SG10201702521WA - Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus - Google Patents
Resin sealing apparatus and method of detecting abnormality of resin sealing apparatusInfo
- Publication number
- SG10201702521WA SG10201702521WA SG10201702521WA SG10201702521WA SG10201702521WA SG 10201702521W A SG10201702521W A SG 10201702521WA SG 10201702521W A SG10201702521W A SG 10201702521WA SG 10201702521W A SG10201702521W A SG 10201702521WA SG 10201702521W A SG10201702521W A SG 10201702521WA
- Authority
- SG
- Singapore
- Prior art keywords
- resin sealing
- sealing apparatus
- detecting abnormality
- resin
- abnormality
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016069507A JP6079925B1 (en) | 2016-03-30 | 2016-03-30 | Resin sealing device and abnormality detection method of resin sealing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201702521WA true SG10201702521WA (en) | 2017-10-30 |
Family
ID=58043235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201702521WA SG10201702521WA (en) | 2016-03-30 | 2017-03-28 | Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6079925B1 (en) |
CN (1) | CN107263827B (en) |
MY (1) | MY184538A (en) |
SG (1) | SG10201702521WA (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6831311B2 (en) | 2017-09-15 | 2021-02-17 | 株式会社神戸製鋼所 | Gas supply device and how to start operation of the gas supply device |
JP6541746B2 (en) * | 2017-10-30 | 2019-07-10 | Towa株式会社 | Resin molding apparatus and method of manufacturing resin molded article |
JP7432925B2 (en) * | 2020-12-04 | 2024-02-19 | アピックヤマダ株式会社 | Pressure monitoring device, resin sealing device, and pressure monitoring method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62212112A (en) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | Apparatus for lead frame loading to molding die assembly in encapsulation of electronic component |
JPH0754831Y2 (en) * | 1990-11-15 | 1995-12-18 | 株式会社アーレスティ | Pin type load sensor for pressure molding machine |
JPH0760806A (en) * | 1993-08-30 | 1995-03-07 | Sony Corp | Molding die |
JP2684168B2 (en) * | 1995-10-30 | 1997-12-03 | トーワ株式会社 | Mold release resistance measuring method and measuring apparatus |
JP2003142510A (en) * | 2001-11-02 | 2003-05-16 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
JP4094515B2 (en) * | 2003-09-26 | 2008-06-04 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
TWI357922B (en) * | 2007-12-24 | 2012-02-11 | Eternal Chemical Co Ltd | Coating compositions and curing method thereof |
JP5539814B2 (en) * | 2010-08-30 | 2014-07-02 | Towa株式会社 | Method and apparatus for manufacturing resin-sealed molded article having substrate exposed surface |
JP5229292B2 (en) * | 2010-10-01 | 2013-07-03 | 第一精工株式会社 | Resin sealing device and resin sealing method |
JP2013256002A (en) * | 2012-06-11 | 2013-12-26 | Yazaki Corp | Insert molding apparatus, and insert molding method |
US9269597B2 (en) * | 2013-01-23 | 2016-02-23 | Microchip Technology Incorporated | Open cavity plastic package |
NL2010252C2 (en) * | 2013-02-06 | 2014-08-07 | Boschman Tech Bv | Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. |
JP5777660B2 (en) * | 2013-05-17 | 2015-09-09 | アサヒ・エンジニアリング株式会社 | Resin molding apparatus and semiconductor device manufacturing method |
KR20160093539A (en) * | 2013-12-04 | 2016-08-08 | 신에츠 엔지니어링 가부시키가이샤 | Method for manufacturing bonded device |
JP6087859B2 (en) * | 2014-03-27 | 2017-03-01 | Towa株式会社 | Resin molding apparatus and resin molding method |
-
2016
- 2016-03-30 JP JP2016069507A patent/JP6079925B1/en active Active
-
2017
- 2017-03-28 SG SG10201702521WA patent/SG10201702521WA/en unknown
- 2017-03-28 MY MYPI2017701079A patent/MY184538A/en unknown
- 2017-03-29 CN CN201710194515.3A patent/CN107263827B/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017177595A (en) | 2017-10-05 |
JP6079925B1 (en) | 2017-02-15 |
CN107263827A (en) | 2017-10-20 |
CN107263827B (en) | 2020-05-19 |
MY184538A (en) | 2021-04-01 |
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