SG10201806123RA - Method of manufacturing substrate for acoustic wave device - Google Patents
Method of manufacturing substrate for acoustic wave deviceInfo
- Publication number
- SG10201806123RA SG10201806123RA SG10201806123RA SG10201806123RA SG10201806123RA SG 10201806123R A SG10201806123R A SG 10201806123RA SG 10201806123R A SG10201806123R A SG 10201806123RA SG 10201806123R A SG10201806123R A SG 10201806123RA SG 10201806123R A SG10201806123R A SG 10201806123RA
- Authority
- SG
- Singapore
- Prior art keywords
- material layer
- piezoelectric material
- acoustic wave
- wave device
- removal amount
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 8
- 238000005498 polishing Methods 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/66—Phase shifters
- H03H9/68—Phase shifters using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Abstract
METHOD OF MANUFACTURING SUBSTRATE FOR ACOUSTIC WAVE DEVICE A method of manufacturing a substrate for an acoustic wave device includes: a substrate joining step of joining a piezoelectric material layer to a surface on one side of a support substrate; a grinding step of grinding the piezoelectric material layer; a removal amount map forming step of measuring in-plane thickness of the piezoelectric material layer by an optical thickness meter, and calculating a removal amount for the piezoelectric material layer for adjusting thickness variability of the piezoelectric material layer to or below a threshold on the basis of each coordinate in the plane, to form a removal amount map; a laser processing step of applying a pulsed laser beam of such a wavelength as to be absorbed in the piezoelectric material layer, to selectively remove the piezoelectric material layer, based on the removal amount map; and a polishing step of polishing the surface of the piezoelectric material layer. (Figure 3)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017150237A JP2019029941A (en) | 2017-08-02 | 2017-08-02 | Manufacturing method of substrate for elastic wave device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201806123RA true SG10201806123RA (en) | 2019-03-28 |
Family
ID=65020126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201806123RA SG10201806123RA (en) | 2017-08-02 | 2018-07-17 | Method of manufacturing substrate for acoustic wave device |
Country Status (7)
Country | Link |
---|---|
US (1) | US11165408B2 (en) |
JP (1) | JP2019029941A (en) |
KR (1) | KR20190014476A (en) |
CN (1) | CN109391241A (en) |
DE (1) | DE102018212493A1 (en) |
SG (1) | SG10201806123RA (en) |
TW (1) | TWI761547B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6654435B2 (en) * | 2016-01-07 | 2020-02-26 | 株式会社ディスコ | Wafer generation method |
WO2020189115A1 (en) * | 2019-03-15 | 2020-09-24 | 日本電気硝子株式会社 | Composite substrate, electronic device, method for manufacturing composite substrate, and method for manufacturing electronic device |
US20230175834A1 (en) * | 2020-06-01 | 2023-06-08 | Lg Electronics Inc. | Thin film characteristic measuring apparatus |
TWI806615B (en) * | 2022-05-19 | 2023-06-21 | 國立清華大學 | Filter and manufacturing method thereof |
CN115229647B (en) * | 2022-07-20 | 2023-08-29 | 华侨大学 | Device for polishing diamond with assistance of femtosecond laser and polishing method thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5389196A (en) * | 1992-01-30 | 1995-02-14 | Massachusetts Institute Of Technology | Methods for fabricating three-dimensional micro structures |
JPH0927645A (en) * | 1995-05-08 | 1997-01-28 | Matsushita Electric Ind Co Ltd | Manufacture of composite substrate and piezoelectric element using that |
JP3168961B2 (en) * | 1997-10-06 | 2001-05-21 | 住友電気工業株式会社 | Diamond substrate, method for evaluating diamond substrate, and diamond surface acoustic wave filter |
FR2788176B1 (en) | 1998-12-30 | 2001-05-25 | Thomson Csf | GUIDED ACOUSTIC WAVE DEVICE IN A THIN LAYER OF PIEZOELECTRIC MATERIAL ADHESED BY A MOLECULAR ADHESIVE ONTO A CARRIER SUBSTRATE AND MANUFACTURING METHOD |
JP4529262B2 (en) * | 2000-09-14 | 2010-08-25 | ソニー株式会社 | High frequency module device and manufacturing method thereof |
