SG10201702085RA - Resin composition for cleaning die - Google Patents
Resin composition for cleaning dieInfo
- Publication number
- SG10201702085RA SG10201702085RA SG10201702085RA SG10201702085RA SG10201702085RA SG 10201702085R A SG10201702085R A SG 10201702085RA SG 10201702085R A SG10201702085R A SG 10201702085RA SG 10201702085R A SG10201702085R A SG 10201702085RA SG 10201702085R A SG10201702085R A SG 10201702085RA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- cleaning die
- die
- cleaning
- resin
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016055785A JP6715627B2 (ja) | 2016-03-18 | 2016-03-18 | 金型清掃用樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201702085RA true SG10201702085RA (en) | 2017-10-30 |
Family
ID=59973682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201702085RA SG10201702085RA (en) | 2016-03-18 | 2017-03-15 | Resin composition for cleaning die |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6715627B2 (ja) |
KR (1) | KR102291077B1 (ja) |
CN (1) | CN107418141B (ja) |
SG (1) | SG10201702085RA (ja) |
TW (1) | TWI725136B (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0742409B2 (ja) * | 1987-11-27 | 1995-05-10 | 株式会社東芝 | 金型清掃体及び金型清掃方法 |
JP3781445B2 (ja) * | 1994-08-24 | 2006-05-31 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物 |
JP3783042B2 (ja) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物 |
JP3270315B2 (ja) * | 1995-10-31 | 2002-04-02 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物タブレット |
TW320600B (ja) * | 1995-10-24 | 1997-11-21 | Nippon Denseki Kogyo Kk | |
TWI223657B (en) * | 2000-10-18 | 2004-11-11 | Chang Chun Plastics Co Ltd | Amino resin composition for the cleaning of the mold |
TWI499668B (zh) * | 2009-07-17 | 2015-09-11 | Nitto Denko Corp | 模具清潔組合物及模具清潔材料、與使用其之模具清潔方法 |
JP5604822B2 (ja) * | 2009-07-17 | 2014-10-15 | 日立化成株式会社 | 半導体装置成形用金型洗浄剤組成物および半導体装置成形用金型洗浄材、ならびにそれを用いた半導体装置成形用金型のクリーニング方法 |
KR101934065B1 (ko) * | 2011-07-15 | 2019-01-02 | 닛뽕 카바이도 고교 가부시키가이샤 | 금형 청소용 수지 조성물 |
CN104985903B (zh) * | 2015-07-31 | 2017-01-25 | 北京新福润达绝缘材料有限责任公司 | 一种高耐漏电起痕无卤阻燃玻璃布层压板的制备方法 |
JP7042409B2 (ja) * | 2018-03-27 | 2022-03-28 | 株式会社サム技研 | 選択丁合システム |
-
2016
- 2016-03-18 JP JP2016055785A patent/JP6715627B2/ja active Active
-
2017
- 2017-03-14 KR KR1020170031915A patent/KR102291077B1/ko active IP Right Grant
- 2017-03-15 SG SG10201702085RA patent/SG10201702085RA/en unknown
- 2017-03-16 CN CN201710156947.5A patent/CN107418141B/zh active Active
- 2017-03-16 TW TW106108630A patent/TWI725136B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6715627B2 (ja) | 2020-07-01 |
TWI725136B (zh) | 2021-04-21 |
CN107418141B (zh) | 2021-06-15 |
TW201800203A (zh) | 2018-01-01 |
KR102291077B1 (ko) | 2021-08-18 |
KR20170108855A (ko) | 2017-09-27 |
CN107418141A (zh) | 2017-12-01 |
JP2017170632A (ja) | 2017-09-28 |
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