SG10201601912YA - Systems for removing and replacing consumable parts from a semiconductor process module in situ - Google Patents
Systems for removing and replacing consumable parts from a semiconductor process module in situInfo
- Publication number
- SG10201601912YA SG10201601912YA SG10201601912YA SG10201601912YA SG10201601912YA SG 10201601912Y A SG10201601912Y A SG 10201601912YA SG 10201601912Y A SG10201601912Y A SG 10201601912YA SG 10201601912Y A SG10201601912Y A SG 10201601912YA SG 10201601912Y A SG10201601912Y A SG 10201601912YA
- Authority
- SG
- Singapore
- Prior art keywords
- situ
- systems
- process module
- semiconductor process
- consumable parts
- Prior art date
Links
- 238000011065 in-situ storage Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32212—If parameter out of tolerance reject product
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50291—Multi-tool, several tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/920,090 US20170115657A1 (en) | 2015-10-22 | 2015-10-22 | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201601912YA true SG10201601912YA (en) | 2017-05-30 |
Family
ID=58561558
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201601912YA SG10201601912YA (en) | 2015-10-22 | 2016-03-11 | Systems for removing and replacing consumable parts from a semiconductor process module in situ |
SG10202003587PA SG10202003587PA (en) | 2015-10-22 | 2016-03-11 | Systems for removing and replacing consumable parts from a semiconductor process module in situ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202003587PA SG10202003587PA (en) | 2015-10-22 | 2016-03-11 | Systems for removing and replacing consumable parts from a semiconductor process module in situ |
Country Status (6)
Country | Link |
---|---|
US (2) | US20170115657A1 (en) |
JP (2) | JP2017085072A (en) |
KR (2) | KR20170047149A (en) |
CN (2) | CN106611727A (en) |
SG (2) | SG10201601912YA (en) |
TW (1) | TWI784924B (en) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
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US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10685862B2 (en) | 2016-01-22 | 2020-06-16 | Applied Materials, Inc. | Controlling the RF amplitude of an edge ring of a capacitively coupled plasma process device |
CN108369922B (en) | 2016-01-26 | 2023-03-21 | 应用材料公司 | Wafer edge ring lifting solution |
US10204795B2 (en) | 2016-02-04 | 2019-02-12 | Applied Materials, Inc. | Flow distribution plate for surface fluorine reduction |
US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US10553404B2 (en) | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US10763081B2 (en) | 2017-07-10 | 2020-09-01 | Applied Materials, Inc. | Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device |
CN110506326B (en) * | 2017-07-24 | 2024-03-19 | 朗姆研究公司 | Removable edge ring design |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US10763150B2 (en) | 2017-09-20 | 2020-09-01 | Applied Materials, Inc. | System for coupling a voltage to spatially segmented portions of the wafer with variable voltage |
US10904996B2 (en) | 2017-09-20 | 2021-01-26 | Applied Materials, Inc. | Substrate support with electrically floating power supply |
US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US10811296B2 (en) | 2017-09-20 | 2020-10-20 | Applied Materials, Inc. | Substrate support with dual embedded electrodes |
US10714372B2 (en) | 2017-09-20 | 2020-07-14 | Applied Materials, Inc. | System for coupling a voltage to portions of a substrate |
US11075105B2 (en) | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
KR102182298B1 (en) * | 2017-11-21 | 2020-11-25 | 램 리써치 코포레이션 | Bottom and middle edge rings |
US11043400B2 (en) | 2017-12-21 | 2021-06-22 | Applied Materials, Inc. | Movable and removable process kit |
US10727075B2 (en) | 2017-12-22 | 2020-07-28 | Applied Materials, Inc. | Uniform EUV photoresist patterning utilizing pulsed plasma process |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US10600623B2 (en) | 2018-05-28 | 2020-03-24 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
US10347500B1 (en) | 2018-06-04 | 2019-07-09 | Applied Materials, Inc. | Device fabrication via pulsed plasma |
US11935773B2 (en) | 2018-06-14 | 2024-03-19 | Applied Materials, Inc. | Calibration jig and calibration method |
CN111312633A (en) * | 2018-07-27 | 2020-06-19 | 上海华力集成电路制造有限公司 | Silicon etching machine and operation method thereof |
CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
JP7126466B2 (en) * | 2018-12-12 | 2022-08-26 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING SYSTEM, TRANSFER METHOD, AND TRANSFER PROGRAM |
CN113169026B (en) | 2019-01-22 | 2024-04-26 | 应用材料公司 | Feedback loop for controlling pulse voltage waveform |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US10784089B2 (en) | 2019-02-01 | 2020-09-22 | Applied Materials, Inc. | Temperature and bias control of edge ring |
