SG10201703546TA - Substrate washing device - Google Patents

Substrate washing device

Info

Publication number
SG10201703546TA
SG10201703546TA SG10201703546TA SG10201703546TA SG10201703546TA SG 10201703546T A SG10201703546T A SG 10201703546TA SG 10201703546T A SG10201703546T A SG 10201703546TA SG 10201703546T A SG10201703546T A SG 10201703546TA SG 10201703546T A SG10201703546T A SG 10201703546TA
Authority
SG
Singapore
Prior art keywords
washing device
substrate washing
substrate
washing
Prior art date
Application number
SG10201703546TA
Inventor
Koichi Fukaya
Tomoatsu Ishibashi
Hisajiro Nakano
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016093755A external-priority patent/JP2017204495A/en
Priority claimed from JP2016093756A external-priority patent/JP6612176B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201703546TA publication Critical patent/SG10201703546TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG10201703546TA 2016-05-09 2017-05-02 Substrate washing device SG10201703546TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016093755A JP2017204495A (en) 2016-05-09 2016-05-09 Substrate cleaning device
JP2016093756A JP6612176B2 (en) 2016-05-09 2016-05-09 Substrate cleaning device

Publications (1)

Publication Number Publication Date
SG10201703546TA true SG10201703546TA (en) 2017-12-28

Family

ID=60244084

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202003568XA SG10202003568XA (en) 2016-05-09 2017-05-02 Substrate washing device
SG10201703546TA SG10201703546TA (en) 2016-05-09 2017-05-02 Substrate washing device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10202003568XA SG10202003568XA (en) 2016-05-09 2017-05-02 Substrate washing device

Country Status (5)

Country Link
US (1) US10991602B2 (en)
KR (1) KR102338647B1 (en)
CN (1) CN107393846B (en)
SG (2) SG10202003568XA (en)
TW (1) TWI772294B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818987A (en) * 2018-08-23 2018-11-16 重庆市嘉凌新科技有限公司 Chip cutting cleaning equipment
CN110112084A (en) * 2019-05-22 2019-08-09 长江存储科技有限责任公司 Semicoductor device washing apparatus
JP7285166B2 (en) * 2019-08-20 2023-06-01 株式会社荏原製作所 SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
JP2021048336A (en) * 2019-09-20 2021-03-25 三菱電機株式会社 Processing liquid generating method, processing liquid generating mechanism, semiconductor manufacturing apparatus and semiconductor manufacturing method
JP7013520B2 (en) * 2020-04-24 2022-01-31 株式会社スギノマシン Cleaning method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60876A (en) 1983-05-27 1985-01-05 Nomura Micro Sci Kk Method and device for producing ultra-pure water having low specific resistance used for washing of wafer, or the like
JP3315611B2 (en) * 1996-12-02 2002-08-19 三菱電機株式会社 Two-fluid jet nozzle for cleaning, cleaning device, and semiconductor device
JP2000070887A (en) 1998-09-03 2000-03-07 Dainippon Screen Mfg Co Ltd Supply of pure water containing carbon dioxide gas dissolved therein, unit for supplying pure water containing carbon dioxide gas dissolved therein, and substrate processing apparatus equipped with the same
JP3824510B2 (en) 2001-08-24 2006-09-20 大日本スクリーン製造株式会社 Substrate processing equipment
JP2003093943A (en) * 2001-09-26 2003-04-02 Dainippon Screen Mfg Co Ltd Apparatus and method for treating substrate
JP2003133217A (en) * 2001-10-26 2003-05-09 Tokyo Electron Ltd Substrate processing apparatus
JP4349606B2 (en) 2002-03-25 2009-10-21 大日本スクリーン製造株式会社 Substrate cleaning method
JP4187540B2 (en) 2003-01-31 2008-11-26 大日本スクリーン製造株式会社 Substrate processing method
JP2004273799A (en) * 2003-03-10 2004-09-30 Dainippon Screen Mfg Co Ltd Rinsing liquid for substrate, and substrate treatment method and equipment
TWI251857B (en) 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
JP4464850B2 (en) 2004-03-09 2010-05-19 株式会社ルネサステクノロジ Substrate cleaning two-fluid nozzle and substrate cleaning device
JP2006187707A (en) 2005-01-05 2006-07-20 Hitachi Chem Co Ltd Two-fluid nozzle for cleaning and cleaning method and apparatus
JP2006223995A (en) * 2005-02-17 2006-08-31 Sony Corp Washing method and washing device
JP2006286665A (en) * 2005-03-31 2006-10-19 Toshiba Corp Method and apparatus for cleaning electronic device
JP2006286947A (en) * 2005-03-31 2006-10-19 Toshiba Corp Method and apparatus for cleaning electronic device
TW200703482A (en) * 2005-03-31 2007-01-16 Toshiba Kk Method and apparatus for cleaning electronic device
JP4989370B2 (en) * 2006-10-13 2012-08-01 大日本スクリーン製造株式会社 Nozzle and substrate processing apparatus having the same
JP2008153322A (en) 2006-12-15 2008-07-03 Dainippon Screen Mfg Co Ltd Two-fluid nozzle, substrate processor, and method for processing substrates
JP4442911B2 (en) 2007-03-19 2010-03-31 大日本スクリーン製造株式会社 Substrate processing equipment
WO2008152716A1 (en) 2007-06-14 2008-12-18 Aqua Science Corporation Method of washing object and object washing system
JP5642574B2 (en) 2011-01-25 2014-12-17 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP5712061B2 (en) 2011-06-16 2015-05-07 株式会社荏原製作所 Substrate processing method and substrate processing unit
JP5866227B2 (en) 2012-02-23 2016-02-17 株式会社荏原製作所 Substrate cleaning method
JP2013214737A (en) * 2012-03-09 2013-10-17 Ebara Corp Substrate processing method and substrate processing apparatus
JP6483348B2 (en) 2014-03-28 2019-03-13 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6600470B2 (en) 2014-04-01 2019-10-30 株式会社荏原製作所 Cleaning device and cleaning method

Also Published As

Publication number Publication date
US20170323809A1 (en) 2017-11-09
TWI772294B (en) 2022-08-01
TW201739529A (en) 2017-11-16
KR102338647B1 (en) 2021-12-13
SG10202003568XA (en) 2020-05-28
KR20170126399A (en) 2017-11-17
CN107393846A (en) 2017-11-24
CN107393846B (en) 2024-04-09
US10991602B2 (en) 2021-04-27

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