SG104316A1 - Ion beam irradiation apparatus and method of igniting a plasma for the same - Google Patents

Ion beam irradiation apparatus and method of igniting a plasma for the same

Info

Publication number
SG104316A1
SG104316A1 SG200202486A SG200202486A SG104316A1 SG 104316 A1 SG104316 A1 SG 104316A1 SG 200202486 A SG200202486 A SG 200202486A SG 200202486 A SG200202486 A SG 200202486A SG 104316 A1 SG104316 A1 SG 104316A1
Authority
SG
Singapore
Prior art keywords
igniting
plasma
same
ion beam
beam irradiation
Prior art date
Application number
SG200202486A
Inventor
Hamamoto Nariaki
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Publication of SG104316A1 publication Critical patent/SG104316A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004Charge control of objects or beams
    • H01J2237/0041Neutralising arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma Technology (AREA)
  • Electron Sources, Ion Sources (AREA)
SG200202486A 2001-04-26 2002-04-24 Ion beam irradiation apparatus and method of igniting a plasma for the same SG104316A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001129014A JP3758520B2 (en) 2001-04-26 2001-04-26 Ion beam irradiation apparatus and related method

Publications (1)

Publication Number Publication Date
SG104316A1 true SG104316A1 (en) 2004-06-21

Family

ID=18977607

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200202486A SG104316A1 (en) 2001-04-26 2002-04-24 Ion beam irradiation apparatus and method of igniting a plasma for the same

Country Status (7)

Country Link
US (1) US6548381B2 (en)
JP (1) JP3758520B2 (en)
KR (1) KR100454457B1 (en)
CN (1) CN1190821C (en)
GB (1) GB2380314B (en)
SG (1) SG104316A1 (en)
TW (1) TW556246B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003173757A (en) 2001-12-04 2003-06-20 Nissin Electric Co Ltd Ion beam irradiation device
DE10303683B4 (en) * 2003-01-30 2007-03-08 Advanced Micro Devices, Inc., Sunnyvale A method for reducing the process-induced process fluctuations during ion implantation
US7105840B2 (en) * 2005-02-03 2006-09-12 Axcelis Technologies, Inc. Ion source for use in an ion implanter
JPWO2007066606A1 (en) * 2005-12-06 2009-05-21 新明和工業株式会社 Plasma deposition system
US20070137576A1 (en) * 2005-12-19 2007-06-21 Varian Semiconductor Equipment Associates, Inc. Technique for providing an inductively coupled radio frequency plasma flood gun
US20070170995A1 (en) * 2006-01-20 2007-07-26 Dutton David T Plasma generating devices and methods for using the same
KR100819020B1 (en) * 2006-11-27 2008-04-02 세메스 주식회사 Apparatus of treating substrate using plasma
JP4001185B1 (en) 2007-03-06 2007-10-31 日新イオン機器株式会社 Plasma generator
KR101307111B1 (en) 2010-08-24 2013-09-11 닛신 이온기기 가부시기가이샤 Plasma generating apparatus
US8664861B1 (en) 2010-08-24 2014-03-04 Nissin Ion Equipment Co., Ltd. Plasma generator
US8471476B2 (en) 2010-10-08 2013-06-25 Varian Semiconductor Equipment Associates, Inc. Inductively coupled plasma flood gun using an immersed low inductance FR coil and multicusp magnetic arrangement
US20160233055A1 (en) * 2015-02-06 2016-08-11 Mks Instruments Inc. Apparatus and Method for Metastable Enhanced Plasma Ignition
CN108269488A (en) * 2018-02-08 2018-07-10 丹阳市鼎新机械设备有限公司 A kind of eyeglass alpha bombardment formula anti-fake machine
WO2023276127A1 (en) * 2021-07-01 2023-01-05 株式会社日立ハイテク Charged particle beam device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2704438B2 (en) * 1989-09-04 1998-01-26 東京エレクトロン株式会社 Ion implanter
US5466929A (en) * 1992-02-21 1995-11-14 Hitachi, Ltd. Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus
JPH07153405A (en) 1993-11-30 1995-06-16 Nissin Electric Co Ltd Plasma application device
US5565036A (en) * 1994-01-19 1996-10-15 Tel America, Inc. Apparatus and method for igniting plasma in a process module
JP3174699B2 (en) 1994-11-08 2001-06-11 三菱重工業株式会社 Ignition device for high-frequency discharge in a magnetic field
JPH10149897A (en) * 1996-11-21 1998-06-02 Sumitomo Metal Ind Ltd Plasma processing method
GB2325561B (en) * 1997-05-20 2001-10-17 Applied Materials Inc Apparatus for and methods of implanting desired chemical species in semiconductor substrates
GB9710380D0 (en) * 1997-05-20 1997-07-16 Applied Materials Inc Electron flood apparatus for neutralising charge build-up on a substrate during ion implantation
JP3608416B2 (en) * 1999-02-02 2005-01-12 日新電機株式会社 Plasma source

Also Published As

Publication number Publication date
CN1383182A (en) 2002-12-04
TW556246B (en) 2003-10-01
GB2380314A (en) 2003-04-02
KR100454457B1 (en) 2004-10-28
JP2002324511A (en) 2002-11-08
GB2380314B (en) 2003-10-08
CN1190821C (en) 2005-02-23
KR20020083934A (en) 2002-11-04
US20020164845A1 (en) 2002-11-07
JP3758520B2 (en) 2006-03-22
GB0209404D0 (en) 2002-06-05
US6548381B2 (en) 2003-04-15

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