US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
US11101115B2 (en) | 2019-04-19 | 2021-08-24 | Applied Materials, Inc. | Ring removal from processing chamber |
US11515127B2 (en) | 2019-05-14 | 2022-11-29 | Beijing E-Town Semiconductor Technology Co., Ltd | End effectors for moving workpieces and replaceable parts within a system for processing workpieces under vacuum |
US10964584B2 (en) * | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
KR20210002175A (en) | 2019-06-26 | 2021-01-07 | 삼성전자주식회사 | Sensor module and etching apparatus having the same |
US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
US11823937B2 (en) * | 2019-08-19 | 2023-11-21 | Applied Materials, Inc. | Calibration of an aligner station of a processing system |
US11469123B2 (en) * | 2019-08-19 | 2022-10-11 | Applied Materials, Inc. | Mapping of a replacement parts storage container |
JP7412124B2 (en) * | 2019-10-18 | 2024-01-12 | 東京エレクトロン株式会社 | How to replace the substrate processing system and edge ring |
US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
JP7471106B2 (en) | 2020-02-28 | 2024-04-19 | 東京エレクトロン株式会社 | Parts transport device |
JP7378318B2 (en) | 2020-02-28 | 2023-11-13 | 東京エレクトロン株式会社 | How to replace parts |
US11766782B2 (en) | 2020-03-17 | 2023-09-26 | Applied Materials, Inc. | Calibration of an electronics processing system |
JP7419154B2 (en) * | 2020-05-01 | 2024-01-22 | 東京エレクトロン株式会社 | Parts replacement system and equipment |
CN113644005A (en) * | 2020-05-11 | 2021-11-12 | 中微半导体设备(上海)股份有限公司 | Semiconductor processing system |
USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
USD954769S1 (en) | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
US20220020615A1 (en) * | 2020-07-19 | 2022-01-20 | Applied Materials, Inc. | Multiple process semiconductor processing system |
US11848176B2 (en) | 2020-07-31 | 2023-12-19 | Applied Materials, Inc. | Plasma processing using pulsed-voltage and radio-frequency power |
KR102523365B1 (en) * | 2020-09-23 | 2023-04-21 | 세메스 주식회사 | Apparatus for treating substrate |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
CN114530361A (en) * | 2020-11-23 | 2022-05-24 | 中微半导体设备(上海)股份有限公司 | Lower electrode assembly, plasma processing apparatus and method of replacing focus ring |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11755001B2 (en) * | 2021-05-18 | 2023-09-12 | Ford Global Technologies, Llc | Modular systems for industrial machinery |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
JP2022185689A (en) * | 2021-06-03 | 2022-12-15 | 東京エレクトロン株式会社 | Component replacement method, component replacement device, and component replacement system |
US11984306B2 (en) | 2021-06-09 | 2024-05-14 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
KR102615218B1 (en) | 2021-11-01 | 2023-12-15 | 세메스 주식회사 | Replacing consumables apparatus, substrate processing system and method for replacing consumables |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
KR20240014258A (en) | 2022-07-25 | 2024-02-01 | 엘지전자 주식회사 | Etching apparatus |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4930634A (en) | 1987-09-29 | 1990-06-05 | Fluoroware, Inc. | Carrier for flat panel displays |
US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
JPH04346247A (en) | 1991-05-23 | 1992-12-02 | Fujitsu Ltd | Semiconductor manufacturing apparatus, wafer transfer arm and wafer mounting stand |
JP3909608B2 (en) * | 1994-09-30 | 2007-04-25 | 株式会社アルバック | Vacuum processing equipment |
US6776289B1 (en) | 1996-07-12 | 2004-08-17 | Entegris, Inc. | Wafer container with minimal contact |
US5788082A (en) | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US6010008A (en) | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6267245B1 (en) | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
US6092981A (en) | 1999-03-11 | 2000-07-25 | Applied Materials, Inc. | Modular substrate cassette |
JP2001179672A (en) | 1999-12-21 | 2001-07-03 | Mitsubishi Electric Corp | Robot hand |
JP4389424B2 (en) * | 2001-12-25 | 2009-12-24 | 東京エレクトロン株式会社 | To-be-processed object conveyance mechanism and processing system |
US7121414B2 (en) | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
JP2004288727A (en) * | 2003-03-19 | 2004-10-14 | Seiko Epson Corp | Cmp device, cmp polishing method, semiconductor device, and its manufacturing method |
US7682455B2 (en) * | 2003-07-11 | 2010-03-23 | Tec-Sem Ag | Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
US20050205209A1 (en) * | 2004-03-18 | 2005-09-22 | Aelan Mosden | Replacing chamber components in a vacuum environment |
JP2006120799A (en) * | 2004-10-20 | 2006-05-11 | Tokyo Electron Ltd | Substrate processing apparatus, substrate placement stage replacing method, and program |
TWI310974B (en) | 2005-07-15 | 2009-06-11 | Fabworx Solutions Inc | An end effecter |
