SG10202008582VA - Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate - Google Patents
Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateInfo
- Publication number
- SG10202008582VA SG10202008582VA SG10202008582VA SG10202008582VA SG10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA
- Authority
- SG
- Singapore
- Prior art keywords
- surface treatment
- producing
- treatment composition
- semiconductor substrate
- composition
- Prior art date
Links
- 238000004381 surface treatment Methods 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3769—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines
- C11D3/3773—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019162883 | 2019-09-06 | ||
JP2020110739A JP7495283B2 (en) | 2019-09-06 | 2020-06-26 | Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202008582VA true SG10202008582VA (en) | 2021-04-29 |
Family
ID=74863185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202008582VA SG10202008582VA (en) | 2019-09-06 | 2020-09-03 | Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7495283B2 (en) |
KR (1) | KR102515938B1 (en) |
SG (1) | SG10202008582VA (en) |
TW (1) | TW202113052A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022155989A (en) * | 2021-03-31 | 2022-10-14 | 株式会社フジミインコーポレーテッド | Substrate manufacturing method and surface treatment method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000044996A (en) | 1998-07-31 | 2000-02-15 | Showa Denko Kk | Acidic detergent |
KR101102800B1 (en) | 2004-08-31 | 2012-01-05 | 산요가세이고교 가부시키가이샤 | Surfactant |
JP4585299B2 (en) * | 2004-12-09 | 2010-11-24 | 東京応化工業株式会社 | Rinsing liquid for lithography and resist pattern forming method using the same |
JP5948758B2 (en) | 2010-08-31 | 2016-07-06 | 三菱化学株式会社 | Substrate cleaning solution for semiconductor device and cleaning method |
JP6559936B2 (en) | 2014-09-05 | 2019-08-14 | 日本キャボット・マイクロエレクトロニクス株式会社 | Slurry composition, rinse composition, substrate polishing method and rinse method |
JP6641951B2 (en) | 2015-12-07 | 2020-02-05 | 日立化成株式会社 | Cleaning liquid and cleaning method |
KR102451201B1 (en) | 2016-09-30 | 2022-10-05 | 도오꾜오까고오교 가부시끼가이샤 | Cleaning composition, cleaning method, and method of manufacturing a semiconductor |
-
2020
- 2020-06-26 JP JP2020110739A patent/JP7495283B2/en active Active
- 2020-07-24 TW TW109125106A patent/TW202113052A/en unknown
- 2020-08-20 KR KR1020200104351A patent/KR102515938B1/en active IP Right Grant
- 2020-09-03 SG SG10202008582VA patent/SG10202008582VA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202113052A (en) | 2021-04-01 |
KR102515938B1 (en) | 2023-03-31 |
KR20210029669A (en) | 2021-03-16 |
JP7495283B2 (en) | 2024-06-04 |
JP2021044537A (en) | 2021-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201708073YA (en) | Composition for treating surface of substrate, method and device | |
EP3118277A4 (en) | Method for producing surface-modified substrate, method for producing conjugate, novel hydrosilane compound, surface treatment agent, surface treatment agent kit, and surface-modified substrate | |
EP3128535A4 (en) | SURFACE TREATMENT METHOD FOR SiC SUBSTRATES, SiC SUBSTRATE, AND SEMICONDUCTOR PRODUCTION METHOD | |
EP3886161A4 (en) | Semiconductor package substrate and method for producing same | |
EP3396030A4 (en) | Semiconductor substrate, and epitaxial wafer and method for producing same | |
SG10201907085QA (en) | Semiconductor substrate processing method | |
EP3258483A4 (en) | Method for polishing silicon wafer and surface treatment composition | |
EP4130224A4 (en) | Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition | |
EP3879010A4 (en) | Sic semiconductor substrate, and, production method therefor and production device therefor | |
EP3936643A4 (en) | Method and apparatus for producing sic substrate | |
GB201917734D0 (en) | Method, substrate and apparatus | |
EP3640973A4 (en) | Wide-gap semiconductor substrate, apparatus for manufacturing wide-gap semiconductor substrate, and method for manufacturing wide-gap semiconductor substrate | |
EP3657533A4 (en) | Method for polishing substrate, and polishing composition set | |
IL277045A (en) | Composition having suppressed alumina damage and production method for semiconductor substrate using same | |
EP3675604A4 (en) | Method for producing ceramic substrate, and ceramic substrate | |
EP3653762A4 (en) | Semiconductor substrate, semiconductor element and method for producing semiconductor substrate | |
SG10202008582VA (en) | Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate | |
SG11202000620SA (en) | Substrate treatment apparatus, method for manufacturing semiconductor device, and program | |
EP3979314A4 (en) | Thermally-conductive silicone composition, semiconductor device, and production method therefor | |
EP3702049A4 (en) | Method for producing film formation substrate, film formation substrate, and surface treatment agent | |
EP4044212A4 (en) | Semiconductor substrate, manufacturing method therefor, and semiconductor device | |
EP3570316A4 (en) | Group iii-nitride semiconductor substrate, and method for manufacturing group iii-nitride semiconductor substrate | |
EP3637484A4 (en) | Semiconductor substrate and method for producing same, substrate, and laminate | |
EP4075480A4 (en) | Semiconductor device manufacturing method, substrate treatment device, and program | |
EP4050132A4 (en) | Semiconductor substrate manufacturing method and semiconductor substrate |