SG10201900413YA - Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium - Google Patents

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Info

Publication number
SG10201900413YA
SG10201900413YA SG10201900413YA SG10201900413YA SG10201900413YA SG 10201900413Y A SG10201900413Y A SG 10201900413YA SG 10201900413Y A SG10201900413Y A SG 10201900413YA SG 10201900413Y A SG10201900413Y A SG 10201900413YA SG 10201900413Y A SG10201900413Y A SG 10201900413YA
Authority
SG
Singapore
Prior art keywords
transfer
shelf
region
vessels
processing apparatus
Prior art date
Application number
SG10201900413YA
Inventor
Takeshi Ito
Takayuki Nakada
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Publication of SG10201900413YA publication Critical patent/SG10201900413YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/12—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface comprising a series of individual load-carriers fixed, or normally fixed, relative to traction element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0407—Storage devices mechanical using stacker cranes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

There is provided a substrate processing apparatus including: a transfer region communicating with a process chamber where substrates are processed; a first shelf region installed above the transfer region and having a first shelf storing transfer vessels accommodating the substrates; a second shelf region installed below a stage part where the vessels to be transferred to and from an external device are loaded, and having a second shelf stacking and storing the transfer vessels; and a transfer vessel transfer robot installed inside a housing accommodating the transfer region, the first shelf region and the second shelf region and transferring the vessels to and from the stage part, the first shelf, the second shelf, and the transfer region. The transfer vessel transfer robot includes: a main body base part; a first table part; a first driving part; a second table part; a second driving part; and a vessel support part. FIGURE 3
SG10201900413YA 2018-01-17 2019-01-16 Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium SG10201900413YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018005411A JP6704423B2 (en) 2018-01-17 2018-01-17 Substrate processing apparatus, semiconductor device manufacturing method, and program

Publications (1)

Publication Number Publication Date
SG10201900413YA true SG10201900413YA (en) 2019-08-27

Family

ID=67212666

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900413YA SG10201900413YA (en) 2018-01-17 2019-01-16 Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Country Status (6)

Country Link
US (1) US11211277B2 (en)
JP (1) JP6704423B2 (en)
KR (1) KR102198732B1 (en)
CN (1) CN110047791B (en)
SG (1) SG10201900413YA (en)
TW (1) TWI763945B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227782B2 (en) * 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645355B2 (en) * 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
US6009890A (en) * 1997-01-21 2000-01-04 Tokyo Electron Limited Substrate transporting and processing system
US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
JP4266197B2 (en) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 Vertical heat treatment equipment
KR100739632B1 (en) * 2005-12-21 2007-07-13 삼성전자주식회사 Equipment for testing a semiconductor module
JP2007331906A (en) * 2006-06-16 2007-12-27 Murata Mach Ltd Overhead traveling vehicle system
US7833351B2 (en) * 2006-06-26 2010-11-16 Applied Materials, Inc. Batch processing platform for ALD and CVD
JP2008004898A (en) * 2006-06-26 2008-01-10 Future Vision:Kk Substrate transport apparatus, substrate transport method, and substrate processing system
JP2008056474A (en) * 2006-09-04 2008-03-13 Murata Mach Ltd Automated warehouse
US8814488B2 (en) * 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
JP5164416B2 (en) 2007-04-16 2013-03-21 株式会社日立国際電気 Substrate processing apparatus, storage container transport method, and semiconductor device manufacturing method
JP2009010009A (en) * 2007-06-26 2009-01-15 Hitachi Kokusai Electric Inc Substrate processing apparatus and fabrication process of semiconductor device
JP4464993B2 (en) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 Substrate processing system
US20090022575A1 (en) * 2007-07-19 2009-01-22 Asyst Shinko. Inc. Article storing apparatus
JP5635270B2 (en) * 2009-02-13 2014-12-03 株式会社日立国際電気 Substrate processing apparatus, substrate processing system, display method of substrate processing apparatus, parameter setting method of substrate processing apparatus, and recording medium
JP2011129679A (en) 2009-12-17 2011-06-30 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP5592826B2 (en) 2011-03-29 2014-09-17 オリンパスメディカルシステムズ株式会社 Pneumoperitoneum
JP2014060338A (en) * 2012-09-19 2014-04-03 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP6031304B2 (en) * 2012-09-19 2016-11-24 株式会社日立国際電気 Substrate processing apparatus and substrate processing method
WO2014104895A1 (en) * 2012-12-31 2014-07-03 Asm Ip Holding B.V. Semiconductor processing assembly and facility
JP6278751B2 (en) 2014-03-04 2018-02-14 東京エレクトロン株式会社 Transport method and substrate processing apparatus
JP6275824B2 (en) * 2014-03-20 2018-02-07 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
WO2016152721A1 (en) * 2015-03-25 2016-09-29 株式会社日立国際電気 Substrate processing device and semiconductor device manufacturing method
JP6505001B2 (en) * 2015-11-18 2019-04-24 東京エレクトロン株式会社 Wafer boat support and heat treatment apparatus using the same

Also Published As

Publication number Publication date
CN110047791A (en) 2019-07-23
KR20190088023A (en) 2019-07-25
JP2019125703A (en) 2019-07-25
TW201932396A (en) 2019-08-16
CN110047791B (en) 2023-10-24
JP6704423B2 (en) 2020-06-03
US11211277B2 (en) 2021-12-28
TWI763945B (en) 2022-05-11
US20190221453A1 (en) 2019-07-18
KR102198732B1 (en) 2021-01-05

Similar Documents

Publication Publication Date Title
WO2019036145A3 (en) High pressure and high temperature anneal chamber
PT1925577E (en) Method for forming a back-to-back wafer batch to be positioned in a process boat and handling system for forming the back-to-back wafer batch
TW200633058A (en) Film forming method, film forming system and recording medium
US10607870B2 (en) Substrate carrier for active/passive bonding and de-bonding of a substrate
SG11201808114VA (en) Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
JP2007273620A (en) Substrate conveyor and substrate processing apparatus
TW200519012A (en) Glass substrate transporting facility
WO2015156968A1 (en) Methods and apparatus for rapidly cooling a substrate
SG10201900413YA (en) Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
JP2018206803A (en) Method of operating electrostatic chuck of plasma processing apparatus
EP4099366A3 (en) System for the flux free processing of a plurality of solder balls on a wafer
TW202347565A (en) Substrate transfer mechanism to reduce back-side substrate contact
WO2019152751A3 (en) Interchangeable edge rings for stabilizing wafer placement and system using same
TW201611154A (en) Wafer loading and unloading
TWD218093S (en) Part of wafer boat for substrate processing equipment
US20190259647A1 (en) Deposition ring for processing reduced size substrates
KR20130120857A (en) Robot for transferring substrate, multi chamber substrate processing apparatus using the same, and control method therefor
US20210118648A1 (en) Substrate processing system and method for replacing edge ring
US11978654B2 (en) Substrate processing apparatus
JP2015159185A (en) Substrate processing device and substrate processing method
JP2019026465A (en) Conveyance system and substrate processing system
JP6275824B2 (en) Substrate processing apparatus, semiconductor device manufacturing method, and program
JP2012084654A (en) Dry etching device and neutralization method of substrate
JP2014207338A (en) Substrate holding device, substrate processing apparatus using the same, and substrate holding method
JP2021145017A (en) Substrate transfer system, vacuum substrate transfer module, and substrate transfer method