SG10201913577PA - Bulk acoustic wave resonator with ceramic substrate - Google Patents
Bulk acoustic wave resonator with ceramic substrateInfo
- Publication number
- SG10201913577PA SG10201913577PA SG10201913577PA SG10201913577PA SG10201913577PA SG 10201913577P A SG10201913577P A SG 10201913577PA SG 10201913577P A SG10201913577P A SG 10201913577PA SG 10201913577P A SG10201913577P A SG 10201913577PA SG 10201913577P A SG10201913577P A SG 10201913577PA
- Authority
- SG
- Singapore
- Prior art keywords
- acoustic wave
- ceramic substrate
- wave resonator
- bulk acoustic
- bulk
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
- H03H9/605—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862785906P | 2018-12-28 | 2018-12-28 | |
| US201862785958P | 2018-12-28 | 2018-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201913577PA true SG10201913577PA (en) | 2020-07-29 |
Family
ID=71121868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201913577PA SG10201913577PA (en) | 2018-12-28 | 2019-12-27 | Bulk acoustic wave resonator with ceramic substrate |
Country Status (3)
| Country | Link |
|---|---|
| US (4) | US11424732B2 (en) |
| JP (1) | JP2020109958A (en) |
| SG (1) | SG10201913577PA (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG10201905013VA (en) | 2018-06-11 | 2020-01-30 | Skyworks Solutions Inc | Acoustic wave device with spinel layer |
| US12063027B2 (en) | 2018-11-21 | 2024-08-13 | Skyworks Solutions, Inc. | Acoustic wave device with ceramic substrate |
| US11424732B2 (en) | 2018-12-28 | 2022-08-23 | Skyworks Global Pte. Ltd. | Acoustic wave devices with common ceramic substrate |
| US11502667B2 (en) | 2019-01-14 | 2022-11-15 | Qorvo Us, Inc. | Top electrodes with step arrangements for bulk acoustic wave resonators |
| US11876501B2 (en) | 2019-02-26 | 2024-01-16 | Skyworks Solutions, Inc. | Acoustic wave device with multi-layer substrate including ceramic |
| US11323097B2 (en) | 2019-07-24 | 2022-05-03 | Skyworks Solutions, Inc. | Bulk acoustic wave filters on shared die |
| US12081189B2 (en) * | 2019-11-21 | 2024-09-03 | Skyworks Solutions, Inc. | Packaged bulk acoustic wave resonator on acoustic wave device |
| DE102021209875A1 (en) * | 2020-09-18 | 2022-03-24 | Skyworks Global Pte. Ltd. | VOLUME WAVE ACOUSTIC DEVICE WITH RAISED FRAME STRUCTURE |
| US20230006651A1 (en) * | 2021-06-30 | 2023-01-05 | Skyworks Solutions, Inc. | Multiplexer with acoustic assisted trap circuit |
| WO2023121738A2 (en) * | 2021-09-28 | 2023-06-29 | Northeastern University | Two-dimensional resonant rod-based delay line with high bandwidth |
| US20220103157A1 (en) * | 2021-11-26 | 2022-03-31 | Newsonic Technologies | Lithium niobate or lithium tantalate fbar structure and fabricating method thereof |
| US20220131527A1 (en) * | 2021-12-28 | 2022-04-28 | Newsonic Technologies | Fbar structure having single crystalline piezoelectric layer and fabricating method thereof |
| US11463070B2 (en) * | 2022-01-18 | 2022-10-04 | Shenzhen Newsonic Technologies Co., Ltd. | FBAR structure and manufacturing method of same |
| CN114793102B (en) * | 2022-04-13 | 2023-05-12 | 苏州汉天下电子有限公司 | Bulk acoustic wave resonator group, preparation method, bulk acoustic wave filter and communication device |
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| US3996535A (en) | 1975-07-09 | 1976-12-07 | Rca Corporation | Microwave bulk acoustic delay device having two transducers on the same surface and method of making same |
| US4347210A (en) * | 1980-05-09 | 1982-08-31 | Raytheon Company | Method of forging spinel domes |
| US5233259A (en) | 1991-02-19 | 1993-08-03 | Westinghouse Electric Corp. | Lateral field FBAR |
| FI113111B (en) | 2000-11-24 | 2004-02-27 | Nokia Corp | Filter structure and arrangement comprising piezoelectric resonators |
| JP4766831B2 (en) | 2002-11-26 | 2011-09-07 | 株式会社村田製作所 | Manufacturing method of electronic parts |
| US7280007B2 (en) * | 2004-11-15 | 2007-10-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Thin film bulk acoustic resonator with a mass loaded perimeter |
