SG10201912382TA - Memory device, method of forming the same, method for controlling the same and memory array - Google Patents

Memory device, method of forming the same, method for controlling the same and memory array

Info

Publication number
SG10201912382TA
SG10201912382TA SG10201912382TA SG10201912382TA SG10201912382TA SG 10201912382T A SG10201912382T A SG 10201912382TA SG 10201912382T A SG10201912382T A SG 10201912382TA SG 10201912382T A SG10201912382T A SG 10201912382TA SG 10201912382T A SG10201912382T A SG 10201912382TA
Authority
SG
Singapore
Prior art keywords
same
controlling
forming
memory device
memory array
Prior art date
Application number
SG10201912382TA
Inventor
Putu Andhita Dananjaya
Wen Siang Lew
Original Assignee
Univ Nanyang Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nanyang Tech filed Critical Univ Nanyang Tech
Publication of SG10201912382TA publication Critical patent/SG10201912382TA/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0011RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • H10N70/066Shaping switching materials by filling of openings, e.g. damascene method
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/24Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/24Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H10N70/245Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8822Sulfides, e.g. CuS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8825Selenides, e.g. GeSe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/883Oxides or nitrides
    • H10N70/8833Binary metal oxides, e.g. TaOx
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/10Resistive cells; Technology aspects
    • G11C2213/15Current-voltage curve
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/50Resistive cell structure aspects
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • H10N70/8416Electrodes adapted for supplying ionic species

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
SG10201912382TA 2016-09-29 2017-09-12 Memory device, method of forming the same, method for controlling the same and memory array SG10201912382TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201608151Q 2016-09-29

Publications (1)

Publication Number Publication Date
SG10201912382TA true SG10201912382TA (en) 2020-02-27

Family

ID=61760036

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201900437YA SG11201900437YA (en) 2016-09-29 2017-09-12 Memory device, method of forming the same, method for controlling the same and memory array
SG10201912382TA SG10201912382TA (en) 2016-09-29 2017-09-12 Memory device, method of forming the same, method for controlling the same and memory array

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201900437YA SG11201900437YA (en) 2016-09-29 2017-09-12 Memory device, method of forming the same, method for controlling the same and memory array

Country Status (3)

Country Link
US (1) US20190272874A1 (en)
SG (2) SG11201900437YA (en)
WO (1) WO2018063093A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10879460B2 (en) * 2018-02-21 2020-12-29 Univerzita Pardubice Method of forming a metallic conductive filament and a random access memory device for carrying out the method
US11158788B2 (en) * 2018-10-30 2021-10-26 International Business Machines Corporation Atomic layer deposition and physical vapor deposition bilayer for additive patterning
US10885979B2 (en) * 2019-04-09 2021-01-05 International Business Machines Corporation Paired intercalation cells for drift migration
US11444125B2 (en) 2020-06-17 2022-09-13 Globalfoundries Singapore Pte. Ltd. Memory devices and methods of forming memory devices
CN112490358A (en) * 2020-11-27 2021-03-12 西安交通大学 High-stability multi-resistance-state memristor based on series structure and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102449702B (en) * 2009-05-29 2015-05-20 于利奇研究中心有限公司 Memory element, stacking, memory matrix and method for operation
US20110084248A1 (en) * 2009-10-13 2011-04-14 Nanya Technology Corporation Cross point memory array devices
US8395926B2 (en) * 2010-06-18 2013-03-12 Sandisk 3D Llc Memory cell with resistance-switching layers and lateral arrangement
FR2973554B1 (en) * 2011-04-04 2013-04-12 Commissariat Energie Atomique "SELECTOR-TYPE ELECTRONIC DEVICE"
US9373786B1 (en) * 2013-01-23 2016-06-21 Adesto Technologies Corporation Two terminal resistive access devices and methods of formation thereof
US9425237B2 (en) * 2014-03-11 2016-08-23 Crossbar, Inc. Selector device for two-terminal memory

Also Published As

Publication number Publication date
US20190272874A1 (en) 2019-09-05
SG11201900437YA (en) 2019-02-27
WO2018063093A1 (en) 2018-04-05

Similar Documents

Publication Publication Date Title
EP3427263A4 (en) Apparatuses and methods for logic/memory devices
EP3562213C0 (en) Access control method and device
EP3413634A4 (en) Device access controlling method, and related device and system
GB2546654B (en) Array antenna apparatus and method for manufacturing the same
SG11201706914TA (en) Memory device controlling method and memory device
EP3311288A4 (en) Shared memory controller and method of using same
SG10201700013VA (en) Semiconductor memory device and method for manufacturing same
EP3507805A4 (en) Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory
EP3518286A4 (en) Memory device
EP3718111A4 (en) Apparatuses and methods including memory commands for semiconductor memories
SG10201909446PA (en) Semiconductor memory device and method for forming the same
EP3539130A4 (en) Apparatuses and methods for memory alignment
SG10201912041UA (en) Memory device and method of forming the same
EP3404661A4 (en) Flash memory device refreshing method and apparatus
EP3245106A4 (en) Device and method of controlling the device
EP3211536A4 (en) Memory controller, memory system, and memory controller control method
IL262824A (en) Method, array and use thereof
SG10201912382TA (en) Memory device, method of forming the same, method for controlling the same and memory array
EP3255553A4 (en) Transmission control method and device for direct memory access
GB201718338D0 (en) Controller and method
SG10201506399TA (en) Earset and control method for the same
EP3692533A4 (en) Apparatuses and methods including memory commands for semiconductor memories
EP3217406A4 (en) Memory management method and device, and memory controller
SG10201501819SA (en) Semiconductor device and control method of the same
KR101748949B9 (en) semiconductor memory device and method of fabricating the same