zh)
TW (1) TWI244718B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090053021A1 (en) * 2005-03-29 2009-02-26 Norichika Yamagishi Semiconductor manufacturing apparatus
US8633441B2 (en) * 2009-09-02 2014-01-21 Asm Assembly Automation Ltd Die bonding process incorporating infrared vision system
JP6114708B2 (ja) * 2013-05-27 2017-04-12 東京エレクトロン株式会社 基板脱離検出装置及び基板脱離検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
KR101825985B1 (ko) * 2017-11-02 2018-02-06 김정덕 렌즈모듈 조립장치의 렌즈픽업헤드 구조
KR101825988B1 (ko) * 2017-11-10 2018-02-06 김정덕 렌즈모듈 조립장치의 렌즈픽업헤드 구조
KR101834199B1 (ko) * 2017-11-10 2018-03-05 김정덕 렌즈모듈 조립장치의 렌즈픽업헤드 구조

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3814931A (en) * 1972-05-22 1974-06-04 Parke Davis & Co Inspection apparatus and means
JPS57122535A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Pellet bonding device
JPS58137222A (ja) * 1982-02-09 1983-08-15 Mitsubishi Electric Corp 半導体素子のフリツプチツプボンデイング装置
JPS6325934A (ja) * 1986-07-18 1988-02-03 Hitachi Ltd ペレツトボンデイング装置
JPH01181539A (ja) * 1988-01-12 1989-07-19 Toshiba Corp ワイヤボンディング装置
JPH03208348A (ja) * 1990-01-10 1991-09-11 Matsushita Electron Corp 半導体素子の有無検出装置
JPH07285087A (ja) * 1994-04-15 1995-10-31 Rohm Co Ltd 半導体チップのピックアップ検査装置
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
KR100481527B1 (ko) * 1998-04-02 2005-06-08 삼성전자주식회사 다이 본딩 장치
JP3982597B2 (ja) 1998-10-09 2007-09-26 日本電産トーソク株式会社 ダイボンダのチップ吸着機構
JP2002231738A (ja) * 2001-02-07 2002-08-16 Sharp Corp ダイボンド装置およびそれを用いた吸着物検出方法

Also Published As

Publication number Publication date
TWI244718B (en) 2005-12-01
US20050006606A1 (en) 2005-01-13
US7045803B2 (en) 2006-05-16
KR20050009155A (ko) 2005-01-24
KR100671729B1 (ko) 2007-01-22
TW200603314A (en) 2006-01-16
MY130675A (en) 2007-07-31
CN100413046C (zh) 2008-08-20
CN1576824A (zh) 2005-02-09

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