SG10201808647YA - Plating apparatus and plating method - Google Patents

Plating apparatus and plating method

Info

Publication number
SG10201808647YA
SG10201808647YA SG10201808647YA SG10201808647YA SG10201808647YA SG 10201808647Y A SG10201808647Y A SG 10201808647YA SG 10201808647Y A SG10201808647Y A SG 10201808647YA SG 10201808647Y A SG10201808647Y A SG 10201808647YA SG 10201808647Y A SG10201808647Y A SG 10201808647YA
Authority
SG
Singapore
Prior art keywords
plating
plating solution
solution
bath
paddle
Prior art date
Application number
SG10201808647YA
Other languages
English (en)
Inventor
Hua Chang Shao
Hirao Tomonori
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201808647YA publication Critical patent/SG10201808647YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
SG10201808647YA 2017-10-12 2018-10-01 Plating apparatus and plating method SG10201808647YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017198557A JP6986921B2 (ja) 2017-10-12 2017-10-12 めっき装置及びめっき方法

Publications (1)

Publication Number Publication Date
SG10201808647YA true SG10201808647YA (en) 2019-05-30

Family

ID=66095653

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201808647YA SG10201808647YA (en) 2017-10-12 2018-10-01 Plating apparatus and plating method

Country Status (6)

Country Link
US (1) US11098413B2 (zh)
JP (1) JP6986921B2 (zh)
KR (1) KR102512401B1 (zh)
CN (1) CN109652851B (zh)
SG (1) SG10201808647YA (zh)
TW (1) TWI772529B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10865496B2 (en) * 2018-10-30 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Plating apparatus and plating method
JP7183111B2 (ja) * 2019-05-17 2022-12-05 株式会社荏原製作所 めっき方法、めっき用の不溶性アノード、及びめっき装置
CN114855244A (zh) * 2021-02-04 2022-08-05 盛美半导体设备(上海)股份有限公司 电镀装置及电镀方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
US6544391B1 (en) * 2000-10-17 2003-04-08 Semitool, Inc. Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
US6514391B2 (en) * 2001-06-07 2003-02-04 Jason Ko Electroplating apparatus with conducting nets for distributing evenly anode current
KR101027489B1 (ko) * 2002-07-18 2011-04-06 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법
JP4365143B2 (ja) * 2003-06-16 2009-11-18 株式会社荏原製作所 めっき用処理液の撹拌方法及びめっき用処理装置
JP4878866B2 (ja) * 2006-02-22 2012-02-15 イビデン株式会社 めっき装置及びめっき方法
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
GB2500163B (en) * 2011-08-18 2016-02-24 Nexeon Ltd Method
JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
JP2014237865A (ja) * 2013-06-06 2014-12-18 株式会社荏原製作所 電解銅めっき装置

Also Published As

Publication number Publication date
KR20190041400A (ko) 2019-04-22
CN109652851A (zh) 2019-04-19
US11098413B2 (en) 2021-08-24
TWI772529B (zh) 2022-08-01
US20190112727A1 (en) 2019-04-18
KR102512401B1 (ko) 2023-03-22
JP6986921B2 (ja) 2021-12-22
CN109652851B (zh) 2022-03-25
TW201923163A (zh) 2019-06-16
JP2019073742A (ja) 2019-05-16

Similar Documents

Publication Publication Date Title
SG10201808647YA (en) Plating apparatus and plating method
TW201611909A (en) Chemical liquid discharge mechanism, liquid processing apparatus, chemical liquid discharge method, and storage medium
EA201890349A1 (ru) Дуплексная нержавеющая сталь и ее применение
CL2015002032A1 (es) Dispositivo de tratamiento de liquido
EP2868778A3 (en) Plating bath and method
EA036231B9 (ru) Генератор нанопузырьков и способ генерирования нанопузырьков
MY179007A (en) Spraying apparatus
EA201790643A1 (ru) Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
GB201211557D0 (en) Microfluidic surface processing device and method
PH12017500597A1 (en) Copper-nickel alloy electroplating apparatus
MY201553A (en) Electrodepositing apparatus and preparation of rare earth permanent magnet
SA518400347B1 (ar) إنتاج اليوريا مع البيوريت المُتحكم فيه
NZ721224A (en) A method of shutting down an operating three-phase slurry bubble column reactor
WO2016020692A3 (en) Apparatus and method for water treatment by an advanced oxidation process
ZA201902895B (en) Apparatus and method of forming a chemical solution
PH12019501620A1 (en) Method and device for manufacturing black plated steel sheet
MX2016017107A (es) Premezclas estructurantes que comprenden agentes de estructuracion no polimericos, cristalinos, que contienen hidroxilo y un alquilsulfato, y composiciones que las comprenden.
RS53766B1 (en) WATER CLEANING PROCEDURE AND COLLOID TREATMENT DEVICE
TW201611907A (en) Coater, coating device and coating method
MY195775A (en) Module For Chemically Processing a Substrate
MX2017015035A (es) Aparato y metodo para procesar agua blanca en una maquina de papel.
MY193144A (en) Composition for fine bubble production, and generation apparatus
RU2014145378A (ru) Способ подготовки рабочей среды для электрических видов обработки и устройство для его осуществления
SG10201911492VA (en) Liquid flow generation apparatus and method, and method of priming the liquid flow generation apparatus
MY193246A (en) High phosphorus electroless nickel