SG10202006474TA - Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making - Google Patents

Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

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Publication number
SG10202006474TA
SG10202006474TA SG10202006474TA SG10202006474TA SG10202006474TA SG 10202006474T A SG10202006474T A SG 10202006474TA SG 10202006474T A SG10202006474T A SG 10202006474TA SG 10202006474T A SG10202006474T A SG 10202006474TA SG 10202006474T A SG10202006474T A SG 10202006474TA
Authority
SG
Singapore
Prior art keywords
die
making
ultrafine pitch
architecture
ultrathin
Prior art date
Application number
SG10202006474TA
Other languages
English (en)
Inventor
Sanka Ganesan
Kevin Mccarthy
Leigh M Tribolet
Debendra Mallik
Ravindranath V Mahajan
Robert L Sankman
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG10202006474TA publication Critical patent/SG10202006474TA/en

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  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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