SG106129A1 - Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method - Google Patents

Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method

Info

Publication number
SG106129A1
SG106129A1 SG200300824A SG200300824A SG106129A1 SG 106129 A1 SG106129 A1 SG 106129A1 SG 200300824 A SG200300824 A SG 200300824A SG 200300824 A SG200300824 A SG 200300824A SG 106129 A1 SG106129 A1 SG 106129A1
Authority
SG
Singapore
Prior art keywords
mask
substrate
storage box
apparatus adapted
transfer
Prior art date
Application number
SG200300824A
Other languages
English (en)
Inventor
Gert-Jan Heerens
De Ven Bastiaan Lambertus Van
Robert Gabriel Mari Lansbergen
Erik Leonardus Ham
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG106129A1 publication Critical patent/SG106129A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Library & Information Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200300824A 2002-03-01 2003-02-27 Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method SG106129A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02075883 2002-03-01

Publications (1)

Publication Number Publication Date
SG106129A1 true SG106129A1 (en) 2004-09-30

Family

ID=29558351

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200300824A SG106129A1 (en) 2002-03-01 2003-02-27 Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method

Country Status (6)

Country Link
US (1) US6753945B2 (ko)
JP (1) JP4030452B2 (ko)
KR (1) KR100588121B1 (ko)
CN (1) CN1474233A (ko)
SG (1) SG106129A1 (ko)
TW (1) TWI247337B (ko)

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DE10261775A1 (de) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
US20050169730A1 (en) * 2003-04-30 2005-08-04 Ravinder Aggarwal Semiconductor processing tool front end interface with sealing capability
US7026581B2 (en) * 2003-08-22 2006-04-11 Axcelis Technologies, Inc. Apparatus for positioning an elevator tube
KR101421398B1 (ko) 2003-09-29 2014-07-18 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
WO2005047981A2 (en) * 2003-11-10 2005-05-26 Nikon Corporation Thermophoretic techniques for protecting reticles from contaminants
WO2005119368A2 (en) 2004-06-04 2005-12-15 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
US20060033905A1 (en) * 2004-08-16 2006-02-16 Mahmood Toofan Pellicle-reticle methods with reduced haze or wrinkle formation
EP1786342A1 (en) * 2004-09-07 2007-05-23 Smith and Nephew, Inc. Minimal thickness bone plate locking mechanism
US7477358B2 (en) * 2004-09-28 2009-01-13 Nikon Corporation EUV reticle handling system and method
JP2006128188A (ja) * 2004-10-26 2006-05-18 Nikon Corp 基板搬送装置、基板搬送方法および露光装置
JP4710308B2 (ja) * 2004-10-29 2011-06-29 株式会社ニコン レチクル搬送装置、露光装置、及びレチクルの搬送方法
US7428958B2 (en) * 2004-11-15 2008-09-30 Nikon Corporation Substrate conveyor apparatus, substrate conveyance method and exposure apparatus
TWI447840B (zh) * 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置
US20060201958A1 (en) * 2005-02-27 2006-09-14 Tieben Anthony M Mask container
JP4667140B2 (ja) * 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
US7665981B2 (en) 2005-08-25 2010-02-23 Molecular Imprints, Inc. System to transfer a template transfer body between a motion stage and a docking plate
US7808616B2 (en) * 2005-12-28 2010-10-05 Nikon Corporation Reticle transport apparatus, exposure apparatus, reticle transport method, and reticle processing method
US7773198B2 (en) * 2006-03-28 2010-08-10 Nikon Corporation Filtered device container assembly with shield for a reticle
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
US20080128303A1 (en) * 2006-12-05 2008-06-05 Nikon Corporation Device container assembly with adjustable retainers for a reticle
WO2008151095A2 (en) * 2007-05-30 2008-12-11 Blueshift Technologies, Inc. Vacuum substrate storage
JP5516968B2 (ja) * 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
KR101293025B1 (ko) 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
US8968971B2 (en) 2013-03-08 2015-03-03 Micro Lithography, Inc. Pellicles with reduced particulates
US10459352B2 (en) 2015-08-31 2019-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Mask cleaning
WO2019091662A1 (en) * 2017-11-09 2019-05-16 Asml Netherlands B.V. Lithographic apparatus and method
KR102388390B1 (ko) * 2020-01-06 2022-04-21 세메스 주식회사 로드 포트 유닛, 이를 포함하는 저장 장치 및 배기 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026239A (en) 1988-09-06 1991-06-25 Canon Kabushiki Kaisha Mask cassette and mask cassette loading device
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US5559584A (en) * 1993-03-08 1996-09-24 Nikon Corporation Exposure apparatus
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
JP3513437B2 (ja) 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
AU4462001A (en) 2000-03-29 2001-10-08 Nikon Corporation Aligner, apparatus and method for transferring wafer, microdevice and method formanufacturing the same
US6473161B2 (en) * 2000-06-02 2002-10-29 Asml Netherlands B.V. Lithographic projection apparatus, supporting assembly and device manufacturing method

Also Published As

Publication number Publication date
JP2004006784A (ja) 2004-01-08
TW200307980A (en) 2003-12-16
US20030224295A1 (en) 2003-12-04
JP4030452B2 (ja) 2008-01-09
KR100588121B1 (ko) 2006-06-09
US6753945B2 (en) 2004-06-22
KR20030071632A (ko) 2003-09-06
TWI247337B (en) 2006-01-11
CN1474233A (zh) 2004-02-11

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