SG10201606515VA - Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating - Google Patents

Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating

Info

Publication number
SG10201606515VA
SG10201606515VA SG10201606515VA SG10201606515VA SG10201606515VA SG 10201606515V A SG10201606515V A SG 10201606515VA SG 10201606515V A SG10201606515V A SG 10201606515VA SG 10201606515V A SG10201606515V A SG 10201606515VA SG 10201606515V A SG10201606515V A SG 10201606515VA
Authority
SG
Singapore
Prior art keywords
electronic components
contact surfaces
bonding wire
insulating coating
electrically insulating
Prior art date
Application number
SG10201606515VA
Inventor
Wei Tok Chee
Su Dan
Sarangapani Murali
Original Assignee
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Materials Singapore Pte Ltd
Priority to SG10201606515VA priority Critical patent/SG10201606515VA/en
Priority to PCT/SG2017/000007 priority patent/WO2018026321A1/en
Publication of SG10201606515VA publication Critical patent/SG10201606515VA/en

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Classifications

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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    • H01L2224/852—Applying energy for connecting
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
SG10201606515VA 2016-08-05 2016-08-05 Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating SG10201606515VA (en)

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SG10201606515VA SG10201606515VA (en) 2016-08-05 2016-08-05 Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating
PCT/SG2017/000007 WO2018026321A1 (en) 2016-08-05 2017-07-07 Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating

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US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JPH09214118A (en) * 1996-02-01 1997-08-15 Tokai Rika Co Ltd Forming method of bump and wire bonding equipment having bump forming capability
US20070262119A1 (en) 2006-05-09 2007-11-15 Malliah Ramkumar Wire bonding process for insulated wires
SG137756A1 (en) * 2006-05-09 2007-12-28 Asm Tech Singapore Pte Ltd Wire bonding process for insulated wires
US9613877B2 (en) * 2013-10-10 2017-04-04 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods for forming semiconductor package

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