SG10201601518UA - Method of determining a target mesa configuration of an electrostatic chuck - Google Patents

Method of determining a target mesa configuration of an electrostatic chuck

Info

Publication number
SG10201601518UA
SG10201601518UA SG10201601518UA SG10201601518UA SG10201601518UA SG 10201601518U A SG10201601518U A SG 10201601518UA SG 10201601518U A SG10201601518U A SG 10201601518UA SG 10201601518U A SG10201601518U A SG 10201601518UA SG 10201601518U A SG10201601518U A SG 10201601518UA
Authority
SG
Singapore
Prior art keywords
determining
electrostatic chuck
mesa configuration
target mesa
target
Prior art date
Application number
SG10201601518UA
Inventor
Robert Steger
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201601518UA publication Critical patent/SG10201601518UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
SG10201601518UA 2005-11-30 2006-11-01 Method of determining a target mesa configuration of an electrostatic chuck SG10201601518UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/289,313 US7869184B2 (en) 2005-11-30 2005-11-30 Method of determining a target mesa configuration of an electrostatic chuck

Publications (1)

Publication Number Publication Date
SG10201601518UA true SG10201601518UA (en) 2016-04-28

Family

ID=38092690

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601518UA SG10201601518UA (en) 2005-11-30 2006-11-01 Method of determining a target mesa configuration of an electrostatic chuck

Country Status (8)

Country Link
US (2) US7869184B2 (en)
JP (2) JP5121720B2 (en)
KR (2) KR101413816B1 (en)
CN (2) CN103531518A (en)
MY (1) MY148834A (en)
SG (1) SG10201601518UA (en)
TW (1) TWI412097B (en)
WO (1) WO2007064435A2 (en)

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CN103165381B (en) * 2011-12-15 2016-08-24 中微半导体设备(上海)有限公司 A kind of electrostatic chuck controlling loaded substrate temperature and plasma processing apparatus
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US10281518B2 (en) 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
US10832931B2 (en) 2014-05-30 2020-11-10 Applied Materials, Inc. Electrostatic chuck with embossed top plate and cooling channels
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
US9738975B2 (en) 2015-05-12 2017-08-22 Lam Research Corporation Substrate pedestal module including backside gas delivery tube and method of making
US10177024B2 (en) 2015-05-12 2019-01-08 Lam Research Corporation High temperature substrate pedestal module and components thereof
US10256075B2 (en) * 2016-01-22 2019-04-09 Applied Materials, Inc. Gas splitting by time average injection into different zones by fast gas valves
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10832936B2 (en) 2016-07-27 2020-11-10 Lam Research Corporation Substrate support with increasing areal density and corresponding method of fabricating
JP6642392B2 (en) * 2016-11-24 2020-02-05 株式会社デンソー Surface roughness measuring method and surface roughness measuring device
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
TWI669514B (en) * 2017-02-23 2019-08-21 葉秀慧 Mechanism for testing semiconductor products using electrostatic carriers
CN111157895B (en) * 2020-02-10 2022-02-25 哈尔滨理工大学 High-voltage motor stator winding end surface potential measuring system
CN117242565A (en) * 2021-03-02 2023-12-15 应用材料公司 Apparatus for a fiber optic temperature probe in a process chamber
JP7550695B2 (en) 2021-03-26 2024-09-13 東京エレクトロン株式会社 Stage inspection method

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Also Published As

Publication number Publication date
KR101413816B1 (en) 2014-07-02
CN101512355B (en) 2013-09-18
KR20080076985A (en) 2008-08-20
US7869184B2 (en) 2011-01-11
WO2007064435A3 (en) 2009-04-30
JP2012231157A (en) 2012-11-22
CN101512355A (en) 2009-08-19
JP2009520452A (en) 2009-05-21
KR101337133B1 (en) 2013-12-16
CN103531518A (en) 2014-01-22
US20100159712A1 (en) 2010-06-24
WO2007064435A2 (en) 2007-06-07
JP5121720B2 (en) 2013-01-16
MY148834A (en) 2013-06-14
US20110063772A1 (en) 2011-03-17
TW200731456A (en) 2007-08-16
KR20130087595A (en) 2013-08-06
TWI412097B (en) 2013-10-11

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