SG10201901030TA - Insulation layer etchant composition and method of forming pattern using the same - Google Patents
Insulation layer etchant composition and method of forming pattern using the sameInfo
- Publication number
- SG10201901030TA SG10201901030TA SG10201901030TA SG10201901030TA SG10201901030TA SG 10201901030T A SG10201901030T A SG 10201901030TA SG 10201901030T A SG10201901030T A SG 10201901030TA SG 10201901030T A SG10201901030T A SG 10201901030TA SG 10201901030T A SG10201901030T A SG 10201901030TA
- Authority
- SG
- Singapore
- Prior art keywords
- silane compound
- insulation layer
- etchant composition
- same
- forming pattern
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 229910000077 silane Inorganic materials 0.000 abstract 7
- -1 silane compound Chemical class 0.000 abstract 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20180017450 | 2018-02-13 | ||
| KR1020180138844A KR20190098030A (ko) | 2018-02-13 | 2018-11-13 | 절연막 식각액 조성물 및 이를 이용한 패턴 형성 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201901030TA true SG10201901030TA (en) | 2019-09-27 |
Family
ID=67808091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201901030TA SG10201901030TA (en) | 2018-02-13 | 2019-02-07 | Insulation layer etchant composition and method of forming pattern using the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20190098030A (ko) |
| SG (1) | SG10201901030TA (ko) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100823461B1 (ko) | 2007-05-11 | 2008-04-21 | 테크노세미켐 주식회사 | 실리콘산화막 및 실리콘질화막 식각용 식각액 조성물 |
-
2018
- 2018-11-13 KR KR1020180138844A patent/KR20190098030A/ko unknown
-
2019
- 2019-02-07 SG SG10201901030TA patent/SG10201901030TA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190098030A (ko) | 2019-08-21 |
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