SG10202008858YA - Electrostatic attraction method and plasma processing apparatus - Google Patents
Electrostatic attraction method and plasma processing apparatusInfo
- Publication number
- SG10202008858YA SG10202008858YA SG10202008858YA SG10202008858YA SG10202008858YA SG 10202008858Y A SG10202008858Y A SG 10202008858YA SG 10202008858Y A SG10202008858Y A SG 10202008858YA SG 10202008858Y A SG10202008858Y A SG 10202008858YA SG 10202008858Y A SG10202008858Y A SG 10202008858YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- plasma processing
- electrostatic attraction
- attraction method
- electrostatic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019165817A JP7398909B2 (ja) | 2019-09-12 | 2019-09-12 | 静電吸着方法及びプラズマ処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202008858YA true SG10202008858YA (en) | 2021-04-29 |
Family
ID=74864290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202008858YA SG10202008858YA (en) | 2019-09-12 | 2020-09-10 | Electrostatic attraction method and plasma processing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210082671A1 (ja) |
JP (1) | JP7398909B2 (ja) |
KR (1) | KR20210031608A (ja) |
CN (1) | CN112490103A (ja) |
SG (1) | SG10202008858YA (ja) |
TW (1) | TW202117839A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2022255118A1 (ja) | 2021-06-01 | 2022-12-08 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000195830A (ja) | 1998-12-28 | 2000-07-14 | Mitsubishi Electric Corp | 半導体製造装置、半導体製造装置のクリ―ニング方法、半導体装置の製造方法及び半導体装置 |
JP6346855B2 (ja) | 2014-12-25 | 2018-06-20 | 東京エレクトロン株式会社 | 静電吸着方法及び基板処理装置 |
CN106024682B (zh) | 2015-03-31 | 2020-07-21 | 松下知识产权经营株式会社 | 等离子处理装置以及等离子处理方法 |
JP6789099B2 (ja) | 2016-12-26 | 2020-11-25 | 東京エレクトロン株式会社 | 計測方法、除電方法及びプラズマ処理装置 |
JP6861579B2 (ja) | 2017-06-02 | 2021-04-21 | 東京エレクトロン株式会社 | プラズマ処理装置、静電吸着方法および静電吸着プログラム |
-
2019
- 2019-09-12 JP JP2019165817A patent/JP7398909B2/ja active Active
-
2020
- 2020-09-01 KR KR1020200110796A patent/KR20210031608A/ko unknown
- 2020-09-01 TW TW109129831A patent/TW202117839A/zh unknown
- 2020-09-04 CN CN202010921226.0A patent/CN112490103A/zh active Pending
- 2020-09-10 SG SG10202008858YA patent/SG10202008858YA/en unknown
- 2020-09-11 US US17/018,662 patent/US20210082671A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20210082671A1 (en) | 2021-03-18 |
JP2021044413A (ja) | 2021-03-18 |
CN112490103A (zh) | 2021-03-12 |
TW202117839A (zh) | 2021-05-01 |
KR20210031608A (ko) | 2021-03-22 |
JP7398909B2 (ja) | 2023-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11202005088WA (en) | Plasma processing apparatus and methods | |
SG11202000354TA (en) | Electrostatic chuck and plasma processing apparatus | |
EP3740936A4 (en) | METHOD AND DEVICE FOR ITEM PROCESSING | |
EP3880854A4 (en) | METHOD AND DEVICE FOR PROCESSING MAGNETITE | |
EP3880855A4 (en) | METHOD AND APPARATUS FOR THE TREATMENT OF MAGNETITE | |
EP3690678A4 (en) | SERVICE PROCESSING METHODS AND RELATED DEVICE | |
EP3800589A4 (en) | TASK PROCESSING PROCESS AND APPARATUS | |
EP3880853A4 (en) | METHOD AND DEVICE FOR PROCESSING MAGNETITE | |
SG10201911998QA (en) | Substrate processing method and substrate processing apparatus | |
EP3944083A4 (en) | METHOD AND APPARATUS FOR PROCESSING ASSOCIATED WITH A CARD | |
EP3844970A4 (en) | IMAGE PROCESSING APPARATUS, AND IMAGE PROCESSING METHOD THEREOF | |
EP3860013A4 (en) | METHOD AND APPARATUS FOR PROCESSING MESSAGES | |
SG10202010798QA (en) | Etching method and plasma processing apparatus | |
SG10202011423RA (en) | Substrate processing method and plasma processing apparatus | |
SG10201910303SA (en) | Plasma processing apparatus and plasma processing method | |
EP3848878A4 (en) | SERVICE PROCESSING METHOD AND DEVICE | |
SG10202011203SA (en) | Plasma processing method and plasma processing apparatus | |
SG11202004968SA (en) | Plasma etching method and plasma etching apparatus | |
SG10202005364XA (en) | Plasma processing method and plasma processing apparatus | |
SG10202004567SA (en) | Plasma processing method and plasma processing apparatus | |
ZA202103248B (en) | Method and apparatus for processing magnetite | |
GB201720265D0 (en) | Method and apparatus for cleaning a plasma processing apparatus | |
ZA202005594B (en) | Method and apparatus for processing legumes | |
SG10202009297VA (en) | Substrate support and plasma processing apparatus | |
TWI799512B (zh) | 清洗方法及電漿處理裝置 |