SG10201803162TA - Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas - Google Patents
Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmasInfo
- Publication number
- SG10201803162TA SG10201803162TA SG10201803162TA SG10201803162TA SG10201803162TA SG 10201803162T A SG10201803162T A SG 10201803162TA SG 10201803162T A SG10201803162T A SG 10201803162TA SG 10201803162T A SG10201803162T A SG 10201803162TA SG 10201803162T A SG10201803162T A SG 10201803162TA
- Authority
- SG
- Singapore
- Prior art keywords
- mole
- oxide
- molar concentration
- concentration ranging
- ceramic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
- C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32495—Means for protecting the vessel against plasma
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structural Engineering (AREA)
- Composite Materials (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
APPARATUSAND METHOD WHICH REDUCE THE EROSION RATE OF SURFACES EXPOSED TO HALOGEN-CONTAINING PLASMAS [0092] OF THE DISCLOSURE 2 [0093] A ceramic article which is resistant to erosion by halogen-containing 3 plasmas used in semiconductor processing. The ceramic article includes ceramic which 4 is multi-phased, typically including two phases to three phases. In a first embodiment, 5 the ceramic is formed from yttrium oxide at a molar concentration ranging from about 50 6 mole % to about 75 mole %; zirconium oxide at a molar concentration ranging from 7 about 10 mole % to about 30 mole %; and at least one other component, selected from the 8 group consisting of aluminum oxide, hafrtium oxide, scandium oxide, neodymium oxide, 9 niobium oxide, samarium oxide, ytterbium oxide, erbium oxide, cerium oxide, and 10 combinations thereof, at a molar concentration ranging from about 10 mole % to about 30 11 xnole%. In a second embodiment, the ceramic article includes ceramic which is formed 12 from yttrium oxide at a molar concentration ranging from about 90 mole % to about 70 13 mole % and zirconium oxide at a molar concentration ranging from about 10 mole % to 14 about 30 mole %,, wherein a mean grain size of said ceramic ranges from about 2 |im to 15 about 8 [im. In a third embodiment, the ceramic article includes ceramic which is formed 16 from zirconium oxide at a molar concentration ranging from about 96 mole % to about 94 17 mole %, and yttrium oxide at a molar concentration ranging from about 4 mole % to 18 about 6 mole %. Figure 2C 32
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/796,211 US7696117B2 (en) | 2007-04-27 | 2007-04-27 | Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
US11/796,210 US20080264564A1 (en) | 2007-04-27 | 2007-04-27 | Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201803162TA true SG10201803162TA (en) | 2018-06-28 |
Family
ID=39691093
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508616SA SG10201508616SA (en) | 2007-04-27 | 2008-04-24 | Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
SG10201803162TA SG10201803162TA (en) | 2007-04-27 | 2008-04-24 | Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
SG200803151-0A SG142320A1 (en) | 2007-04-27 | 2008-04-24 | Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508616SA SG10201508616SA (en) | 2007-04-27 | 2008-04-24 | Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200803151-0A SG142320A1 (en) | 2007-04-27 | 2008-04-24 | Apparatus and method which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1988187A3 (en) |
JP (7) | JP4975676B2 (en) |
KR (6) | KR100917292B1 (en) |
CN (1) | CN103102157A (en) |
SG (3) | SG10201508616SA (en) |
TW (11) | TWI562205B (en) |
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2007
- 2007-07-04 TW TW103132298A patent/TWI562205B/en active
- 2007-07-04 TW TW107103413A patent/TWI654159B/en active
- 2007-07-04 TW TW107103418A patent/TWI654160B/en active
- 2007-07-04 TW TW105136802A patent/TWI628154B/en active
- 2007-07-04 TW TW096124359A patent/TWI351057B/en active
- 2007-07-04 TW TW109115828A patent/TWI744898B/en active
- 2007-07-04 TW TW108104769A patent/TWI695822B/en active
- 2007-07-04 CN CN2012105926835A patent/CN103102157A/en active Pending
- 2007-07-04 TW TW107103401A patent/TWI654158B/en active
- 2007-07-04 TW TW100117999A patent/TWI483291B/en active
- 2007-07-04 TW TW104122059A patent/TWI571452B/en active
- 2007-07-04 TW TW103132299A patent/TWI567793B/en active
- 2007-07-23 KR KR1020070073619A patent/KR100917292B1/en active IP Right Grant
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2008
- 2008-04-07 JP JP2008099381A patent/JP4975676B2/en active Active
- 2008-04-22 EP EP08154940A patent/EP1988187A3/en not_active Withdrawn
- 2008-04-24 SG SG10201508616SA patent/SG10201508616SA/en unknown
- 2008-04-24 SG SG10201803162TA patent/SG10201803162TA/en unknown
- 2008-04-24 SG SG200803151-0A patent/SG142320A1/en unknown
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2009
- 2009-02-26 KR KR1020090016418A patent/KR101365139B1/en active IP Right Grant
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2012
- 2012-01-06 JP JP2012001609A patent/JP5805545B2/en active Active
- 2012-12-20 KR KR1020120149865A patent/KR101428646B1/en active IP Right Grant
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2013
- 2013-08-26 KR KR1020130101297A patent/KR101441865B1/en active IP Right Grant
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2014
- 2014-01-24 KR KR20140008866A patent/KR101491568B1/en active IP Right Grant
- 2014-07-09 KR KR1020140086042A patent/KR101456539B1/en active IP Right Grant
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2015
- 2015-05-28 JP JP2015108229A patent/JP6314110B2/en active Active
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2016
- 2016-01-15 JP JP2016006345A patent/JP6259844B2/en active Active
- 2016-12-09 JP JP2016239304A patent/JP2017095350A/en active Pending
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2018
- 2018-11-20 JP JP2018217295A patent/JP2019069891A/en active Pending
- 2018-11-21 JP JP2018218140A patent/JP2019069892A/en active Pending
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