SG10202008582VA - Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate - Google Patents

Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate

Info

Publication number
SG10202008582VA
SG10202008582VA SG10202008582VA SG10202008582VA SG10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA SG 10202008582V A SG10202008582V A SG 10202008582VA
Authority
SG
Singapore
Prior art keywords
surface treatment
producing
treatment composition
semiconductor substrate
composition
Prior art date
Application number
SG10202008582VA
Inventor
Yoshino Tsutomu
Onishi Shogo
Ishida Yasuto
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG10202008582VA publication Critical patent/SG10202008582VA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/37Polymers
    • C11D3/3746Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3769(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines
    • C11D3/3773(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines in liquid compositions
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2003Alcohols; Phenols
    • C11D3/2065Polyhydric alcohols
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
SG10202008582VA 2019-09-06 2020-09-03 Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate SG10202008582VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019162883 2019-09-06
JP2020110739A JP7495283B2 (en) 2019-09-06 2020-06-26 Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate

Publications (1)

Publication Number Publication Date
SG10202008582VA true SG10202008582VA (en) 2021-04-29

Family

ID=74863185

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202008582VA SG10202008582VA (en) 2019-09-06 2020-09-03 Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate

Country Status (4)

Country Link
JP (1) JP7495283B2 (en)
KR (1) KR102515938B1 (en)
SG (1) SG10202008582VA (en)
TW (1) TW202113052A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022155989A (en) * 2021-03-31 2022-10-14 株式会社フジミインコーポレーテッド Substrate manufacturing method and surface treatment method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044996A (en) 1998-07-31 2000-02-15 Showa Denko Kk Acidic detergent
KR101102800B1 (en) 2004-08-31 2012-01-05 산요가세이고교 가부시키가이샤 Surfactant
JP4585299B2 (en) * 2004-12-09 2010-11-24 東京応化工業株式会社 Rinsing liquid for lithography and resist pattern forming method using the same
JP5948758B2 (en) 2010-08-31 2016-07-06 三菱化学株式会社 Substrate cleaning solution for semiconductor device and cleaning method
JP6559936B2 (en) 2014-09-05 2019-08-14 日本キャボット・マイクロエレクトロニクス株式会社 Slurry composition, rinse composition, substrate polishing method and rinse method
JP6641951B2 (en) 2015-12-07 2020-02-05 日立化成株式会社 Cleaning liquid and cleaning method
KR102451201B1 (en) 2016-09-30 2022-10-05 도오꾜오까고오교 가부시끼가이샤 Cleaning composition, cleaning method, and method of manufacturing a semiconductor

Also Published As

Publication number Publication date
TW202113052A (en) 2021-04-01
KR102515938B1 (en) 2023-03-31
KR20210029669A (en) 2021-03-16
JP7495283B2 (en) 2024-06-04
JP2021044537A (en) 2021-03-18

Similar Documents

Publication Publication Date Title
SG11201708073YA (en) Composition for treating surface of substrate, method and device
EP3118277A4 (en) Method for producing surface-modified substrate, method for producing conjugate, novel hydrosilane compound, surface treatment agent, surface treatment agent kit, and surface-modified substrate
EP3128535A4 (en) SURFACE TREATMENT METHOD FOR SiC SUBSTRATES, SiC SUBSTRATE, AND SEMICONDUCTOR PRODUCTION METHOD
EP3886161A4 (en) Semiconductor package substrate and method for producing same
EP3396030A4 (en) Semiconductor substrate, and epitaxial wafer and method for producing same
SG10201907085QA (en) Semiconductor substrate processing method
EP3258483A4 (en) Method for polishing silicon wafer and surface treatment composition
EP4130224A4 (en) Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition
EP3879010A4 (en) Sic semiconductor substrate, and, production method therefor and production device therefor
EP3936643A4 (en) Method and apparatus for producing sic substrate
GB201917734D0 (en) Method, substrate and apparatus
EP3640973A4 (en) Wide-gap semiconductor substrate, apparatus for manufacturing wide-gap semiconductor substrate, and method for manufacturing wide-gap semiconductor substrate
EP3657533A4 (en) Method for polishing substrate, and polishing composition set
IL277045A (en) Composition having suppressed alumina damage and production method for semiconductor substrate using same
EP3675604A4 (en) Method for producing ceramic substrate, and ceramic substrate
EP3653762A4 (en) Semiconductor substrate, semiconductor element and method for producing semiconductor substrate
SG10202008582VA (en) Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
SG11202000620SA (en) Substrate treatment apparatus, method for manufacturing semiconductor device, and program
EP3979314A4 (en) Thermally-conductive silicone composition, semiconductor device, and production method therefor
EP3702049A4 (en) Method for producing film formation substrate, film formation substrate, and surface treatment agent
EP4044212A4 (en) Semiconductor substrate, manufacturing method therefor, and semiconductor device
EP3570316A4 (en) Group iii-nitride semiconductor substrate, and method for manufacturing group iii-nitride semiconductor substrate
EP3637484A4 (en) Semiconductor substrate and method for producing same, substrate, and laminate
EP4075480A4 (en) Semiconductor device manufacturing method, substrate treatment device, and program
EP4050132A4 (en) Semiconductor substrate manufacturing method and semiconductor substrate