JP4627269B2 (en) * | 2006-02-24 | 2011-02-09 | 日本碍子株式会社 | Method for manufacturing piezoelectric thin film device |
JP5016876B2 (en) * | 2006-09-06 | 2012-09-05 | 株式会社ディスコ | Via hole processing method |
JP5384313B2 (en) * | 2008-12-24 | 2014-01-08 | 日本碍子株式会社 | Composite substrate manufacturing method and composite substrate |
KR20110020741A (en) * | 2009-08-24 | 2011-03-03 | 엔지케이 인슐레이터 엘티디 | Method for manufacturing composite substrate |
JP6092535B2 (en) * | 2012-07-04 | 2017-03-08 | 太陽誘電株式会社 | Lamb wave device and manufacturing method thereof |
DE112013006227T5 (en) * | 2012-12-26 | 2015-10-01 | Ngk Insulators, Ltd. | Composite substrate, manufacturing method thereof, and acoustic wave device |
JP6230422B2 (en) * | 2014-01-15 | 2017-11-15 | 株式会社ディスコ | Wafer processing method |
JP6226774B2 (en) | 2014-02-25 | 2017-11-08 | 日本碍子株式会社 | Composite substrate manufacturing method and composite substrate |
JP6324796B2 (en) * | 2014-04-21 | 2018-05-16 | 株式会社ディスコ | Single crystal substrate processing method |
JP2017005158A (en) * | 2015-06-12 | 2017-01-05 | 株式会社ディスコ | Method for grinding rear surface of wafer |
JP2017046225A (en) * | 2015-08-27 | 2017-03-02 | 株式会社ディスコ | Baw device and manufacturing method of the same |
TWI599445B (en) * | 2015-09-15 | 2017-09-21 | Ngk Insulators Ltd | Method of manufacturing a composite substrate |
DE112016000125B4 (en) * | 2015-09-15 | 2020-06-25 | Ngk Insulators, Ltd. | Composite substrate and thickness trend estimation method for a piezoelectric substrate |
-
2017
- 2017-08-02 JP JP2017150237A patent/JP2019029941A/en active Pending
-
2018
- 2018-07-05 TW TW107123298A patent/TWI761547B/en active
- 2018-07-17 SG SG10201806123RA patent/SG10201806123RA/en unknown
- 2018-07-23 US US16/042,097 patent/US11165408B2/en active Active
- 2018-07-26 DE DE102018212493.0A patent/DE102018212493A1/en active Pending
- 2018-07-31 KR KR1020180089092A patent/KR20190014476A/en not_active Application Discontinuation
- 2018-08-01 CN CN201810865015.2A patent/CN109391241A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102018212493A1 (en) | 2019-02-07 |
KR20190014476A (en) | 2019-02-12 |
TW201919336A (en) | 2019-05-16 |
US20190044494A1 (en) | 2019-02-07 |
CN109391241A (en) | 2019-02-26 |
US11165408B2 (en) | 2021-11-02 |
TWI761547B (en) | 2022-04-21 |
JP2019029941A (en) | 2019-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201806123RA (en) | Method of manufacturing substrate for acoustic wave device | |
SG131773A1 (en) | Method of dividing a non-metal substrate | |
MX2018000096A (en) | Methods of manufacturing security documents and security devices. | |
TW201613710A (en) | Method and device for laser-based machining of planar, crystalline substrates, in particular of semiconductor substrates | |
MY180611A (en) | Sic substrate separating method | |
CL2015003682A1 (en) | Procedure and device for manufacturing a three-dimensional surface structure of a compression tool. | |
SG10201804904YA (en) | Wafer producing apparatus | |
TW200717661A (en) | Method and apparatus for laser annealing | |
TW200705681A (en) | Image sensor package, optical glass used thereby, and processing method thereof | |
MY172341A (en) | Semiconductor-processing pressure-sensitive adhesive tape | |
SG11201810733PA (en) | Hybrid structure for surface acoustic wave device | |
SG10201807751QA (en) | Wafer processing method | |
SG10201902671UA (en) | Wafer processing method | |
TW201412446A (en) | Method of cutting a non-metallic material along a curved line | |
SG10201807747VA (en) | Wafer processing method | |
PH12015000103A1 (en) | Processing method for stacked substrate | |
SG154390A1 (en) | Wafer processing method for processing wafer having bumps formed thereon | |
JP2010192884A5 (en) | ||
JP6267505B2 (en) | Laser dicing method | |
JP6471491B2 (en) | Scribing method | |
JP2019087604A5 (en) | ||
KR102345239B9 (en) | Thin film glass cutting and cutting surface shape processing method using laser | |
SG10201807754PA (en) | Wafer processing method | |
RU2016108114A (en) | DEVICE HOUSING AND METHOD OF ITS PROCESSING, DEVICE | |
MX2016015360A (en) | Deposition of integrated computational elements (ice) using a translation stage. |