| JP2007221189A (en) * | 2006-02-14 | 2007-08-30 | Toshiba Corp | Thin film piezoelectric resonator and thin film piezoelectric resonator filter |
| JP5322597B2 (en) | 2008-11-13 | 2013-10-23 | 太陽誘電株式会社 | Resonator, filter, duplexer and electronic device |
| JP5549167B2 (en) | 2009-09-18 | 2014-07-16 | 住友電気工業株式会社 | SAW device |
| CN102498667A (en) | 2009-09-18 | 2012-06-13 | 住友电气工业株式会社 | Substrate, manufacturing method of substrate, saw device, and device |
| JP6017868B2 (en) * | 2011-11-04 | 2016-11-02 | 太陽誘電株式会社 | Demultiplexer, filter and communication module |
| JP2013223025A (en) * | 2012-04-13 | 2013-10-28 | Taiyo Yuden Co Ltd | Filter device, method of manufacturing filter device, and duplexer |
| DE112013003488B4 (en) | 2012-07-12 | 2021-08-19 | Ngk Insulators, Ltd. | COMPOSITE SUBSTRATE, PIEZOELECTRIC DEVICE, AND METHOD FOR MANUFACTURING A COMPOSITE SUBSTRATE |
| US9246533B2 (en) | 2012-10-18 | 2016-01-26 | Skyworks Panasonic Filter Solutions Japan Co., Ltd. | Electronic device including filter |
| JP6336817B2 (en) | 2014-05-12 | 2018-06-06 | 太陽誘電株式会社 | Elastic wave device and manufacturing method thereof |
| JP6603012B2 (en) * | 2014-05-21 | 2019-11-06 | 太陽誘電株式会社 | Duplexer |
| US9571063B2 (en) | 2014-10-28 | 2017-02-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator device with structures having different apodized shapes |
| US10374574B2 (en) * | 2015-12-08 | 2019-08-06 | Skyworks Solutions, Inc. | Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer |
| JP6635794B2 (en) | 2016-01-12 | 2020-01-29 | 太陽誘電株式会社 | Elastic wave device and method of manufacturing the same |
| US20170288121A1 (en) * | 2016-03-31 | 2017-10-05 | Avago Technologies General Ip (Singapore) Pte. Ltd | Acoustic resonator including composite polarity piezoelectric layer having opposite polarities |
| JP6556094B2 (en) * | 2016-05-11 | 2019-08-07 | 太陽誘電株式会社 | Filters and multiplexers |
| JP6757594B2 (en) * | 2016-05-18 | 2020-09-23 | 太陽誘電株式会社 | Piezoelectric thin film resonators, filters and multiplexers |
| CN107424985B (en) | 2016-05-23 | 2019-09-27 | 台达电子工业股份有限公司 | Power module |
| US11095266B2 (en) * | 2016-10-07 | 2021-08-17 | Qorvo Us, Inc. | Slanted apodization for acoustic wave devices |
| JP6580020B2 (en) * | 2016-12-05 | 2019-09-25 | 太陽誘電株式会社 | Electronic components |
| JP6556113B2 (en) | 2016-12-21 | 2019-08-07 | 太陽誘電株式会社 | Piezoelectric thin film resonator, filter and multiplexer |
| US10483248B2 (en) | 2017-03-23 | 2019-11-19 | Skyworks Solutions, Inc. | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias |
| JP6903471B2 (en) | 2017-04-07 | 2021-07-14 | 太陽誘電株式会社 | Piezoelectric thin film resonators, filters and multiplexers |
| SG10201901768XA (en) | 2018-03-02 | 2019-10-30 | Skyworks Solutions Inc | Lamb Wave Loop Circuit For Acoustic Wave Filter |
| CN109245742B (en) * | 2018-11-27 | 2024-03-01 | 杭州左蓝微电子技术有限公司 | Film bulk acoustic wave combined resonator based on surface acoustic wave and solid reflection layer |
| US11424732B2 (en) | 2018-12-28 | 2022-08-23 | Skyworks Global Pte. Ltd. | Acoustic wave devices with common ceramic substrate |
| US12081189B2 (en) * | 2019-11-21 | 2024-09-03 | Skyworks Solutions, Inc. | Packaged bulk acoustic wave resonator on acoustic wave device |
-
2019
- 2019-12-23 US US16/726,107 patent/US11424732B2/en active Active
- 2019-12-23 US US16/726,058 patent/US11349454B2/en active Active
- 2019-12-23 US US16/726,072 patent/US11387808B2/en active Active
- 2019-12-25 JP JP2019233705A patent/JP2020109958A/en active Pending
- 2019-12-27 SG SG10201913577PA patent/SG10201913577PA/en unknown
-
2022
- 2022-07-29 US US17/877,075 patent/US20220368311A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US11349454B2 (en) | 2022-05-31 |
| JP2020109958A (en) | 2020-07-16 |
| US20220368311A1 (en) | 2022-11-17 |
| US11387808B2 (en) | 2022-07-12 |
| US20200212884A1 (en) | 2020-07-02 |
| US11424732B2 (en) | 2022-08-23 |
| US20200212882A1 (en) | 2020-07-02 |
| US20200212878A1 (en) | 2020-07-02 |
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