SG10201911815YA - Baffle unit and substrate processing apparatus including the same - Google Patents
Baffle unit and substrate processing apparatus including the sameInfo
- Publication number
- SG10201911815YA SG10201911815YA SG10201911815YA SG10201911815YA SG10201911815YA SG 10201911815Y A SG10201911815Y A SG 10201911815YA SG 10201911815Y A SG10201911815Y A SG 10201911815YA SG 10201911815Y A SG10201911815Y A SG 10201911815YA SG 10201911815Y A SG10201911815Y A SG 10201911815YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- same
- substrate processing
- apparatus including
- baffle unit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190145721A KR102225657B1 (en) | 2019-11-14 | 2019-11-14 | Baffle unit, substrate processing apparatus including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201911815YA true SG10201911815YA (en) | 2021-06-29 |
Family
ID=75147738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201911815YA SG10201911815YA (en) | 2019-11-14 | 2019-12-09 | Baffle unit and substrate processing apparatus including the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210151299A1 (en) |
JP (2) | JP6981460B2 (en) |
KR (1) | KR102225657B1 (en) |
CN (1) | CN112802730B (en) |
SG (1) | SG10201911815YA (en) |
TW (1) | TWI716204B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240098299A (en) * | 2022-12-21 | 2024-06-28 | 피에스케이 주식회사 | Substrate processing apparatus and baffles |
CN117612978B (en) * | 2024-01-23 | 2024-04-05 | 上海邦芯半导体科技有限公司 | Air inlet device and air inlet method |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0689457B2 (en) * | 1987-12-14 | 1994-11-09 | 古河電気工業株式会社 | Shower electrode for plasma CVD equipment |
US5589002A (en) * | 1994-03-24 | 1996-12-31 | Applied Materials, Inc. | Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing |
JPH0845910A (en) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | Plasma treatment device |
JP3290036B2 (en) * | 1994-10-18 | 2002-06-10 | 菱電セミコンダクタシステムエンジニアリング株式会社 | Dry etching apparatus and dry etching method |
JPH09223685A (en) * | 1996-02-14 | 1997-08-26 | Sony Corp | Plasma processing apparatus and plasma processing method |
US6335293B1 (en) * | 1998-07-13 | 2002-01-01 | Mattson Technology, Inc. | Systems and methods for two-sided etch of a semiconductor substrate |
KR100290511B1 (en) * | 1999-03-27 | 2001-05-15 | 윤영세 | A separated upper electrode |
JP3317935B2 (en) * | 1999-09-01 | 2002-08-26 | 九州日本電気株式会社 | Plasma processing equipment |
JP4669137B2 (en) * | 2001-02-16 | 2011-04-13 | 東京エレクトロン株式会社 | Dividable electrode and plasma processing apparatus using the electrode |
JP4115337B2 (en) * | 2003-05-30 | 2008-07-09 | 俊夫 後藤 | Plasma processing equipment |
KR100893955B1 (en) * | 2004-02-19 | 2009-04-20 | 도쿄엘렉트론가부시키가이샤 | Method for cleaning treatment chamber in substrate treating apparatus and method for detecting endpoint of cleaning |
US20050241767A1 (en) * | 2004-04-30 | 2005-11-03 | Ferris David S | Multi-piece baffle plate assembly for a plasma processing system |
JP4877748B2 (en) * | 2006-03-31 | 2012-02-15 | 東京エレクトロン株式会社 | Substrate processing apparatus and processing gas discharge mechanism |
US8715455B2 (en) * | 2007-02-06 | 2014-05-06 | Tokyo Electron Limited | Multi-zone gas distribution system for a treatment system |
JPWO2008114363A1 (en) * | 2007-03-16 | 2010-06-24 | 富士通マイクロエレクトロニクス株式会社 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
US8419854B2 (en) * | 2007-04-17 | 2013-04-16 | Ulvac, Inc. | Film-forming apparatus |
CN101548364B (en) * | 2007-08-28 | 2013-02-06 | 东京毅力科创株式会社 | Top panel and plasma processing apparatus |
JP2012519956A (en) * | 2009-03-03 | 2012-08-30 | ジュソン エンジニアリング カンパニー リミテッド | Gas distribution apparatus and substrate processing apparatus having the same |
KR101234594B1 (en) * | 2011-07-25 | 2013-02-19 | 피에스케이 주식회사 | Baffle and substrate treating apparatus including the baffle |
KR101505536B1 (en) * | 2012-05-14 | 2015-03-25 | 피에스케이 주식회사 | A baffle and an apparatus for treating a substrate with the baffle |
JP2014075234A (en) * | 2012-10-03 | 2014-04-24 | Tokyo Electron Ltd | Antenna and plasma processing apparatus |
US9245761B2 (en) * | 2013-04-05 | 2016-01-26 | Lam Research Corporation | Internal plasma grid for semiconductor fabrication |
KR101505948B1 (en) * | 2013-12-16 | 2015-03-26 | 피에스케이 주식회사 | A baffle assembly and an apparatus for treating a substrate with the baffle |
JP2016039356A (en) * | 2014-08-06 | 2016-03-22 | ピーエスケー・インコーポレーテッド | Baffle and substrate treating apparatus including the same |
KR20180014900A (en) * | 2016-08-01 | 2018-02-12 | 세메스 주식회사 | Apparatus for treating substrate |
KR101932117B1 (en) * | 2017-08-11 | 2018-12-24 | 피에스케이 주식회사 | Substrate treating apparatus, substrate treating method and plasma generating unit |
-
2019
- 2019-11-14 KR KR1020190145721A patent/KR102225657B1/en active IP Right Grant
- 2019-11-27 TW TW108143187A patent/TWI716204B/en active
- 2019-12-03 US US16/701,235 patent/US20210151299A1/en not_active Abandoned
- 2019-12-05 JP JP2019220680A patent/JP6981460B2/en active Active
- 2019-12-09 SG SG10201911815YA patent/SG10201911815YA/en unknown
- 2019-12-24 CN CN201911346015.2A patent/CN112802730B/en active Active
-
2021
- 2021-07-08 JP JP2021113318A patent/JP7190540B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP7190540B2 (en) | 2022-12-15 |
CN112802730B (en) | 2024-03-12 |
KR102225657B1 (en) | 2021-03-10 |
TWI716204B (en) | 2021-01-11 |
TW202119872A (en) | 2021-05-16 |
CN112802730A (en) | 2021-05-14 |
JP6981460B2 (en) | 2021-12-15 |
JP2021082798A (en) | 2021-05-27 |
JP2021180318A (en) | 2021-11-18 |
US20210151299A1 (en) | 2021-05-20 |
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