SG10201912415WA - Resin Composition For Cleaning Die - Google Patents

Resin Composition For Cleaning Die

Info

Publication number
SG10201912415WA
SG10201912415WA SG10201912415WA SG10201912415WA SG10201912415WA SG 10201912415W A SG10201912415W A SG 10201912415WA SG 10201912415W A SG10201912415W A SG 10201912415WA SG 10201912415W A SG10201912415W A SG 10201912415WA SG 10201912415W A SG10201912415W A SG 10201912415WA
Authority
SG
Singapore
Prior art keywords
resin composition
cleaning die
die
cleaning
resin
Prior art date
Application number
SG10201912415WA
Other languages
English (en)
Inventor
Fukunishi Youichi
Yoshimura Katsunori
Nomura Hiroaki
Hiromitsu Kiyohito
Original Assignee
Nippon Carbide Industries Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Industries Co Inc filed Critical Nippon Carbide Industries Co Inc
Publication of SG10201912415WA publication Critical patent/SG10201912415WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F3/00—Compounds containing elements of Groups 2 or 12 of the Periodic Table
    • C07F3/06—Zinc compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16—Fibres; Fibrils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Reinforced Plastic Materials (AREA)
SG10201912415WA 2015-08-07 2016-08-04 Resin Composition For Cleaning Die SG10201912415WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015157474 2015-08-07
JP2016143701A JP6803165B2 (ja) 2015-08-07 2016-07-21 金型清掃用樹脂組成物

Publications (1)

Publication Number Publication Date
SG10201912415WA true SG10201912415WA (en) 2020-02-27

Family

ID=58048495

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201912415WA SG10201912415WA (en) 2015-08-07 2016-08-04 Resin Composition For Cleaning Die
SG10201606440PA SG10201606440PA (en) 2015-08-07 2016-08-04 Resin Composition For Cleaning Die

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201606440PA SG10201606440PA (en) 2015-08-07 2016-08-04 Resin Composition For Cleaning Die

Country Status (5)

Country Link
JP (1) JP6803165B2 (ja)
KR (1) KR102525580B1 (ja)
CN (1) CN106433021B (ja)
SG (2) SG10201912415WA (ja)
TW (1) TWI702131B (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742409B2 (ja) * 1987-11-27 1995-05-10 株式会社東芝 金型清掃体及び金型清掃方法
JP3781445B2 (ja) * 1994-08-24 2006-05-31 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP3270312B2 (ja) * 1995-10-24 2002-04-02 日本カーバイド工業株式会社 金型清掃用樹脂組成物タブレット
WO2002030648A1 (fr) * 2000-10-11 2002-04-18 Nippon Carbide Kogyo Kabushiki Kaisha Composition a base de resine pour le nettoyage de moules
TWI223657B (en) * 2000-10-18 2004-11-11 Chang Chun Plastics Co Ltd Amino resin composition for the cleaning of the mold
KR100905843B1 (ko) * 2002-01-21 2009-07-02 닛뽕 카바이도 고교 가부시키가이샤 금형 청소용 수지 조성물
JP4948541B2 (ja) * 2006-10-27 2012-06-06 日本カーバイド工業株式会社 金型清掃用及び離型回復用樹脂組成物並びに金型清掃及び金型離型回復方法
MY154931A (en) * 2007-03-30 2015-08-28 Nippon Carbide Kogyo Kk Mold conditioning resin composition and method of mold conditioning
SG11201404265PA (en) * 2012-01-23 2014-10-30 Nippon Carbide Kogyo Kk Resin composition for cleaning die
JP2014019861A (ja) * 2012-07-24 2014-02-03 Nikougiken Co Ltd 複合結晶性ポリマーと複合結晶性ポリマー製品

Also Published As

Publication number Publication date
TWI702131B (zh) 2020-08-21
KR102525580B1 (ko) 2023-04-25
SG10201606440PA (en) 2017-03-30
JP6803165B2 (ja) 2020-12-23
TW201707920A (zh) 2017-03-01
KR20170017732A (ko) 2017-02-15
JP2017035881A (ja) 2017-02-16
CN106433021A (zh) 2017-02-22
CN106433021B (zh) 2020-08-14

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