SG10202000778YA - Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus - Google Patents

Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus

Info

Publication number
SG10202000778YA
SG10202000778YA SG10202000778YA SG10202000778YA SG10202000778YA SG 10202000778Y A SG10202000778Y A SG 10202000778YA SG 10202000778Y A SG10202000778Y A SG 10202000778YA SG 10202000778Y A SG10202000778Y A SG 10202000778YA SG 10202000778Y A SG10202000778Y A SG 10202000778YA
Authority
SG
Singapore
Prior art keywords
cleaning member
cleaning
attaching part
substrate
member assembly
Prior art date
Application number
SG10202000778YA
Inventor
Shuji Uozumi
Toru Maruyama
Yasuyuki Motoshima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202000778YA publication Critical patent/SG10202000778YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/02—Brushes with driven brush bodies or carriers power-driven carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/02—Brushes with driven brush bodies or carriers power-driven carriers
    • A46B13/04—Brushes with driven brush bodies or carriers power-driven carriers with reservoir or other means for supplying substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202000778YA 2019-02-04 2020-01-28 Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus SG10202000778YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019017549 2019-02-04

Publications (1)

Publication Number Publication Date
SG10202000778YA true SG10202000778YA (en) 2020-09-29

Family

ID=71901188

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202000778YA SG10202000778YA (en) 2019-02-04 2020-01-28 Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus

Country Status (4)

Country Link
US (2) US20200276619A1 (en)
JP (1) JP2020127009A (en)
CN (1) CN111524829A (en)
SG (1) SG10202000778YA (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478625B2 (en) 2020-08-25 2024-05-07 株式会社荏原製作所 SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE C
CN112735940B (en) * 2020-12-15 2023-01-03 华海清科股份有限公司 Dynamically adjustable wafer cleaning method
CN113243834B (en) * 2021-03-10 2022-12-06 北京顺造科技有限公司 Rolling brush assembly, cleaning head device, cleaning equipment and method
CN113059006B (en) * 2021-05-10 2022-06-07 新疆八一钢铁股份有限公司 Hot rolling surface detector water proof device
CN113327841B (en) * 2021-05-28 2022-07-29 华海清科股份有限公司 Wafer cleaning system and cleaning method capable of keeping cleaning roller clean

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6520191B1 (en) * 1998-10-19 2003-02-18 Memc Electronic Materials, Inc. Carrier for cleaning silicon wafers
JP2001246331A (en) * 2000-03-08 2001-09-11 Sharp Corp Cleaning device
KR100685919B1 (en) * 2000-12-29 2007-02-22 엘지.필립스 엘시디 주식회사 Cleaning Device
US20060254625A1 (en) * 2005-05-16 2006-11-16 Innolux Display Corp. Sprayer and cleaning apparatus using the same
JP4516508B2 (en) * 2005-10-13 2010-08-04 株式会社日立ハイテクノロジーズ Disc cleaning device
US20070095367A1 (en) * 2005-10-28 2007-05-03 Yaxin Wang Apparatus and method for atomic layer cleaning and polishing
KR100924863B1 (en) * 2007-12-24 2009-11-02 주식회사 동부하이텍 Wet cleaning apparatus for manufacturing a semiconductor device
KR20110107910A (en) * 2010-03-26 2011-10-05 주식회사 케이씨텍 Contact type cleaning device
CN202398555U (en) * 2011-12-30 2012-08-29 中芯国际集成电路制造(上海)有限公司 Cleaning brush and cleaning device
JP5886224B2 (en) * 2012-05-23 2016-03-16 株式会社荏原製作所 Substrate cleaning method
JP6163081B2 (en) * 2013-11-05 2017-07-12 アイオン株式会社 Brush roller
CN208177975U (en) * 2018-03-09 2018-12-04 洛阳尚德太阳能电力有限公司 A kind of novel water spray roller bearing

Also Published As

Publication number Publication date
US20200276619A1 (en) 2020-09-03
US20230356267A1 (en) 2023-11-09
JP2020127009A (en) 2020-08-20
CN111524829A (en) 2020-08-11

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