JP4884801B2 (en) | 2005-10-06 | 2012-02-29 | 東京エレクトロン株式会社 | Processing system |
JP2007186757A (en) | 2006-01-13 | 2007-07-26 | Tokyo Electron Ltd | Vacuum treatment apparatus and vacuum treatment method |
US7717481B2 (en) | 2007-01-11 | 2010-05-18 | Applied Materials, Inc. | High temperature robot end effector |
KR20100031681A (en) * | 2007-05-18 | 2010-03-24 | 브룩스 오토메이션 인코퍼레이티드 | Compact substrate transport system with fast swap robot |
US9002514B2 (en) * | 2007-11-30 | 2015-04-07 | Novellus Systems, Inc. | Wafer position correction with a dual, side-by-side wafer transfer robot |
TWI562940B (en) | 2008-01-13 | 2016-12-21 | Entegris Inc | Wafer container and method of manufacture |
US8185242B2 (en) | 2008-05-07 | 2012-05-22 | Lam Research Corporation | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
JP4921429B2 (en) | 2008-07-03 | 2012-04-25 | 信越ポリマー株式会社 | Substrate storage container |
US8652260B2 (en) * | 2008-08-08 | 2014-02-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for holding semiconductor wafers |
JP2010123733A (en) * | 2008-11-19 | 2010-06-03 | Tokyo Electron Ltd | Substrate processing apparatus and processing method thereof, and storage medium |
JP2010153585A (en) * | 2008-12-25 | 2010-07-08 | Ebara Corp | Tool and method for holding substrate |
TWI346638B (en) | 2008-12-26 | 2011-08-11 | Gudeng Prec Industral Co Ltd | A purging valve and a wafer container having the purging valve |
JP5208800B2 (en) * | 2009-02-17 | 2013-06-12 | 東京エレクトロン株式会社 | Substrate processing system and substrate transfer method |
US8409995B2 (en) | 2009-08-07 | 2013-04-02 | Tokyo Electron Limited | Substrate processing apparatus, positioning method and focus ring installation method |
JP5650935B2 (en) * | 2009-08-07 | 2015-01-07 | 東京エレクトロン株式会社 | Substrate processing apparatus, positioning method, and focus ring arrangement method |
JP5363277B2 (en) | 2009-11-11 | 2013-12-11 | 信越ポリマー株式会社 | Substrate storage container and support member |
JP5575507B2 (en) * | 2010-03-02 | 2014-08-20 | 株式会社日立国際電気 | Substrate processing apparatus, substrate transport method, semiconductor device manufacturing method, and substrate processing apparatus maintenance method |
JP5548163B2 (en) | 2010-09-14 | 2014-07-16 | 株式会社日立国際電気 | Substrate transport mechanism, substrate processing apparatus, and semiconductor device manufacturing method |
US8840754B2 (en) * | 2010-09-17 | 2014-09-23 | Lam Research Corporation | Polar regions for electrostatic de-chucking with lift pins |
US20170236737A1 (en) | 2010-10-20 | 2017-08-17 | Entegris, Inc. | Wafer container with door guide and seal |
JP6003011B2 (en) * | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | Substrate processing equipment |
WO2013072760A2 (en) * | 2011-10-26 | 2013-05-23 | Brooks Automation, Inc. | Semiconductor wafer handling and transport |
SG11201406893XA (en) * | 2012-04-26 | 2014-11-27 | Intevac Inc | System architecture for vacuum processing |
TWI494174B (en) * | 2012-05-16 | 2015-08-01 | Kern Energy Entpr Co Ltd | Equipment for surface treatment of substrate |
TWI674168B (en) | 2015-07-27 | 2019-10-11 | 美商應用材料股份有限公司 | Lift pin actuator,substrate support assembly, and method for utilizing substrate support assembly |
US9881820B2 (en) | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US10124492B2 (en) | 2015-10-22 | 2018-11-13 | Lam Research Corporation | Automated replacement of consumable parts using end effectors interfacing with plasma processing system |
-
2015
- 2015-10-22 US US14/920,090 patent/US20170115657A1/en not_active Abandoned
-
2016
- 2016-03-11 TW TW105107511A patent/TWI784924B/en active
- 2016-03-11 KR KR1020160029812A patent/KR20170047149A/en active Application Filing
- 2016-03-11 SG SG10201601912YA patent/SG10201601912YA/en unknown
- 2016-03-11 SG SG10202003587PA patent/SG10202003587PA/en unknown
- 2016-03-18 JP JP2016054583A patent/JP2017085072A/en active Pending
- 2016-03-31 CN CN201610196076.5A patent/CN106611727A/en active Pending
- 2016-03-31 CN CN201910911341.7A patent/CN110828337A/en active Pending
-
2017
- 2017-08-02 US US15/666,866 patent/US11112773B2/en active Active
-
2021
- 2021-02-15 JP JP2021021594A patent/JP2021077916A/en active Pending
-
2023
- 2023-09-04 KR KR1020230117142A patent/KR20230130597A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
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CN106611727A (en) | 2017-05-03 |
US11112773B2 (en) | 2021-09-07 |
KR20170047149A (en) | 2017-05-04 |
JP2021077916A (en) | 2021-05-20 |
JP2017085072A (en) | 2017-05-18 |
SG10202003587PA (en) | 2020-05-28 |
US20180032062A1 (en) | 2018-02-01 |
US20170115657A1 (en) | 2017-04-27 |
TWI784924B (en) | 2022-12-01 |
TW201715565A (en) | 2017-05-01 |
CN110828337A (en) | 2020-02-21 |
KR20230130597A (en) | 2023-09-12 |
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