SG106626A1 - Head gimbal assembly - Google Patents

Head gimbal assembly

Info

Publication number
SG106626A1
SG106626A1 SG200104983A SG200104983A SG106626A1 SG 106626 A1 SG106626 A1 SG 106626A1 SG 200104983 A SG200104983 A SG 200104983A SG 200104983 A SG200104983 A SG 200104983A SG 106626 A1 SG106626 A1 SG 106626A1
Authority
SG
Singapore
Prior art keywords
gimbal assembly
head gimbal
head
assembly
gimbal
Prior art date
Application number
SG200104983A
Other languages
English (en)
Inventor
Takehiro Kamigama
Masashi Shiraishi
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of SG106626A1 publication Critical patent/SG106626A1/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
SG200104983A 2000-09-12 2001-08-17 Head gimbal assembly SG106626A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000276565A JP3738679B2 (ja) 2000-09-12 2000-09-12 ヘッドジンバルアセンブリ

Publications (1)

Publication Number Publication Date
SG106626A1 true SG106626A1 (en) 2004-10-29

Family

ID=18762004

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104983A SG106626A1 (en) 2000-09-12 2001-08-17 Head gimbal assembly

Country Status (5)

Country Link
US (1) US6667857B2 (zh)
JP (1) JP3738679B2 (zh)
CN (1) CN1202516C (zh)
HK (1) HK1044621A1 (zh)
SG (1) SG106626A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4104957B2 (ja) 2002-11-07 2008-06-18 日本発条株式会社 サスペンション用部品の接合処理装置
JP3997976B2 (ja) 2003-10-10 2007-10-24 新科實業有限公司 サスペンション、ヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置
US7230796B2 (en) * 2003-10-14 2007-06-12 Seagate Technology Llc Features for improved slider attachment
JP2005190534A (ja) * 2003-12-25 2005-07-14 Shinka Jitsugyo Kk サスペンション、ヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置
JP5591602B2 (ja) 2010-06-24 2014-09-17 日本発條株式会社 フレキシャ及びその配線部形成方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796132A (en) * 1986-10-24 1989-01-03 Hitachi, Ltd. Thin film magnetic head having Au ultrasonic connection structure
US5491597A (en) * 1994-04-15 1996-02-13 Hutchinson Technology Incorporated Gimbal flexure and electrical interconnect assembly
JPH0916933A (ja) * 1995-06-28 1997-01-17 Nec Corp ヘッドジンバル組立体
US5844751A (en) * 1994-04-15 1998-12-01 Hutchinson Technology, Incorporated Laminated structures for a disk drive suspension assembly
US5995328A (en) * 1996-10-03 1999-11-30 Quantum Corporation Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
US6125015A (en) * 1998-12-04 2000-09-26 Read-Rite Corporation Head gimbal assembly with low stiffness flex circuit and ESD Protection
JP2001067635A (ja) * 1999-08-26 2001-03-16 Nitto Denko Corp 磁気ヘッドサスペンション装置
US6249404B1 (en) * 1999-02-04 2001-06-19 Read-Rite Corporation Head gimbal assembly with a flexible printed circuit having a serpentine substrate
WO2001086641A1 (en) * 2000-05-09 2001-11-15 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245489A (en) * 1990-10-04 1993-09-14 Hitachi, Ltd. Guide arm with a fixed printed circuit board for magnetic disk drive
JP2934126B2 (ja) * 1993-08-10 1999-08-16 富士通株式会社 磁気ディスク装置用の磁気ヘッドユニット
JP2995164B2 (ja) * 1997-07-23 1999-12-27 サンコール株式会社 磁気ヘッドスライダ支持機構及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796132A (en) * 1986-10-24 1989-01-03 Hitachi, Ltd. Thin film magnetic head having Au ultrasonic connection structure
US5491597A (en) * 1994-04-15 1996-02-13 Hutchinson Technology Incorporated Gimbal flexure and electrical interconnect assembly
US5844751A (en) * 1994-04-15 1998-12-01 Hutchinson Technology, Incorporated Laminated structures for a disk drive suspension assembly
JPH0916933A (ja) * 1995-06-28 1997-01-17 Nec Corp ヘッドジンバル組立体
US5995328A (en) * 1996-10-03 1999-11-30 Quantum Corporation Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
US6125015A (en) * 1998-12-04 2000-09-26 Read-Rite Corporation Head gimbal assembly with low stiffness flex circuit and ESD Protection
US6249404B1 (en) * 1999-02-04 2001-06-19 Read-Rite Corporation Head gimbal assembly with a flexible printed circuit having a serpentine substrate
JP2001067635A (ja) * 1999-08-26 2001-03-16 Nitto Denko Corp 磁気ヘッドサスペンション装置
WO2001086641A1 (en) * 2000-05-09 2001-11-15 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit

Also Published As

Publication number Publication date
CN1202516C (zh) 2005-05-18
US20020030940A1 (en) 2002-03-14
US6667857B2 (en) 2003-12-23
JP3738679B2 (ja) 2006-01-25
JP2002092834A (ja) 2002-03-29
CN1345033A (zh) 2002-04-17
HK1044621A1 (zh) 2002-10-25

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